IP Library › Granted Patent US 9,060,144
Granted Patent B2
US 9,060,144 · App. 13/968,764 · Granted Jun 16, 2015

Image sensor and manufacturing method thereof

Inventors: Yi-Sheng Liu (Yilan County, TW); Yun-Wei Cheng (Taipei, TW); Volume Chien (Tainan County, TW); Chi-Cherng Jeng (Tainan County, TW); Hsin-Chi Chen (Tainan, TW)
Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
H04N5/374H01L31/18H01L27/14685
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Quick Facts
Patent No.
US 9,060,144
App. No.
13/968,764
Granted
Jun 16, 2015
Kind
B2
Abstract

An image sensor comprises an image sensing substrate that in turns includes an image sensing device, a first sensor pixel, a second sensor pixel, and a divider. The divider is between the first sensor pixel and the second sensor pixel.

Claims (16)

1. An image sensor, comprising:

an image sensing substrate including:

an image sensing device;

a first sensor pixel and a second sensor pixel adjacent to the first sensor pixel; and

a divider between the first sensor pixel and the second sensor pixel,

a light guiding grid above and vertically aligning with the divider;

wherein the image sensing substrate has a refractive index; the divider has a refractive index; and the substrate's refractive index is greater than the divider's refractive index.

2. The image sensor of claim 1 , further comprising an anti reflection coating (ARC) between the divider and the light guiding grid.

3. The image sensor of claim 1 , wherein the divider includes dielectric material.

4. The image sensor of claim 1 , further comprising a boundary between the first sensor pixel and the second sensor pixel, wherein the divider is symmetrical with reference to the boundary.

5. The image sensor of claim 1 , wherein a light guiding grid being above and vertically aligning with the divider, and the divider having sections separating from one another.

6. The image sensor of claim 1 , wherein the divider aligns with the light guiding grid.

7. The image sensor of claim 1 , wherein a width of the divider is between about one half and about two times of a width of the light guiding grid.

8. The image sensor of claim 1 , wherein a height of the divider is between about one half and about two times of a height of the light guiding grid.

9. The image sensor of claim 1 , wherein a top surface of the divider is below a surface of the image sensing substrate.

10. The image sensor of claim 1 , further comprising an interface between the light guiding grid and the image sensing substrate, wherein the divider is not in contact with the interface.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 16, 2013
From: LIU, YI-SHENG; CHENG, YUN-WEI; CHIEN, VOLUME; JENG, CHI-CHERNG; CHEN, HSIN-CHI
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
Reel/Frame 031026/0070 →
Continuity (1)
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