LDMOS transistor having trench structures extending to a buried layer
A semiconductor device includes a semiconductor substrate, a buried layer, a deep well having a first conductivity type being disposed on the buried layer, a first doped region having the first conductivity type and a well having the second conductivity type being disposed in the deep well, a first heavily doped region having the first conductivity type being disposed in the first doped region, a second heavily doped region having the first conductivity type being disposed in the well, a gate disposed between the first heavily doped region and the second heavily doped region, and a first trench structure and a second trench structure being disposed at the two sides of the gate in the semiconductor substrate. The first trench structure contacts the buried layer, and a depth of the second trench structure is substantially larger than a depth of the buried layer.
1. A semiconductor device, comprising:
a semiconductor substrate;
a buried layer disposed in the semiconductor substrate;
a deep well having a first conductivity type being disposed in the semiconductor substrate, wherein the deep well is disposed on the buried layer;
a first doped region having the first conductivity type being disposed in the deep well, wherein the first doped region contacts the buried layer;
a well having a second conductivity type being disposed in the deep well;
a first region having the first conductivity type and being disposed in the first doped region;
a second region having the first conductivity type being disposed in the well;
a gate disposed on the semiconductor substrate between the first region and the second region;
a first trench structure disposed in the semiconductor substrate and directly under part of the gate and between the gate and the first doped region, and contacting the buried layer and the first doped region directly; and
a second trench structure disposed in the semiconductor substrate at the other side of the gate opposite to the first trench structure, wherein a depth of the second trench structure is larger than a depth of the buried layer and larger than the depth of the first trench structure.
2. The semiconductor device according to claim 1 , wherein the first trench structure is disposed between the first region and the second region.
3. The semiconductor device according to claim 2 , wherein the first trench structure is disposed between the first doped region and the well.
4. The semiconductor device according to claim 1 , wherein a part of the well is under the gate, and the well does not contact the buried layer.
5. The semiconductor device according to claim 1 , further comprising an epitaxial layer, wherein the deep well is disposed in the epitaxial layer.
6. The semiconductor device according to claim 1 , wherein a width of the first trench structure is smaller than a width of the second trench structure.
7. The semiconductor device according to claim 1 , wherein the first doped region has a dopant concentration, and the dopant concentration increases progressively from an interface between the first doped region and the buried layer towards a top surface of the first doped region.
8. The semiconductor device according to claim 1 , wherein the first conductivity type comprises n-type or p-type, and the second conductivity type comprises the other one.