IP Library Granted Patent US 9,046,305
Granted Patent B2
US 9,046,305 · App. 13/631,764 · Granted Jun 2, 2015

Phase change type heat dissipating device

Inventor: Rung-An Chen (New Taipei, TW)
Assignee: Foxconn Technology Co., Ltd.
F28D15/02H01L23/4275F28D15/0233F28D15/0275F28D20/02H01L23/427H01L2924/0002Y02E60/145
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Quick Facts
Patent No.
US 9,046,305
App. No.
13/631,764
Granted
Jun 2, 2015
Kind
B2
Abstract

A phase change type heat dissipating device for dissipating heat from a heat generating component includes a casing, a working medium received in the casing and a heat pipe connected to the casing. The heat pipe includes an evaporator section and a condenser section. The working medium is electrically insulated and phase change material, and represents solid state at normal temperature. The heat generating component is received in the casing, and the evaporator section of the heat pipe extends into the casing and contacts the working medium.

Claims (9)

1. A phase change type heat dissipating device for removing heat from a heat generating component, the phase change type heat dissipating device comprising:

a casing enclosing the heat generating component, the casing comprises a top cover and a bottom plate opposite to the top cover, a plurality of sidewalls extend upward from a periphery of the bottom plate, and a periphery of a bottom surface of the top cover is attached to top ends of the sidewalls to form a cavity, the heat generating component is located at the bottom plate;

a working medium received in the casing, the working medium being disposed between the top cover and the bottom plate, the working medium covers the heat generating component, the working medium being electrically insulated and a phase change material, and representing solid state of the phase change material at a temperature of the heat generating component under standby/low-loading; and

a heat pipe connected to the casing, the heat pipe comprising an evaporator section inserting in the casing and contacting the working medium, and a condenser section extending out of the casing.

2. The phase change type heat dissipating device of claim 1 , wherein the working medium is made from hydrate, organic acid or esters.

3. The phase change type heat dissipating device of claim 1 , wherein the heat generating component electrically connects to external power source via printed circuit board or wire out of the casing.

4. The phase change type heat dissipating device of claim 1 , wherein the top cover and the bottom plate are made from copper or aluminum.

5. The phase change type heat dissipating device of claim 1 , wherein the evaporator section of the heat pipe is spaced from the heat generating component.

6. The phase change type heat dissipating device of claim 1 , wherein a melting point of the working medium is between the temperature of the heat generating component under standby/low-loading and the temperature of the heat generating component under high loading.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 28, 2012
From: CHEN, RUNG-AN
To: FOXCONN TECHNOLOGY CO., LTD.
Reel/Frame 029051/0268 →
Priority Claims (1)
TW 101120756 · Jun 8, 2012 · national
Continuity (1)
Related Publication 20130327502A1 · Dec 12, 2013