Heat sink structure with a vapor-permeable membrane for two-phase cooling
A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).
1. A heat sink comprising:
a thermally conductive structure comprising at least one coolant-carrying channel;
a membrane structure associated with the at least one coolant-carrying channel, the membrane structure comprising at least one vapor-permeable region, at least a portion of the at least one vapor-permeable region overlying a portion of the at least one coolant-carrying channel and facilitating removal of vapor from the at least one coolant-carrying channel, and the membrane structure further comprising at least one orifice extending therethrough and coupled to inject coolant onto at least one surface of the at least one coolant-carrying channel intermediate ends of the at least one coolant-carrying channel, the at least one orifice overlying the at least one coolant-carrying channel at a location intermediate the ends of the at least one coolant-carrying channel; and
wherein the membrane structure further comprises at least one vapor-impermeable region, the at least one vapor-impermeable region comprising multiple vapor-impermeable digits, at least one vapor-impermeable digit of the multiple vapor-impermeable digits comprising at least one orifice coupled to inject coolant into the at least one coolant-carrying channel, the multiple vapor-impermeable digits being interdigitated with multiple vapor-permeable areas of the at least one vapor-permeable region.
2. The heat sink of claim 1 , wherein the membrane structure comprises a liquid-impermeable membrane and the at least one coolant-carrying channel comprises at least one coolant-carrying microchannel having a characteristic dimension less than 1.0 mm.
3. The heat sink of claim 1 , wherein the membrane structure further comprises at least one vapor-impermeable region, the at least one vapor-impermeable region comprising the at least one orifice coupled to inject coolant into the at least one coolant-carrying channel.
4. The heat sink of claim 1 , further comprising at least one vapor transport channel in fluid communication with the at least one vapor-permeable region of the membrane structure, the at least one vapor transport channel facilitating exhausting of vapor egressing across the at least one vapor-permeable region of the membrane structure from the at least one coolant-carrying channel.
5. The heat sink of claim 4 , further comprising at least one coolant exhaust channel in fluid communication with the at least one coolant-carrying channel and facilitating exhausting of coolant from the at least one coolant-carrying channel.
6. The heat sink of claim 5 , wherein the at least one vapor transport channel is in fluid communication with the at least one coolant exhaust channel within the heat sink, and wherein the heat sink comprises an outlet port exhausting coolant from the at least one coolant exhaust channel and vapor from the at least one vapor transport channel.
7. A heat sink comprising:
a thermally conductive structure comprising at least one coolant-carrying channel;
a membrane structure associated with the at least one coolant-carrying channel, the membrane structure comprising at least one vapor-permeable region, at least a portion of the at least one vapor-permeable region overlying a portion of the at least one coolant-carrying channel and facilitating removal of vapor from the at least one coolant-carrying channel, and the membrane structure further comprising at least one orifice coupled to inject coolant onto at least one surface of the at least one coolant-carrying channel intermediate ends of the at least one coolant-carrying channel; and
wherein the membrane structure further comprises at least one vapor-impermeable region, the at least one vapor-impermeable region comprising multiple vapor-impermeable digits, each vapor-impermeable digit comprising at least one orifice coupled to inject coolant into the at least one coolant-carrying channel, the multiple vapor-impermeable digits being interdigitated with multiple vapor-permeable areas of the at least one vapor-permeable region.
8. The heat sink of claim 7 , wherein the thermally conductive structure comprises multiple coolant-carrying channels arranged substantially parallel to each other, and wherein the multiple vapor-impermeable digits extend transverse to the multiple coolant-carrying channels, and each vapor-impermeable digit of the membrane comprises multiple orifices, each orifice of the multiple orifices being coupled to inject coolant into a respective coolant-carrying channel of the multiple coolant-carrying channels.
9. The heat sink of claim 1 , wherein coolant within the at least one coolant-carrying channel comprises water, and wherein the membrane structure comprises a hydrophobic membrane.