Method of fabricating high-density hermetic electrical feedthroughs
A method of fabricating electrical feedthroughs selectively removes substrate material from a first side of an electrically conductive substrate (e.g. a bio-compatible metal) to form an array of electrically conductive posts in a substrate cavity. An electrically insulating material (e.g. a bio-compatible sealing glass) is then flowed to fill the substrate cavity and surround each post, and solidified. The solidified insulating material is then exposed from an opposite second side of the substrate so that each post is electrically isolated from each other as well as the bulk substrate. In this manner a hermetic electrically conductive feedthrough construction is formed having an array of electrical feedthroughs extending between the first and second sides of the substrate from which it was formed.
1. A method of fabricating electrical feedthroughs, comprising:
providing an electrically conductive substrate having opposing first and second sides;
selectively removing substrate material from the first side of the substrate to form an array of electrically conductive posts in a substrate cavity;
filling said substrate cavity with an electrically insulating material to surround each post therewith;
solidifying the electrically insulating material; and
exposing the solidified electrically insulating material from the second side of the substrate so that each post is electrically isolated as an electrical feedthrough extending between the first and second sides of the substrate.
2. The method of claim 1 ,
wherein the electrically conductive substrate is a bio-compatible metal.
3. The method of claim 2 ,
wherein the electrically conductive bio-compatible metal substrate is selected from the group consisting of titanium, platinum, iridium, ruthenium, niobium, palladium, gold, stainless steel, p- or n-type doped silicon, and alloys thereof.
4. The method of claim 1 ,
wherein the electrically insulating material is a bio-compatible material.
5. The method of claim 4 ,
wherein the electrically insulating bio-compatible material is selected from the group consisting of sealing glasses, non-leaded glass, boro-silicate glass, glass-frit powder or paste, and glasses or ceramics containing one or more of B 2 O 3 , CaO, BaO, SiO 2 , La 2 O 3 , Al 2 O 3 , Li 2 O 3 , TiO 2 .
6. The method of claim 1 ,
wherein the electrically insulating material has a thermal expansion coefficient substantially matching that of the substrate.
7. The method of claim 1 ,
wherein the substrate material is selectively removed by using a process selected from a group comprising using a dicing saw, milling, laser cutting, reactive ion etching, ion milling, mechanical dicing, electrical discharge machining, waterjet cutting, laser waterjet cutting, laser cutting, reactive-ion etching, deep reactive ion etching, and ion-milling.
8. A method of fabricating electrical feedthroughs, comprising:
providing an electrically conductive bio-compatible metal substrate having opposing first and second sides;
selectively removing substrate material from the first side of the substrate to form an array of electrically conductive posts in a substrate cavity;
filling said substrate cavity with an electrically insulating bio-compatible material to surround each post therewith;
solidifying the electrically insulating material; and
exposing the solidified electrically insulating material from the second side of the substrate so that each post is electrically isolated as an electrical feedthrough extending between the first and second sides of the substrate.
9. The method of claim 8 ,
wherein the electrically conductive bio-compatible metal substrate is selected from the group consisting of titanium, platinum, iridium, ruthenium, niobium, palladium, gold, stainless steel, p- or n-type doped silicon, and alloys thereof, and
wherein the electrically insulating bio-compatible material is selected from the group consisting of sealing glasses, non-leaded glass, boro-silicate glass, glass-frit powder or paste, and glasses or ceramics containing one or more of B 2 O 3 , CaO, BaO, SiO 2 , La 2 O 3 , Al 2 O 3 , Li 2 O 3 , TiO 2 .
10. The method of claim 8 ,
wherein the electrically insulating material has a thermal expansion coefficient substantially matching that of the substrate.
11. The method of claim 8 ,
wherein the substrate material is selectively removed by using a process selected from a group comprising using a dicing saw, milling, laser cutting, reactive ion etching, ion milling, mechanical dicing, electrical discharge machining, waterjet cutting, laser waterjet cutting, laser cutting, reactive-ion etching, deep reactive ion etching, and ion-milling.
12. A hermetic electrically conductive feedthrough construction, comprising:
an electrically conductive substrate having opposing first and second surfaces, a frame portion, and a post portion comprising an array of posts extending between the first and second surfaces, with each post electrically isolated from the frame portion and each other by an electrically insulating material solidified therebetween, as an array of electrically conductive feedthroughs.
13. The hermetic electrically conductive feedthrough construction of claim 12 ,
wherein the electrically conductive substrate is a bio-compatible metal.
14. The hermetic electrically conductive feedthrough construction of claim 13 ,
wherein the electrically conductive bio-compatible metal substrate is selected from the group consisting of titanium, platinum, iridium, ruthenium, niobium, palladium, gold, stainless steel, p- or n-type doped silicon, and alloys thereof.
15. The hermetic electrically conductive feedthrough construction of claim 12 ,
wherein the electrically insulating material is a bio-compatible material.
16. The hermetic electrically conductive feedthrough construction of claim 15 ,
wherein the electrically insulating bio-compatible material is selected from the group consisting of sealing glasses, non-leaded glass, boro-silicate glass, glass-frit powder or paste, and glasses or ceramics containing one or more of B 2 O 3 , CaO, BaO, SiO 2 , La 2 O 3 , Al 2 O 3 , Li 2 O 3 , TiO 2 .
17. The hermetic electrically conductive feedthrough construction of claim 12 ,
wherein the electrically insulating material has a thermal expansion coefficient substantially matching that of the substrate.