IP Library › Granted Patent US 9,086,209
Granted Patent B2
US 9,086,209 · App. 13/920,844 · Granted Jul 21, 2015

Lighting device

Inventors: Kwang Ho Park (Seoul, KR); Chul Hong Kim (Seoul, KR); Hyun Duck Yang (Seoul, KR); Moo Ryong Park (Seoul, KR); Jun Chul Hyun (Seoul, KR)
Assignee: LG INNOTEK CO., LTD.
F21V13/02F21V3/02F21V3/04F21V15/012H01L25/0753H01L33/48F21V31/04F21Y2101/02F21Y2105/001
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Quick Facts
Patent No.
US 9,086,209
App. No.
13/920,844
Granted
Jul 21, 2015
Kind
B2
Abstract

Provided is a lighting device, comprising: a light source module comprising: at least one light source disposed on a printed circuit board; and a resin layer disposed on the printed circuit board so that the light source is embedded; a light reflection member formed on at least any one of one side surface and another side surface of the resin layer; and a diffusion plate having an upper surface formed on the light source module, and a side wall which is integrally formed with the upper surface and formed to extend in a lower side direction and which is adhered onto the light reflection member, wherein a first separated space is formed between the light source module and the upper surface of the diffusion plate, whereby flexibility of the product itself can be secured, and durability and reliability of the product can be also improved.

Claims (24)

1. A lighting device comprising:

a light source module comprising at least one light source disposed on a printed circuit board, and a resin layer disposed on the printed circuit board so that the light source is embedded;

a light reflection member formed on at least any one of one side surface and another side surface of the resin layer; and

a diffusion plate having an upper surface formed on the light source module, and a side wall which is integrally formed with the upper surface and formed to extend in a lower side direction and which is adhered onto the light reflection member,

wherein a first separated space is formed between the light source module and the upper surface of the diffusion plate.

2. The lighting device according to claim 1 , wherein the light source module further comprises a reflection unit formed between the printed circuit board and the resin layer and having a spacing part in an inner part thereof.

3. The lighting device according to claim 1 , wherein the light source module further comprises an optical pattern layer having an optical pattern for dispersing light formed on the resin layer.

4. The lighting device according to claim 1 , wherein the resin layer is comprises an ultraviolet curing resin including an oligomer.

5. The lighting device according to claim 4 , wherein the oligomer constitutes 40 to 55 wt. % of the resin and comprises at least one of urethane acrylate, epoxy acrylate, polyester acrylate, polyether acrylate, polybutadiene acrylate, and silicon acrylate.

6. The lighting device according to claim 2 , wherein the reflection unit comprises: a first reflection sheet adhered onto a surface of the printed circuit board; and a second reflection sheet made of a transparent material and spaced apart from the first reflection sheet to form the spacing part.

7. The lighting device according to claim 6 , wherein the reflection unit further comprises a separation member for separating the first reflection sheet from the second reflection sheet.

8. The lighting device according to claim 7 , wherein the separation member is configured such that at least one or more unit separation members composed of an adhesive material which form a first separation part due to a void part formed in an inner portion thereof are disposed.

9. The lighting device according to claim 8 , wherein the separation member is configured such that the plurality of unit separation members is disposed to be spaced apart from each other, and a second separation part is formed in spaces spaced apart from each other between the unit separation members.

10. The lighting device according to claim 3 , wherein the optical pattern layer comprises: a first optical sheet formed an upper surface of the resin layer to disperse emitted light; and a second optical sheet formed on the first optical sheet.

11. The lighting device according to claim 10 , wherein the optical pattern layer further comprises an adhesive layer formed between the first optical sheet and the second optical sheet.

12. The lighting device according to claim 11 , wherein a second separated space, which surrounds a periphery part of the optical pattern, is formed in the adhesive layer.

13. The lighting device according to claim 10 , wherein the optical pattern is formed on an upper surface of the first optical sheet or a lower surface of the second optical sheet.

14. The lighting device according to claim 3 , wherein the optical pattern is composed in an overlapping structure of a diffusion pattern including one or more materials selected from the group consisting of TiO 2 , CaCO 3 , BaSO 4 , Al 2 O 3 , Silicon, and PS (Polystyrene), and a light shielding pattern including Al or a mixture of Al and TiO 2 .

15. The lighting device according to claim 1 , wherein the resin layer further comprises a diffusion material for diffusing light, which is composed of at least any one selected from the group consisting of silicon, silica, glass bubble, PMMA, urethane, Zn, Zr, Al 2 O 3 , and acryl.

16. The lighting device according to claim 2 , wherein the light source module further comprises a reflection pattern formed on the reflection unit.

17. The lighting device according to claim 1 , wherein the light source is a side view type light emitting device package.

18. The lighting device according to claim 1 , wherein the light source comprises a light source package that comprises: a package body having a cavity; a first lead frame including one end exposed to the cavity and another end exposed to one surface of the package body by passing through the package body; a second lead frame including one end exposed to one side of the one surface of the package body, another end exposed to another side of the one surface of the package body, and a middle part exposed to the cavity; and at least one light emitting chip disposed on a first semiconductor layer, an active layer a second semiconductor layer and the first lead frame.

19. The lighting device according to claim 18 , wherein the first lead frame comprises: a first upper surface part exposed to the cavity; and a first side surface part which is bent from a first side portion of the first upper surface part and which is exposed to the one surface of the package body.

20. The lighting device according to claim 19 , wherein the second lead frame comprises: a second upper surface part which is disposed around at least one side portion of the first upper surface part and which is exposed to the cavity of the package body; and a second side surface part which is bent from the second upper surface part and which is exposed to the one side and the another side of the one surface of the package body.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 8, 2013
From: PARK, KWANG HO; KIM, CHUL HONG; YANG, HYUN DUCK; PARK, MOO RYONG; HYUN, JUN CHUL
To: LG INNOTEK CO., LTD.
Reel/Frame 030750/0721 →
Priority Claims (3)
KR 10-2012-0065259 · Jun 18, 2012 · national
KR 10-2012-0065260 · Jun 18, 2012 · national
KR 10-2012-0065264 · Jun 18, 2012 · national
Continuity (1)
Related Publication 20130335975A1 · Dec 19, 2013