IP Library › Granted Patent US 9,096,953
Granted Patent B2
US 9,096,953 · App. 11/529,573 · Granted Aug 4, 2015

Method for high throughput, high volume manufacturing of biomolecule micro arrays

Inventors: Narayan Sundararajan (San Francisco, CA); John J. Rajasekaran (Los Altos, CA); Guangyu Xu (Milpitas, CA); Gunjan Tiwari (Sunnyvale, CA); Edelmira Cabezas (Sunnyvale, CA)
Assignee: INTEL CORPORATION
C40B50/18B01J19/0046B82Y5/00B82Y30/00B01J2219/00432B01J2219/00495B01J2219/00527B01J2219/00612B01J2219/00617B01J2219/00637B01J2219/00659B01J2219/00711B01J2219/00725C40B40/06
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Quick Facts
Patent No.
US 9,096,953
App. No.
11/529,573
Granted
Aug 4, 2015
Kind
B2
Abstract

The embodiments of the invention relate to a system and method for making a biomolecule microarray comprising a spacer attachment module adapted to attach a linker to a substrate surface of the biomolecule microarray, a coupling module adapted to couple a molecule to the linker, the molecule being capable of forming a peptide bond and containing a protecting group that prevents the formation of the peptide bond, and a deprotection module adapted to create deprotection of the protecting group with a radiation exposure of about 1-50 mJ/cm 2 .

Claims (23)

1. An apparatus configured to make a biomolecule microarray without human intervention, the apparatus comprising a track system, the track system being configured for inline processing and comprising a spacer attachment module adapted to attach a linker to a substrate surface of the biomolecule microarray, a coupling module adapted to couple a molecule to the linker, the molecule being a nucleotide or an amino acid and respectively being capable of forming an amide bond or a phosphodiester bond when the molecule is not bound to a protecting group that respectively prevents the formation of the amide or phosphodiester bond, the molecule being bound to the protecting group, and a deprotection module adapted to create deprotection of the protecting group with a radiation exposure of about 1-50 mJ/cm 2 ;

wherein the deprotection of the protecting group is by generating photo acid in a photoresist comprising poly methyl methacrylate, Bis(4-tert-butylphenyl)iodonium triflate and isopropylthioxanthenone in propylene glycol methyl ether acetate.

2. The apparatus of claim 1 , wherein the spacer attachment module comprises a developer module and a hot plate module adapted to cure the linker on the substrate surface.

3. The apparatus of claim 2 , wherein the developer module is adapted with a puddle mechanism and a spin-wash mechanism.

4. The apparatus of claim 2 , wherein the spacer attachment module further comprises a chill plate module.

5. The apparatus of claim 1 , wherein the spacer attachment module comprises a vapor prime module and a hot plate module adapted to cure the linker on the substrate surface.

6. The apparatus of claim 5 , wherein the vapor prime module is a hexamethyldisilazane (HMDS) vapor prime module.

7. The apparatus of claim 5 , wherein the spacer attachment module further comprises a chill plate module.

8. The apparatus of claim 1 , wherein the coupling module comprises a developer module.

9. The apparatus of claim 8 , wherein the developer module is adapted with a puddle mechanism and a spin-wash mechanism.

10. The apparatus of claim 8 , wherein the developer module is adapted with a mechanism to cap an unreacted linker on the substrate surface.

11. The apparatus of claim 1 , wherein the deprotection module comprises a spin coater module adapted to deposit a photoactive layer on the substrate surface.

12. The apparatus of claim 11 , wherein the deprotection module further comprises a hot plate module adapted to bake the photoactive layer.

13. The apparatus of claim 12 , wherein the deprotection module further comprises a chill plate module adapted to cool the photoactive layer.

14. The apparatus of claim 1 , wherein the deprotection module comprises an alignment and exposure module adapted to remove the protecting group.

15. The apparatus of claim 14 , wherein the alignment and exposure module adapted to remove the protecting group with the radiation exposure of about 10-50 mJ/cm 2 .

16. The apparatus of claim 15 , wherein the radiation exposure is an ultraviolet radiation exposure.

17. The apparatus of claim 14 , wherein the alignment and exposure module comprises a stepper platform.

18. The apparatus of claim 17 , wherein the stepper platform is adapted to step and scan with ability to handle one or more reticles.

19. The apparatus of claim 17 , wherein the stepper platform is adapted to perform maskless lithography.

20. The apparatus of claim 14 , wherein the deprotection module further comprises a developer module adapted to strip a photoactive layer on the substrate surface.

21. The apparatus of claim 1 , wherein the track system is enclosed inside an enclosure, air in the enclosure being filtered using a filter that filters ozone.

22. The apparatus of claim 1 , wherein the photoresist comprises 2.5% poly methyl methacrylate, 5% Bis(4-tert-butylphenyl)iodonium triflate, and 5% isopropylthioxanthenone.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 7, 2007
From: SUNDARARAJAN, NARAYAN; RAJASEKARAN, JOHN J.; XU, GUANGYU; TIWARI, GUNJAN; CABEZAS, EDELMIRA
To: INTEL CORPORATION
Reel/Frame 019257/0097 →
Continuity (1)
Related Publication 20100240555A1 · Sep 23, 2010