Device for cutting a substrate and method for controlling such a cutting device
A device for cutting a substrate along a cutting line is disclosed. The device includes a saw unit with a saw blade, which can be rotated around an axis of rotation, a guide carriage for moving the saw unit along a guide rail, and a control device for controlling the saw unit and the guide carriage. A marking device is provided for marking an end point of the cutting line.
1. A device for cutting a substrate along a cutting line, comprising:
a saw unit with a saw blade, wherein the saw blade is rotatable around an axis of rotation;
a guide carriage, wherein the saw unit is movable by the guide carriage along a guide rail;
a control device, wherein the saw unit and the guide carriage are controllable by the control device; and
a marking device associated with the guide rail, wherein an end point of the cutting line is markable by the marking device;
wherein the marking device has an optical marking element, a signal generator, and a detector device, wherein the end point is optically markable by the optical marking element, wherein a position signal corresponding to a position of the end point or a position of a reference point which is arranged at a defined distance from the end point is emittable by the signal generator, and wherein the position signal is receivable by the detector device.
2. The device according to claim 1 , further comprising a second marking device associated with the guide rail, wherein a second end point of the cutting line is markable by the second marking device.
3. The device according to claim 2 , wherein the marking device and the second marking device have a common detector device.
4. The device according to claim 1 , wherein the detector device is connectable to the control device and wherein information corresponding to the position signal is transmittable to the control device by the detector device.
5. The device according to claim 1 , wherein the optical marking element is movable on the guide rail by a movement device.
6. The device according to claim 1 , further comprising a mechanical end stop connected to the optical marking element.
7. The device according to claim 1 :
wherein the signal generator has a transmitting unit, wherein a measuring beam is transmittable by the transmitting unit, and a measurement object;
and wherein the detector device has a receiving unit and an evaluation device.
8. The device according to claim 7 , wherein the transmitting unit, the receiving unit, and the evaluation device form a laser distance measuring system or an ultrasonic distance measuring system.
9. A method for controlling a cutting device, comprising the steps of:
generating a position signal by a signal generator which includes a measurement object, wherein the position signal corresponds to a position of an end point of a cutting line on a substrate and wherein the measurement object is arranged at the position of the end point or at a position of a reference point which is arranged at a defined distance from the end point;
receiving the position signal by a detector device, wherein the position signal is reflected and/or scattered from the measurement object;
transmitting information corresponding to the position signal to a control device by the detector device; and
controlling a drive device of the cutting device by the control device based on the transmitted information.
10. The method according to claim 9 :
wherein the signal generator further includes a transmitting unit;
and wherein the detector device has a receiving unit and an evaluation device.