Semiconductor device

1. A semiconductor device comprising:

an interlayer dielectric film formed on an upper surface of a substrate, the interlayer dielectric film including a trench;

a gate insulating film formed in the trench;

a work function control film formed on the gate insulating film of the trench along bottom and sidewalls of the trench;

a first metal gate pattern on the work function control film of the trench and filling a portion of the trench;

a second metal gate pattern on the first metal gate pattern of the trench, the second metal gate pattern different from the first metal gate pattern; and

an adhesive film disposed between the second metal gate pattern and the work function control film and between the second metal gate pattern and the first metal gate pattern,

wherein a distance from the upper surface of the substrate to an uppermost surface of the second metal gate pattern is greater than a distance from the upper surface of the substrate to an uppermost surface of the first metal gate pattern.

2. The semiconductor device of claim 1 , wherein the work function control film includes an inclined uppermost surface defining an acute angle with respect to the sidewalls of the trench.

3. The semiconductor device of claim 2 , wherein a top surface of the first metal gate pattern is positioned below the inclined uppermost surface of the work function control film.

4. The semiconductor device of claim 1 , wherein the first metal gate pattern has a thickness in a range between 10 Å to 100 Å.

5. The semiconductor device of claim 1 , wherein the semiconductor device is an NMOS transistor, the first metal gate pattern is at least one element selected from the group consisting of aluminum (Al), tungsten (W) and titanium (Ti), and the second metal gate pattern is another at least one element selected from the group consisting of Al, W and Ti.

6. The semiconductor device of claim 1 , wherein when the second metal gate pattern is made of tungsten (W), the adhesive film is made of titanium nitride (TiN), and when the second metal gate pattern is made of aluminum (Al), the adhesive film is made of titanium (Ti) or titanium nitride (TiN).

7. The semiconductor device of claim 1 , wherein the semiconductor device is a fin type transistor.

8. A semiconductor device comprising:

an interlayer dielectric film formed on an upper surface of a substrate, the interlayer dielectric film including a first trench and a second trench spaced apart from the first trench;

an NMOS transistor having a first replacement metal gate formed in the first trench; and

a PMOS transistor having a second replacement metal gate formed in the second trench, wherein the first replacement metal gate comprises:

a work function control film along a bottom and sidewalls of the first trench;

a first metal gate pattern on the work function control film of the first trench and filling a portion of the first trench; and

a second metal gate pattern on the first metal gate pattern of the first trench, the second metal gate pattern different from the first metal gate pattern,

wherein the work function control film of the first replacement metal gate is a first work function control film comprising a first material, and

wherein the second replacement metal gate comprises:

a second work function control film comprising a second material different from the first material, the second work function control film formed along bottom and sidewalls of the second trench,

a third work function control film comprising the first material, the third work function control film formed on the P type work function control film;

a third metal gate pattern formed on the third work function control film in the second trench and filling a portion of the second trench; and

a fourth metal gate pattern formed on the third metal gate pattern in the second trench, the fourth metal gate pattern different from the third metal gate pattern.

9. A semiconductor device comprising:

an interlayer dielectric film on an upper surface of a substrate, the interlayer dielectric film including a trench;

a gate insulating film on a bottom and sidewall surfaces of the trench;

a work function control film on the gate insulating film comprising a chamfered uppermost surface at an opening of the trench defining an acute angle with respect to the sidewall surfaces of the trench;

a first metal gate pattern on the work function control film and filling a portion of the trench; and

a second metal gate pattern on the first metal gate pattern, the second metal gate pattern comprising a different composition from a composition of the first metal gate pattern,

wherein a distance from the upper surface of the substrate to an uppermost surface of the second metal gate pattern is greater than a distance from the upper surface of the substrate to an uppermost surface of the first metal gate pattern,

further comprising an adhesive film between the second metal gate pattern and the work function control film and between the second metal gate pattern and the first metal gate pattern, the adhesive film including a chamfered uppermost surface defining an acute angle with respect to the sidewall surfaces of the trench, wherein the chamfered uppermost surface of the adhesive film is on the chamfered uppermost surface of the work function control film.

10. The semiconductor device of claim 9 , wherein the work function control film is a first work function control film comprising a first material, wherein the semiconductor device further comprises a second work function control film between the gate insulating film and the first work function control film, the second work function control film comprising a second material different from the first material, wherein the second work function control film includes a chamfered uppermost surface defining an acute angle with respect to the sidewall surfaces of the trench, and

wherein the chamfered uppermost surface of the second work function control film and the chamfered uppermost surface of the first work function control film are continuous.