IP Library Granted Patent US 9,087,804
Granted Patent B2
US 9,087,804 · App. 13/463,828 · Granted Jul 21, 2015

Heat dissipating module and heat dissipating method thereof

Inventors: Chun-Chieh Wong (Taipei, TW); Cheng-Yu Wang (Taipei, TW)
Assignee: ASUSTeK COMPUTER INC.
H01L23/34G06F1/20H01L23/427H01L23/467H01L2924/0002
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Quick Facts
Patent No.
US 9,087,804
App. No.
13/463,828
Granted
Jul 21, 2015
Kind
B2
Abstract

A heat dissipating module disposed between a plurality of heating elements is provided. The heat dissipating module includes a plurality of heat conducting units, a set of heat dissipating fins, a plurality of fans, a plurality of sensing units and a control unit. The heat conducting units are connected to the set of the heat dissipating fins and the heating elements. A gap exists between the heat conducting units. The fans are disposed at the same side of the set of the heat dissipating fins. The sensing units are coupled to the heating elements, respectively, to detect the heat generated by the heating elements. The control unit is electrically connected to the fans and the sensing units. The heat generated by the heating elements is different from each other, and the control unit adjusts the speed of the fans according to the heat generated by the heating elements.

Claims (10)

1. A heat dissipating module disposed between a plurality of heating elements, the heat dissipating module comprising:

a plurality of heat conducting units connected to the heating elements, respectively;

a set of heat dissipating fins connected to the heat conducting units, wherein a gap exists between the heat conducting units;

a plurality of fans disposed at the same side of the set of the heat dissipating fins;

a plurality of sensing units coupled to the heating elements, respectively, to detect heat generated by the heating elements; and

a control unit electrically connected to the fans and the sensing units, wherein the heat generated by the heating elements is different from each other and the control unit adjusts the speed of the fans according to the heat generated by the heating elements, when one of the heating elements generates more heat than other heating elements, the control unit drives the fan corresponding to the heating element generating more heat than other heating elements to rotate in a higher speed than other fans.

2. The heat dissipating module according to claim 1 , wherein the heat conducting units are connected to edge of the set of the heat dissipating fins, respectively.

3. The heat dissipating module according to claim 1 , wherein the heat conducting units pass through the set of the heat dissipating fins.

4. The heat dissipating module according to claim 3 , wherein projections of the heat conducting units passing through the set of the heat dissipating fins at a bottom of the set of the heat dissipating fins are not overlapped.

5. The heat dissipating module according to claim 1 , wherein if the heating element generates more heat, the heat is transferred to the heating element generating less heat via the heat conducting units and the set of the heat dissipating fins.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 7, 2012
From: WONG, CHUN-CHIEH; WANG, CHENG-YU
To: ASUSTEK COMPUTER INC.
Reel/Frame 028162/0385 →
Priority Claims (1)
CN 2011 1 0115415 · May 5, 2011 · national
Continuity (1)
Related Publication 20120279688A1 · Nov 8, 2012