IP Library › Granted Patent US 9,101,068
Granted Patent B2
US 9,101,068 · App. 13/830,033 · Granted Aug 4, 2015

Two-stage power delivery architecture

Inventors: Changhan Yun (San Diego, CA); Francesco Carobolante (San Diego, CA); Chengjie Zuo (Santee, CA); Jonghae Kim (San Diego, CA); Mario Francisco Velez (San Diego, CA); Lawrence D. Smith (San Diego, CA); Matthew M. Nowak (San Diego, CA)
Assignee: QUALCOMM INCORPORATED
H05K7/1092H01L23/49822H01L23/49827H05K1/0231H05K1/165H01L23/49816H05K1/0243H05K1/0262Y10T29/4913Y10T29/49128
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Quick Facts
Patent No.
US 9,101,068
App. No.
13/830,033
Granted
Aug 4, 2015
Kind
B2
Abstract

A two-stage power delivery network includes a voltage regulator and an interposer. The interposer includes a packaging substrate having an embedded inductor. The embedded inductor includes a set of traces and a set of through substrate vias at opposing ends of the traces. The interposer is coupled to the voltage regulator. The two-stage power delivery network also includes a semiconductor die supported by the packaging substrate. The two-stage power delivery network also includes a capacitor that is supported by the packaging substrate. The capacitor is operable to provide a decoupling capacitance associated with the semiconductor die and a capacitance to reduce a switching noise of the voltage regulator.

Claims (16)

1. A two-stage power delivery network, comprising:

a voltage regulator;

an interposer comprising a packaging substrate having an embedded inductor including a plurality of traces and a plurality of through substrate vias at opposing ends of the plurality of traces, the interposer coupled to the voltage regulator;

a semiconductor die supported by the packaging substrate; and

a metal-insulator-metal capacitor directly on the packaging substrate and embedded within a protective layer of the interposer, the metal-insulator-metal capacitor operable to provide a decoupling capacitance associated with the semiconductor die and a capacitance to reduce a switching noise of the voltage regulator.

2. The two-stage power delivery network of claim 1 , further comprising a printed circuit board supporting the packaging substrate and the voltage regulator.

3. The two-stage power delivery network of claim 1 , in which the packaging substrate comprises glass, air, quartz, sapphire or high-resistivity silicon.

4. The two-stage power delivery network of claim 1 , in which opposing sides of the capacitor comprise thick conductive films to provide a high quality factor value.

5. The two-stage power delivery network of claim 1 , in which the voltage regulator is provided on a surface of the interposer.

6. The two-stage power delivery network of claim 1 , integrated into a mobile phone, a set top box, a music player, a video player, an entertainment unit, a navigation device, a computer, a hand-held personal communication systems (PCS) unit, a portable data unit, and/or a fixed location data unit.

7. A two-stage power delivery network, comprising:

a means for regulating voltage;

an interposer comprising a packaging substrate having an embedded inductor including a plurality of traces and a plurality of through substrate vias at opposing ends of the plurality of traces, the interposer coupled to the voltage regulating means;

a die supported by the packaging substrate; and

a metal-insulator-metal capacitor directly on the packaging substrate and embedded within a protective layer of the interposer, the metal-insulator-metal capacitor operable to provide a decoupling capacitance associated with the semiconductor die and a capacitance to reduce a switching noise of the voltage regulating means.

8. The two-stage power delivery network of claim 7 , integrated into a mobile phone, a set top box, a music player, a video player, an entertainment unit, a navigation device, a computer, a hand-held personal communication systems (PCS) unit, a portable data unit, and/or a fixed location data unit.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2013
From: YUN, CHANGHAN; CAROBOLANTE, FRANCESCO; ZUO, CHENGJIE; KIM, JONGHAE; VELEZ, MARIO FRANCISCO; SMITH, LAWRENCE D.; NOWAK, MATTHEW M.
To: QUALCOMM INCORPORATED
Reel/Frame 030124/0872 →
Continuity (1)
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