Memory device and method for manufacturing the same
A memory device that is as small in area as possible and has an extremely long data retention period. A transistor with extremely low leakage current is used as a cell transistor of a memory element in a memory device. Moreover, in order to reduce the area of a memory cell, the transistor is formed so that its source and drain are stacked in the vertical direction in a region where a bit line and a word line intersect each other. Further, a capacitor is stacked above the transistor.
1. A memory device comprising:
an insulating surface;
a transistor over the insulating surface, the transistor comprising a bit line, a semiconductor layer, a gate insulating layer, and a word line, the gate insulating layer being interposed between a side face of the semiconductor layer and the word line; and
a capacitor overlapping the transistor, the capacitor comprising an insulating layer interposed between a capacitor electrode and a capacitor line, the capacitor electrode being in electrical contact with the semiconductor layer,
wherein a top surface of the semiconductor layer, a top surface of the gate insulating layer, and a top surface of the word line are in a same horizontal plane,
wherein the bit line, the semiconductor layer, the capacitor electrode, the insulating layer, and the capacitor line are stacked in this order, and
wherein the semiconductor layer comprises a semiconductor material having a wider band gap than silicon.
2. The memory device according to claim 1 ,
wherein the semiconductor layer comprises a material having a band gap greater than or equal to 2.5 eV and less than or equal to 4 eV.
3. The memory device according to claim 1 ,
wherein the semiconductor layer has been formed by deposition of a thin film semiconductor material.
4. The memory device according to claim 1 ,
wherein the semiconductor layer comprises an oxide semiconductor.
5. The memory device according to claim 1 ,
wherein the semiconductor layer comprises a c-axis aligned crystalline oxide semiconductor.
6. The memory device according to claim 1 , further comprising a driver circuit formed over a semiconductor substrate,
wherein the transistor and the capacitor are formed over the driver circuit and are functionally connected to the driver circuit.
7. The memory device according to claim 1 , further comprising a driver circuit formed over a semiconductor substrate,
wherein the driver circuit is electrically connected to the bit line through a contact plug, and
wherein the transistor and the capacitor are formed over the driver circuit.
8. The memory device according to claim 1 ,
wherein the semiconductor layer is prism-shaped or cylinder-shaped, and
wherein the word line faces all of side faces or the whole side face of the semiconductor layer.
9. The memory device according to claim 1 ,
wherein the transistor and the capacitor are included in a memory cell and,
wherein, in the memory cell, a distance separating a lowest part of the capacitor from a highest part of the capacitor is smaller than a width of the memory cell.
10. The memory device according to claim 1 ,
wherein the bit line is a metal layer overlapping with the semiconductor layer.
11. The memory device according to claim 1 ,
wherein the top surface of the gate insulating layer and the top surface of the word line are formed by a planarization step stopped when the top surface of the gate insulating layer and the top surface of the word line are in the same horizontal plane as the top surface of the semiconductor layer.
12. A semiconductor device comprising:
an insulating surface;
a first conductive layer formed over the insulating surface;
a semiconductor layer formed over and in electrical contact with the first conductive layer;
a second conductive layer formed over and in electrical contact with the semiconductor layer;
an insulating layer formed over the second conductive layer;
a third conductive layer formed over the insulating layer and overlapping the second conductive layer and the semiconductor layer;
a fourth conductive layer facing a side face of the semiconductor layer; and
a gate insulating layer interposed between the fourth conductive layer and the semiconductor layer,
wherein a top surface of the semiconductor layer, a top surface of the gate insulating layer, and a top surface of the fourth conductive layer are in a same horizontal plane, and
wherein the semiconductor layer comprises a semiconductor material having a wider band gap than silicon.
13. The semiconductor device according to claim 12 ,
wherein the first conductive layer, the second conductive layer, and the fourth conductive layer form respectively a source, a drain, and a gate of a transistor including the semiconductor layer as a channel-formation layer; and
wherein the second conductive layer and the third conductive layer form two facing electrodes of a capacitor.
14. The semiconductor device according to claim 12 ,
wherein the semiconductor layer comprises a material having a band gap greater than or equal to 2.5 eV and less than or equal to 4 eV.
15. The semiconductor device according to claim 12 ,
wherein the semiconductor layer has been formed by deposition of a thin film semiconductor material.
16. The semiconductor device according to claim 12 ,
wherein the semiconductor layer comprises an oxide semiconductor.
17. The semiconductor device according to claim 12 ,
wherein the semiconductor layer comprises a c-axis aligned crystalline oxide semiconductor.
18. The semiconductor device according to claim 12 , further comprising a driver circuit formed over a semiconductor substrate,
wherein the first conductive layer and the second conductive layer are formed over the driver circuit and are functionally connected to the driver circuit.
19. The semiconductor device according to claim 12 , further comprising a driver circuit formed over a semiconductor substrate,
wherein the driver circuit is electrically connected to the first conductive layer through a contact plug, and
wherein the first conductive layer and the second conductive layer are formed over the driver circuit.
20. The semiconductor device according to claim 12 ,
wherein the semiconductor layer is prism-shaped or cylinder-shaped, and
wherein the fourth conductive layer faces all of side faces or the whole side face of the semiconductor layer.
21. The semiconductor device according to claim 12 ,
wherein the second conductive layer and the third conductive layer are at least partly included in a memory cell and,
wherein, in the memory cell, a distance separating a lowest bottom surface of the second conductive layer from a highest top surface of the third conductive layer is smaller than a width of the memory cell.
22. The semiconductor device according to claim 12 ,
wherein the semiconductor device is a memory device.
23. The semiconductor device according to claim 12 ,
wherein the first conductive layer is a metal layer overlapping with the semiconductor layer.
24. The semiconductor device according to claim 12 ,
wherein the top surface of the gate insulating layer and the top surface of the fourth conductive layer are formed by a planarization step stopped when the top surface of the gate insulating layer and the top surface of the fourth conductive layer are in the same horizontal plane as the top surface of the semiconductor layer.
25. A memory device comprising:
an insulating surface;
a first transistor over the insulating surface, the first transistor comprising a first bit line, a first semiconductor layer over the first bit line, a first capacitor electrode, and a first gate insulating layer, the first semiconductor layer being interposed between and in electrical contact with the first bit line and the first capacitor electrode;
a second transistor over the insulating surface, the second transistor comprising a second bit line, a second semiconductor layer over the second bit line, a second capacitor electrode, and a second gate insulating layer, the second semiconductor layer being interposed between and in electrical contact with the second bit line and the second capacitor electrode;
a word line facing a side surface of the first semiconductor layer and a side surface of the second semiconductor layer with the first gate insulating layer and the second gate insulating layer interposed between the word line and, respectively, the first semiconductor layer and the second semiconductor layer;
an insulating layer covering the first and the second capacitor electrodes;
a capacitor line over the insulating layer;
a capacitor comprising the first capacitor electrode, the insulating layer, and the capacitor line,
wherein the word line fills a space separating the first and the second semiconductor layers, except for a volume occupied by the first and the second gate insulating layers, and
wherein the first and the second semiconductor layers each comprise a semiconductor material having a wider band gap than silicon.
26. The memory device according to claim 25 ,
wherein the first bit line is a metal layer overlapping with the first semiconductor layer.
27. The memory device according to claim 25 ,
wherein the word line completely fills the space separating the first and the second semiconductor layers, except for the volume occupied by the first and the second gate insulating layers.