Cooling ring for physical vapor deposition chamber target
Apparatus and method for physical vapor deposition are provided. In some embodiments, a cooling ring to cool a target in a physical vapor deposition chamber may include an annular body having a central opening; an inlet port coupled to the body; an outlet port coupled to the body; a coolant channel disposed in the body and having a first end coupled to the inlet port and a second end coupled to the outlet port; and a cap coupled to the body and substantially spanning the central opening, wherein the cap includes a center hole.
1. A cooling ring to cool a target in a physical vapor deposition chamber, comprising:
an annular body having a central opening and a first surface configured to be coupled to a target backing plate;
an inlet port coupled to the body;
an outlet port coupled to the body;
a coolant channel disposed in the body and having a first end coupled to the inlet port and a second end coupled to the outlet port, wherein the coolant channel is configured to flow coolant through the coolant channel in an annular flow direction following a shape of the cooling ring; and
a cap coupled to a second surface of the body and substantially spanning the central opening, wherein the cap includes a center hole, wherein the second surface of the body opposes the first surface, and wherein the cap, the annular body, and the target backing plate form a cavity when the cooling ring is coupled to the target backing plate.
2. The cooling ring of claim 1 , wherein the body is made of at least one of copper, aluminum, or bronze.
3. The cooling ring of claim 2 , wherein the cap is made of at least one of copper, aluminum, or bronze.
4. The cooling ring of claim 3 , wherein the body and the cap are silver plated.
5. The cooling ring of claim 1 , wherein the coolant channel is formed in a first surface of the body and substantially about an entire circumference of the body.
6. The cooling ring of claim 1 , wherein a coolant flowed through the coolant channel to cool the target comprises at least one of ethylene glycol solution, deionized water, or a perfluorinated polyether.
7. The cooling ring of claim 1 , wherein the coolant channel is configured to flow coolant through the coolant channel at about 1 to about 7 gallons per minute.
8. The cooling ring of claim 1 , further comprising:
a plurality of coolant channels disposed in the body.
9. The cooling ring of claim 1 , wherein cooling channel is formed in a first surface of the body, and wherein the cap is coupled to the first surface of the body over the cooling channel to seal the coolant channel.
10. A target assembly for use in a physical vapor deposition system, comprising:
a target comprising a source material to be deposited on a substrate and a target backing plate;
a cooling ring coupled to the target and having one or more coolant channels disposed in a first surface of the cooling ring to flow a coolant through the coolant ring in an annular flow direction following a shape of the cooling ring, wherein a second surface of the cooling ring that opposes the first surface is coupled to the target backing plate;
a cap coupled the first surface of the cooling ring and substantially spanning a central opening of the cooling ring, wherein the cap includes a center hole;
a central cavity adjacent the target backing plate defined by inner walls of the cooling ring, the cap, and the target backing plate; and
a rotatable magnet assembly disposed within the cavity.
11. The target assembly of claim 10 , wherein the cooling ring further comprises:
a body;
a coolant inlet port coupled to the body; and
a coolant outlet port coupled to the body.
12. The target assembly of claim 11 , wherein the target is coupled to the body.
13. The target assembly of claim 11 , wherein the cavity is bounded by a target-facing surface of the cap, a cap-facing surface of the target backing plate and the body of the cooling ring.
14. The target assembly of claim 11 , further comprising a coolant source coupled to the coolant inlet port.
15. The target assembly of claim 14 , wherein the coolant source supplies at least one of ethylene glycol solution, deionized water, or a perfluorinated polyether to the one or more coolant channels.
16. The target assembly of claim 11 , further comprising an RF source coupled to the cooling ring.
17. A method of processing a substrate in a physical vapor deposition chamber, comprising:
sputtering material coupled to a target backing plate of a target disposed in the physical vapor deposition chamber to deposit the material on the substrate supported within the physical vapor deposition chamber; and
flowing a coolant through a coolant channel disposed in a body of a cooling ring in an annular flow direction following a shape of the cooling ring, wherein the cooling ring further includes:
the body having a central opening and a first surface configured to be coupled to the target backing plate; and
a cap coupled to a second surface of the body and substantially spanning the central opening, wherein the cap includes a center hole, wherein the second surface of the body opposes the first surface, and wherein the cap, the body, and the target backing plate form a cavity.
18. The method of claim 17 , wherein the coolant channel circulates the coolant around substantially an entire circumference of the body of the cooling ring.
19. The method of claim 17 , wherein the coolant is flowed through the coolant channel at a flow rate of about 1 to about 7 gallons per minute.
20. The method of claim 17 , wherein the coolant flowed through the coolant channel comprises at least one of ethylene glycol solution, deionized water, or a perfluorinated polyether.