Methods and apparatus of guard rings for wafer-level-packaging
View Patent ↗Methods and apparatuses are disclosed for forming a post-passivation interconnect (PPI) guard ring over a circuit in a wafer forming a wafer level package (WLP). A circuit device comprises a guard ring and an active area. A passivation layer is formed on top of the circuit device over the guard ring and the active area, wherein the passivation layer contains a passivation contact connected to the guard ring. A first polymer layer is formed over the passivation layer. A PPI opening is formed within the first polymer layer or within the passivation layer over the passivation contact. A PPI guard ring is formed filling the PPI opening in touch with the passivation contact and extending on top of the first polymer layer or the passivation layer.
1. A semiconductor device, comprising:
a circuit device comprising a guard ring and an active area;
a passivation layer on the circuit device over the guard ring and the active area, wherein the passivation layer comprises a passivation contact connected to the guard ring;
a first polymer layer over the passivation layer, wherein the first polymer layer has a post-passivation interconnect (PPI) opening over the guard ring;
a PPI guard ring filling the PPI opening connected to the passivation contact and extending on top of the first polymer layer; and
a second polymer layer directly on the first polymer layer and the PPI guard ring.
2. The semiconductor device of claim 1 , wherein the passivation layer comprises a plurality of sub-layers.
3. The semiconductor device of claim 1 , wherein the first polymer layer extends to an edge of the guard ring next to a scribe line.
4. The semiconductor device of claim 1 , wherein the PPI opening is of a round shape with a diameter about 2 μm and the PPI guard ring on top of the first polymer layer is of a square shape with a side of size about 4 μm.
5. The semiconductor device of claim 1 , wherein an edge of the PPI guard ring on top of the first polymer layer has a distance about at least 2 μm to an edge of the first polymer layer.
6. The semiconductor device of claim 1 , wherein an edge of the PPI guard ring on top of the first polymer layer has a distance about at least 2 μm to an edge of the guard ring next to the active area.
7. The semiconductor device of claim 1 , wherein the PPI guard ring is made of copper, copper alloy, aluminum, silver, gold, or combinations thereof.
8. The semiconductor device of claim 1 , wherein the first polymer layer is made of an epoxy, polyimide, benzocyclobutene (BCB), polybenzoxazole (PBO), or other polymer material.
9. The semiconductor device of claim 1 , further comprising a PPI pad on top of the first polymer layer connected to a bonding pad of the circuit device.
10. The semiconductor device of claim 9 , further comprising an under-bump metallurgy (UBM) layer over the second polymer layer electrically connected to the PPI pad.
11. The semiconductor device of claim 1 , wherein the first polymer layer comprising a first part over the guard ring discontinuous from a second part ending at an edge of the guard ring and over the active area.
12. The semiconductor device of claim 11 , wherein a gap between the first part of the first polymer layer and the second part of the first polymer layer is about a size of 2 μm.
13. A method of forming a semiconductor device, comprising:
forming a passivation layer on top of a circuit device, wherein the circuit device comprises a guard ring and an active area, and the passivation layer is formed over the guard ring and the active area;
forming a passivation contact within the passivation layer connected to the guard ring;
forming a first polymer layer over the passivation layer;
forming a post-passivation interconnect (PPI) opening within the first polymer layer over the guard ring;
filling the PPI opening with a PPI guard ring, wherein the PPI guard ring is connected to the passivation contact and extends on top of the first polymer layer; and
forming a second polymer layer encapsulating the first polymer layer and the PPI guard ring, the second polymer layer extending along a sidewall of the first polymer layer.
14. A semiconductor device, comprising:
a circuit device comprising a guard ring and an active area;
a passivation layer on top of the circuit device over the guard ring and the active area, wherein the passivation layer comprises a passivation contact connected to the guard ring;
a first polymer layer over the passivation layer, wherein the first polymer layer comprises a first part over the guard ring discontinuous from a second part ending at an edge of the guard ring and over the active area, and the first polymer layer has a post-passivation interconnect (PPI) opening over the guard ring;
a post-passivation interconnect (PPI) guard ring filling the PPI opening within the first polymer layer and extending on top of the first polymer layer, the PPI guard ring contacting the guard ring; and
a second polymer layer over the first polymer layer and extending over a top major surface of the PPI guard ring.
15. The semiconductor device of claim 14 , wherein the passivation layer comprises a plurality of sub-layers.
16. The semiconductor device of claim 14 , wherein the second polymer layer extends to an edge of the guard ring next to a scribe line.
17. The semiconductor device of claim 14 , wherein the PPI opening is of a round shape with a diameter about 2 μm and the PPI guard ring on top of the passivation layer is of a rectangle shape with a side of size about 4 μm.
18. The semiconductor device of claim 14 , wherein an edge of the PPI guard ring over the passivation layer has a distance at least about 2 μm to an edge of the first polymer layer.
19. The semiconductor device of claim 14 , wherein the PPI guard ring is made of copper, copper alloys. aluminum, silver, gold, or combinations thereof.
20. The semiconductor device of claim 14 , wherein the first polymer layer is made of an epoxy, polyimide, benzocyclobutene (BCB), polybenzoxazole (PBO), and the like polymer.