IP Library › Granted Patent US 9,062,857
Granted Patent B2
US 9,062,857 · App. 13/090,702 · Granted Jun 23, 2015

Light emitting device module

Inventors: Yontae Moon (Seoul, KR); Eunseon Lee (Seoul, KR)
Assignee: LG INNOTEK CO., LTD.
F21V19/0045F21K9/00F21V19/001F21V21/35F21Y2101/02H01L33/486F21K9/17F21Y2111/005H01L2224/48091
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Quick Facts
Patent No.
US 9,062,857
App. No.
13/090,702
Granted
Jun 23, 2015
Kind
B2
Abstract

A light emitting device module is provided comprising a light emitting device package and a printed circuit board to which the light emitting device package is coupled, wherein the light emitting device package includes a sliding groove and a fixing groove, and wherein the printed circuit board includes a sliding protrusion coupled to the sliding groove to guide the light emitting device package to a predetermined position and a fixing protrusion coupled to the fixing groove at the predetermined position.

Claims (36)

1. A tight emitting device module comprising:

a light emitting device package; and

a printed circuit board to which the light emitting device package is coupled, wherein

the light emitting device package includes a sliding groove and a fixing groove, wherein

the printed circuit board includes a sliding protrusion coupled to the sliding groove to guide the light emitting device package to a predetermined position and a fixing protrusion coupled to the fixing groove at the predetermined position,

wherein the light emitting device package includes,

a light emitting device; and

a body including a first lead frame on which the LED is arranged and a second lead frame spaced apart from the first lead frame, wherein at least one of the sliding groove and the fixing groove is formed on at least one surface of the body, and

wherein the sliding groove includes a first sliding groove formed at a first surface of the body and a second sliding groove formed at a second surface of the body, wherein the first surface is parallel to the second surface.

2. The light emitting device module of claim 1 , wherein the first and second lead frames are formed on the first and second side surfaces respectively.

3. The light emitting device module of claim 1 , wherein the first sliding groove is symmetrical to the second sliding groove.

4. The light emitting device module of claim 1 , wherein the fixing groove is formed at a third surface different from the first and second surfaces.

5. The light emitting device module of claim 4 , wherein the fixing groove includes first and second fixing grooves that are symmetrical to each other with respect to a central portion of the third surface.

6. The light emitting device module of claim 5 , wherein the first lead frame is arranged in at least one of the first sliding groove and the first fixing groove, and the second lead frame is arranged in at least one of the second sliding groove and the second fixing groove.

7. The light emitting device module of claim 6 , wherein the sliding protrusion includes a first sliding protrusion guided along the first sliding groove and a second sliding protrusion guided along the second sliding groove.

8. The light emitting device module of claim 7 , wherein the fixing protrusion includes a first fixing protrusion coupled to the first fixing groove and a second fixing protrusion coupled to the second fixing groove.

9. The light emitting device module of claim 8 , wherein the printed circuit board includes first and second patterns electrically connected to the first and second lead frames, respectively, wherein

the first pattern is arranged on at least one of the first sliding protrusion and the first fixing protrusion, and the second pattern is arranged on at least one of the second sliding protrusion and the second fixing protrusion.

10. The light emitting device module of claim 1 , wherein the sliding protrusion has a semicircle shape, a polygonal shape, or a rounded shape having a curvature.

11. The light emitting device module of claim 1 , wherein the fixing protrusion has a semicircle shape.

12. A light emitting device module comprising:

a light emitting device package; and

a printed circuit board to which the light emitting device package is coupled, wherein

the light emitting device package includes a sliding groove and a fixing groove, and wherein

the printed circuit board includes a sliding protrusion coupled to the sliding groove to guide the light emitting device package to a predetermined position and a fixing protrusion coupled to the fixing groove, at the predetermined position, wherein the fixing protrusion has elasticity in a vertical direction.

13. A light emitting device module comprising:

a light emitting device package; and

a printed circuit hoard to which the light emitting device package is coupled, wherein

the light emitting device package includes a sliding groove and a fixing groove, and wherein

the printed circuit board includes a sliding protrusion coupled to the sliding groove to guide the light emitting device package to a predetermined position and a fixing protrusion coupled to the fixing groove at the predetermined position, wherein a gap is formed between the fixing protrusion and the fixing groove.

14. The light emitting device module of claim 12 , wherein the light emitting device package includes,

a light emitting device; and

a body including a first lead frame on which the LED is arranged and a second lead frame spaced apart from the first lead frame, wherein at least one of the sliding groove and the fixing groove is formed at least one surface of the body.

15. The Light emitting device module of claim 13 , wherein the light emitting device package includes,

a light emitting device; and

a body including a first lead frame on which the LED is arranged and a second lead frame spaced apart from the first lead frame, wherein at least one of the sliding groove and the fixing groove is formed at least one surface of the body.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 25, 2021
From: LG INNOTEK CO., LTD.
To: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
Reel/Frame 056366/0335 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 20, 2011
From: MOON, YONTAE; LEE, EUNSEON
To: LG INNOTEK CO., LTD.
Reel/Frame 026157/0552 →
Priority Claims (1)
KR 10-2010-0064488 · Jul 5, 2010 · national
Continuity (1)
Related Publication 20120002427A1 · Jan 5, 2012