IP Library › Granted Patent US 9,089,075

Granted Patent B2

US 9,089,075 · App. 13/835,105 · Granted Jul 21, 2015

Silicon-based cooling package for cooling and thermally decoupling devices in close proximity

Inventors: Gerald Ho Kim (Carlsbad, CA); Jay Eunjae Kim (Issaquah, WA)

H05K7/2039 F28F21/065 H01L23/367 H01L23/3738 H01L2924/0002

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Quick Facts

Patent No.: US 9,089,075
App. No.: 13/835,105
Granted: Jul 21, 2015
Kind: B2

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Abstract

Various embodiments of an apparatus that simultaneously cools and thermally decouples adjacent electrically-driven devices in close proximity are provided. In one aspect, an apparatus comprises a first non-silicon heat sink and a first silicon-based heat sink disposed on the first non-silicon heat sink. The first silicon-based heat sink is configured to receive a first electrically-driven device on a first portion of the first silicon-based heat sink and to receive a second electrically-driven device on a second portion of the first silicon-based heat sink. The first silicon-based heat sink includes a first groove or a first opening between the first portion and the second portion such that a heat conduction path between the first electrically-driven device and the first non-silicon heat sink through the first silicon-based heat sink is shorter than a heat conduction path between the first electrically-driven device and the second electrically-driven device through the first silicon-based heat sink.

Claims (53)

1. An apparatus, comprising:

a first non-silicon heat sink;

a first silicon-based heat sink having a first primary surface and a second primary surface opposite to the first primary surface, the first silicon-based heat sink disposed on the first non-silicon heat sink with the first primary surface facing the first non-silicon heat sink, the first silicon-based heat sink configured to receive a first electrically-driven device on a first portion of the first silicon-based heat sink on the second primary surface and to receive a second electrically-driven device on a second portion of the first silicon-based heat sink on the second primary surface, the first silicon-based heat sink comprising a first groove or a first opening between the first portion and the second portion such that a heat conduction path between the first electrically-driven device and the first non-silicon heat sink through the first silicon-based heat sink is shorter than a heat conduction path between the first electrically-driven device and the second electrically-driven device through the first silicon-based heat sink; and

a second silicon-based heat sink having a first primary surface and a second primary surface opposite to the first primary surface, the second silicon-based heat sink configured to be disposed on the first electrically-driven device and the second electrically-driven device when the first and second electrically-driven devices are disposed on the second primary surface of the first silicon-based heat sink such that the first silicon-based heat sink and the second silicon-based heat sink sandwich the first electrically-driven device and the second electrically-driven device therebetween with a first portion of the first primary surface of the second silicon-based heat sink facing the first electrically-driven device and a second portion of the first primary surface of the second silicon-based heat sink facing the second electrically-driven device, the second silicon-based heat sink comprising a second groove or a second opening between the first portion and the second portion of the second silicon-based heat sink.

2. The apparatus as recited in claim 1 , wherein a thermal conductivity of the first non-silicon heat sink is greater than a thermal conductivity of the first silicon-based heat sink.

3. The apparatus as recited in claim 1 , wherein the first silicon-based heat sink comprises a silicon-based plate made of single-crystal silicon.

4. The apparatus as recited in claim 1 , wherein the first silicon-based heat sink further comprises one or more additional grooves or one or more additional openings that increase the heat conduction path between the first electrically-driven device and the second electrically-driven device through the first silicon-based heat sink.

5. The apparatus as recited in claim 1 , wherein the second silicon-based heat sink comprises a silicon-based plate made of single-crystal silicon.

6. The apparatus as recited in claim 1 , wherein either or both of the second primary surface of the first silicon-based heat sink and the first primary surface of the second silicon-based heat sink comprise one or more metallic patterns deposited thereon such that the first electrically-driven device is operable to drive the second electrically-driven device by providing electricity through the one or more metallic patterns when the first electrically-driven device and the second electrically-driven device are disposed between the first silicon-based heat sink and the second silicon-based heat sink.

7. The apparatus as recited in claim 1 , wherein the second portion of the second silicon-based heat sink comprises a third opening that at least partially exposes a surface of the second electrically-driven device facing the second silicon-based heat sink when the second electrically-driven device is disposed between the first silicon-based heat sink and the second silicon-based heat sink.

8. The apparatus as recited in claim 1 , further comprising:

a second non-silicon heat sink disposed on the second primary surface of the second silicon-based heat sink.

9. The apparatus as recited in claim 8 , wherein a thermal conductivity of the second non-silicon heat sink is greater than a thermal conductivity of the second silicon-based heat sink.

10. The apparatus as recited in claim 8 , wherein the second portion of the second silicon-based heat sink comprises a third opening, and wherein a portion of the second non-silicon heat sink aligned with the second portion of the second silicon-based heat sink comprises an opening such that at least a portion of a surface of the second electrically-driven device facing the second silicon-based heat sink is exposed through the third opening of the second silicon-based heat sink and the opening of the second non-silicon heat sink when the second electrically-driven device is disposed between the first silicon-based heat sink and the second silicon-based heat sink.

11. The apparatus as recited in claim 1 , further comprising:

the first electrically-driven device disposed on the first portion of the second primary surface of the first silicon-based heat sink; and

the second electrically-driven device disposed on the second portion of the second primary surface of the first silicon-based heat sink.

12. The apparatus as recited in claim 11 , wherein the second electrically-driven device is electrically driven by the first electrically-driven device, wherein the first electrically-driven device comprises a driver circuit, and wherein the second electrically-driven device comprises a laser diode or a sensor.

13. The apparatus as recited in claim 11 , wherein the first electrically-driven device comprises a laser driver circuit or a radio frequency (RF) driver circuit.

14. The apparatus as recited in claim 11 , wherein the second electrically-driven device comprises an edge-emitting laser, a vertical-cavity surface-emitting laser (VCSEL), or a photo-diode.

15. An apparatus, comprising:

a first silicon-based heat sink having a first primary surface and a second primary surface opposite to the first primary surface, the first primary surface of the first silicon-based heat sink configured to be disposed on a first non-silicon heat sink, the first silicon-based heat sink configured to receive a first electrically-driven device on a first portion of the first silicon-based heat sink on the second primary surface and to receive a second electrically-driven device on a second portion of the first silicon-based heat sink on the second primary surface, the first silicon-based heat sink comprising a first groove or a first opening between the first portion and the second portion such that a heat conduction path between the first electrically-driven device and the first non-silicon heat sink through the first silicon-based heat sink is shorter than a heat conduction path between the first electrically-driven device and the second electrically-driven device through the first silicon-based heat sink when the first silicon-based heat sink is disposed on the first non-silicon heat sink; and

16. The apparatus as recited in claim 15 , wherein at least one of the first silicon-based heat sink or the second silicon-based heat sink comprises a silicon-based plate made of single-crystal silicon.

17. The apparatus as recited in claim 15 , wherein at least one of the first silicon-based heat sink or the second silicon-based heat sink further comprises one or more additional grooves or one or more additional openings that increase the heat conduction path between the first electrically-driven device and the second electrically-driven device through the at least one of the first silicon-based heat sink or the second silicon-based heat sink that further comprises the one or more additional grooves or the one or more additional openings.

18. The apparatus as recited in claim 15 , wherein either or both of the second primary surface of the first silicon-based heat sink and the first primary surface of the second silicon-based heat sink comprise one or more metallic patterns deposited thereon such that the first electrically-driven device is operable to drive the second electrically-driven device by providing electricity through the one or more metallic patterns when the first electrically-driven device and the second electrically-driven device are disposed between the first silicon-based heat sink and the second silicon-based heat sink.

19. The apparatus as recited in claim 15 , wherein the second portion of the second silicon-based heat sink comprises a third opening that at least partially exposes a surface of the second electrically-driven device facing the second silicon-based heat sink when the second electrically-driven device is disposed between the first silicon-based heat sink and the second silicon-based heat sink.

20. The apparatus as recited in claim 15 , further comprising:

the first non-silicon heat sink on which the first silicon-based heat sink is disposed with the first primary surface of the first silicon-based heat sink facing the first non-silicon heat sink.

21. The apparatus as recited in claim 20 , wherein a thermal conductivity of the first non-silicon heat sink is greater than a thermal conductivity of the first silicon-based heat sink.

22. The apparatus as recited in claim 20 , further comprising:

a second non-silicon heat sink disposed on the second primary surface of the second silicon-based heat sink.

23. The apparatus as recited in claim 22 , wherein a thermal conductivity of the second non-silicon heat sink is greater than a thermal conductivity of the second silicon-based heat sink.

24. The apparatus as recited in claim 22 , wherein the second portion of the second silicon-based heat sink comprises a third opening, and wherein a portion of the second non-silicon heat sink aligned with the second portion of the second silicon-based heat sink comprises an opening such that at least a portion of a surface of the second electrically-driven device facing the second silicon-based heat sink is exposed through the third opening of the second silicon-based heat sink and the opening of the second non-silicon heat sink when the second electrically-driven device is disposed between the first silicon-based heat sink and the second silicon-based heat sink.

25. The apparatus as recited in claim 15 , further comprising:

the first electrically-driven device disposed on the first portion of the second primary surface of the first silicon-based heat sink and disposed between the first silicon-based heat sink and the second silicon-based heat sink; and

the second electrically-driven device disposed on the second portion of the second primary surface of the first silicon-based heat sink and disposed between the first silicon-based heat sink and the second silicon-based heat sink.

26. The apparatus as recited in claim 25 , wherein the second electrically-driven device is electrically driven by the first electrically-driven device, wherein the first electrically-driven device comprises a driver circuit, and wherein the second electrically-driven device comprises a laser diode or a sensor.

27. The apparatus as recited in claim 25 , wherein the first electrically-driven device comprises a laser driver circuit or a radio frequency (RF) driver circuit.

28. The apparatus as recited in claim 25 , wherein the second electrically-driven device comprises an edge-emitting laser, a vertical-cavity surface-emitting laser (VCSEL), or a photo-diode.

29. An apparatus, comprising:

a first electrically-driven device;

a second electrically-driven device electrically driven by the first electrically-driven device;

a first non-silicon heat sink;

a first silicon-based heat sink having a first primary surface and a second primary surface opposite to the first primary surface, the first silicon-based heat sink disposed on the first non-silicon heat sink with the first primary surface facing the first non-silicon heat sink, the first silicon-based heat sink configured to receive the first electrically-driven device on a first portion of the first silicon-based heat sink on the second primary surface and to receive the second electrically-driven device on a second portion of the first silicon-based heat sink on the second primary surface, the first silicon-based heat sink comprising a first groove or a first opening between the first portion and the second portion such that a heat conduction path between the first electrically-driven device and the first non-silicon heat sink through the first silicon-based heat sink is shorter than a heat conduction path between the first electrically-driven device and the second electrically-driven device through the first silicon-based heat sink;

a second silicon-based heat sink having a first primary surface and a second primary surface opposite to the first primary surface, the second silicon-based heat sink disposed on the first electrically-driven device and the second electrically-driven device when the first and second electrically-driven devices are disposed on the second primary surface of the first silicon-based heat sink such that the first silicon-based heat sink and the second silicon-based heat sink sandwich the first electrically-driven device and the second electrically-driven device therebetween with a first portion of the first primary surface of the second silicon-based heat sink facing the first electrically-driven device and a second portion of the first primary surface of the second silicon-based heat sink facing the second electrically-driven device, the second silicon-based heat sink comprising a second groove or a second opening between the first portion and the second portion of the second silicon-based heat sink; and

a second non-silicon heat sink disposed on the second primary surface of the second silicon-based heat sink.

30. The apparatus as recited in claim 29 , wherein a thermal conductivity of the first non-silicon heat sink is greater than a thermal conductivity of the first silicon-based heat sink.

31. The apparatus as recited in claim 29 , wherein a thermal conductivity of the second non-silicon heat sink is greater than a thermal conductivity of the second silicon-based heat sink.

32. The apparatus as recited in claim 29 , wherein at least one of the first silicon-based heat sink or the second silicon-based heat sink comprises a silicon-based plate made of single-crystal silicon.

33. The apparatus as recited in claim 29 , wherein at least one of the first silicon-based heat sink or the second silicon-based heat sink further comprises one or more additional grooves or one or more additional openings that increase the heat conduction path between the first electrically-driven device and the second electrically-driven device through the at least one of the first silicon-based heat sink or the second silicon-based heat sink that further comprises the one or more additional grooves or the one or more additional openings.

34. The apparatus as recited in claim 29 , wherein either or both of the second primary surface of the first silicon-based heat sink and the first primary surface of the second silicon-based heat sink comprise one or more metallic patterns deposited thereon such that the first electrically-driven device is operable to drive the second electrically-driven device by providing electricity through the one or more metallic patterns when the first electrically-driven device and the second electrically-driven device are disposed between the first silicon-based heat sink and the second silicon-based heat sink.

35. The apparatus as recited in claim 29 , wherein the second portion of the second silicon-based heat sink comprises a third opening, and wherein a portion of the second non-silicon heat sink aligned with the second portion of the second silicon-based heat sink comprises an opening such that at least a portion of a surface of the second electrically-driven device facing the second silicon-based heat sink is exposed through the third opening of the second silicon-based heat sink and the opening of the second non-silicon heat sink when the second electrically-driven device is disposed between the first silicon-based heat sink and the second silicon-based heat sink.

Continuity (2)

Provisional Application 61616301 · Mar 27, 2012

Related Publication 20130258597A1 · Oct 3, 2013