Substrate collecting method
Even in case that a wafer is so greatly deviated that a peripheral portion of the wafer cannot be detected, position determination of the wafer can be performed without inflicting a damage on the wafer. The wafer peripheral portion, which is a target, is detected based on output images from a plurality of imaging units disposed along a peripheral portion shape of the wafer (step S210), and a wafer position deviation correcting step (step S220) or a rough correcting step (step 230) is performed according to the number of the imaging units capable of detecting the wafer peripheral portion. In case that the wafer peripheral portion cannot be detected by all the imaging units, a wafer position adjusting step (step 240) for moving the wafer is performed in a position adjusting direction acquired by a combination of the output images by each imaging unit.
1. A substrate collecting method for withdrawing a substrate by a transfer arm, the method comprising:
a substrate peripheral portion detecting step for detecting a peripheral portion of the substrate, which is a target to be withdrawn, based on output images from a plurality of imaging units disposed along a peripheral portion shape of the substrate;
a substrate position deviation correcting step for, when the peripheral portion of the substrate can be detected by at least one imaging unit, acquiring a positional deviation from a preset reference position based on a horizontal position of the substrate obtained from a shape of the detected peripheral portion, and correcting the positional deviation by moving the substrate in a horizontal direction if the deviation exceeds a withdrawable range; and
a substrate collecting step for withdrawing the substrate by the transfer arm when the deviation does not exceed the withdrawable range, or when the deviation is reduced not to exceed the withdrawable range through the substrate position deviation correcting step.
2. The substrate collecting method of claim 1 , further comprising:
a substrate position adjusting step for, when the peripheral portion of the substrate cannot be detected by any imaging unit, obtaining a position adjusting direction of the substrate according to a combination of presence/absence states of the substrate detected based on the output image from each imaging unit, and performing an adjustment of a substrate position by moving the substrate along the position adjusting direction.
3. The substrate collecting method of claim 2 , wherein, when the peripheral portion of the substrate becomes detectable by at least one imaging unit through the substrate position adjusting step, the positional deviation from the preset reference position is acquired based on the horizontal position of the substrate obtained from the shape of the detected peripheral portion, and, if the positional deviation exceeds the withdrawable range, the positional deviation is corrected by moving the substrate along a horizontal direction; and, if the positional deviation does not exceed the withdrawable range or if the position deviation is reduced not to exceed the withdrawable range through the substrate position deviation correcting step, the substrate is withdrawn by the transfer arm.