IP Library Granted Patent US 9,080,969
Granted Patent B2
US 9,080,969 · App. 14/281,100 · Granted Jul 14, 2015

Backside CMOS compatible BioFET with no plasma induced damage

Inventors: Yi-Shao Liu (Zhubei, TW); Chun-Ren Cheng (Hsin-Chu, TW); Ching-Ray Chen (Taipei, TW); Yi-Hsien Chang (Shetou Township, TW); Fei-Lung Lai (New Taipei, TW); Chun-Wen Cheng (Zhubei, TW)
Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
G01N27/4145G01N27/4148H01L29/66477
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Quick Facts
Patent No.
US 9,080,969
App. No.
14/281,100
Granted
Jul 14, 2015
Kind
B2
Abstract

The present disclosure provides a bio-field effect transistor (BioFET) device and methods of fabricating a BioFET and a BioFET device. The method includes forming a BioFET using one or more process steps compatible with or typical to a complementary metal-oxide-semiconductor (CMOS) process. The BioFET device includes a gate structure disposed on a first surface of a substrate and an interface layer formed on a second surface of the substrate. The substrate is thinned from the second surface to expose a channel region before forming the interface layer.

Claims (40)

1. A device, comprising:

a carrier substrate;

a first BioFET device attached to the carrier substrate, the first BioFET device including:

a gate structure on a first side of a semiconductor substrate;

a source region and a drain region in the semiconductor substrate adjacent to the gate structure;

a channel region interposing the source and drain regions and underlying the gate structure;

a sensing film directly on and covering at least a portion of the channel region on a second side of the semiconductor substrate; and

a microfluidic channel or microfluidic well disposed over the sensing film.

2. The device of claim 1 , further comprising:

an intrinsic dielectric film between the first BioFET device and a microfluidic structure containing the microfluidic channel or microfluidic well and surrounding the at least a portion of the channel region.

3. The device of claim 2 , wherein sidewalls of the intrinsic dielectric film has a straight profile.

4. The device of claim 1 , further comprising a coating for bio-molecule binding over the sensing film.

5. The device of claim 1 , wherein the sensing film is selected from the group consisting SiO 2 , Si 3 N 4 , Al 2 O 3 , TiO 2 , HfO 2 , Ta 2 O 5 , SnO, Sn 0 2 , Ba x Sr 1-31 x TiO3 and combinations thereof.

6. The device of claim 1 , wherein the first BioFET further comprises:

a multi-layer interconnect (MLI) disposed on the first side of the semiconductor substrate.

7. The device of claim 1 , further comprising:

a second BioFET connected to the first BioFET by the microfluidic channel; and

a third BioFET and a fourth BioFET connected to a second microfluidic channel, wherein the first, second, third and fourth BioFETs are disposed in an array configuration.

8. The device of claim 1 , wherein the microfluidic channel or microfluidic well comprises a layer of biocompatible material and wherein the sensing film extends under the layer of biocompatible material.

9. A device, comprising:

a Field Effect Transistor (FET) device on a substrate, wherein the FET device includes a gate structure formed on a first surface of the substrate and a channel region, the channel region having a top surface adjacent the gate structure and a bottom surface opposite the top surface;

an opening extending from a second surface of the substrate, opposite the first surface, through to the bottom surface of the channel region; and

a sensing film directly in the opening, the sensing film being on the bottom surface of the channel region and directly on at least a portion of the second surface of the substrate.

10. The device of claim 9 , further comprising:

a microfluidic chamber on the second surface of the substrate, wherein at least a portion of the sensing film is contained within the micro fluidic chamber.

11. The device of claim 10 , wherein the microfluidic chamber is selected from the group consisting of a microfluidic channel, a microfluidic well, and a combination thereof.

12. The device of claim 9 , further comprising a carrier substrate attached to the first surface of the substrate.

13. The device of claim 9 , further comprising an intrinsic dielectric layer on the second surface of the substrate.

14. The device of claim 13 , wherein the intrinsic dielectric layer forms a trench overlying the sensing film.

15. The device of claim 9 , further comprising a multi-layer interconnect (MLI) disposed on the first surface of the substrate.

16. The device of claim 9 , further comprising a receptor on the sensing film, wherein the receptor is selected from the group consisting of enzymes, antibodies, ligands, peptides, nucleotides, self-assembled molecules, and combinations thereof.

17. The device of claim 9 , further comprising a hydrophilic or hydrophobic coating on the sensing film.

18. A device comprising:

a FET device on a semiconductor substrate, the FET device including a gate structure formed on a first surface of the semiconductor substrate and a channel region in the semiconductor substrate below the gate structure, the channel region having a first surface proximate the gate and second surface distal the gate;

a carrier substrate attached to the first surface of the semiconductor substrate;

an opening extending through the semiconductor substrate and aligned with the second surface of the channel region;

a sensing film in the opening and contacting the second surface of the channel region and a second surface of the semiconductor substrate; and,

a microfluidic chamber over the sensing film.

19. The device of claim 18 , wherein the semiconductor substrate is a silicon-on-insulator (SOI) substrate.

20. The device of claim 18 , wherein the sensing film includes a receptor on the sensing film, wherein the receptor is selected from the group consisting of enzymes, antibodies, ligands, peptides, nucleotides, self-assembled molecules, and combinations thereof.

Continuity (2)
Division 13706002 · Dec 5, 2012
Related Publication 20140252421A1 · Sep 11, 2014