Solid-state imaging apparatus
A solid-state imaging apparatus includes: a solid-state imaging device photoelectrically converting light taken by a lens; and a light shielding member shielding part of light incident on the solid-state imaging device from the lens, wherein an angle made between an edge surface of the light shielding member and an optical axis direction of the lens is larger than an incident angle of light to be incident on an edge portion of the light shielding member.
1. An imaging device, comprising:
a solid-state imaging device photoelectrically converting light taken by a lens;
a light shielding member shielding part of light incident on the solid-state imaging device from lens; and
a sealing member sealing a gap on the light receiving surface of the solid-state imaging device,
wherein the light shielding member has an opening, a first size of the opening facing the solid-state imaging device is greater than a second size of the opening facing the lens, and
wherein an edge surface of the opening of the light shielding member forms an angle with respect to an optical axis direction of the lens, and
wherein the light shielding member is provided on a surface of the sealing member facing the lens or a surface thereof facing the solid-state imaging device.
2. The imaging device according to claim 1 ,
wherein the angle made between the edge surface of the light shielding member and the optical axis direction of the lens is larger than the incident angle of light whose incident angle is the largest of light incident on the edge portion of the light shielding member.
3. The imaging device according to claim 2 ,
wherein pads to which metal wires connected to a substrate are connected are provided at an peripheral portion of a light receiving surface of the solid-state imaging device, and
wherein the pads are not arranged on an area closer to the light receiving surface in areas defined by an intersection between a surface of the solid-state imaging device and a virtual extension surface of the edge surface of the light shielding member.
4. The imaging device according to claim 2 ,
wherein the light receiving surface of the solid-state imaging device receives light incident from an opening of a substrate having the opening, and
an edge surface of the opening does not intersect the virtual extension surface of the edge surface of the light shielding member.
5. The imaging device according to claim 1 ,
wherein a side surface of the sealing member does not intersect the virtual extension surface of the edge surface of the light shielding member.
6. The imaging device according to claim 2 ,
wherein the light shielding member is formed by printing a material for printing on an optical filter arranged on an optical path once or plural times.
7. The imaging device according to claim 1 ,
wherein the angle made between the edge surface of the light shielding member and the optical axis is 50 degrees.
8. The imaging device according to claim 1 ,
wherein the light shielding member is made of an antireflection film.
9. The imaging device according to claim 8 , wherein the light shielding member is colored black.
10. The imaging device according to claim 1 , wherein the light shielding member is colored black.
11. The imaging device according to claim 8 , wherein the light shielding member has UV curability or heat curability.
12. The imaging device according to claim 11 , wherein the light shielding member is made of a material selected from the group consisting of a carbon filler, epoxy resin or acrylic resin colored black with dye and an epoxy/acrylic hybrid resin.
13. The imaging device according to claim 2 , further comprising;
an optical member arranged on an optical path between the lens and the solid-state image device,
wherein the light shielding member is bonded to a surface of the optical member facing the solid-state imaging device.
14. The imaging device according to claim 13 , wherein the optical member is an infrared ray cut filter.
15. The imaging device according to claim 13 , further comprising:
a bonding pad arranged on a peripheral portion of the solid-state imaging device excluding a light receiving surface,
wherein the solid-state imaging apparatus is configured to satisfy the following expressions: θM>arctan [tanθU+{(D−2σ)/G], wherein θM is the angle made between the edge surface of the light shielding member and the optical axis, θU is an incident angle of an upper ray, D is a distance between the edge portion of the light receiving surface and the bonding pad, σ is a deviation from a position in design of the light shielding member, and G is a gap length between the optical member and the solid-state imaging device.
16. The imaging device according to claim 13 , wherein the sealing member is made of transparent materials transmitting light.
17. The imaging device according to claim 16 , wherein the sealing member is made of glass or resin.
18. An electronic apparatus comprising:
a solid-state imaging device photoelectrically converting light taken by a lens;
a light shielding member shielding part of light incident on the solid-state imaging device from lens; and
a sealing member sealing a gap on the light receiving surface of the solid-state imaging device,
wherein the light shielding member has an opening, a first size of the opening facing the solid-state imaging device is greater than a second size of the opening facing the lens,
wherein an edge surface of the opening of the light shielding member forms an angle with respect to an optical axis direction of the lens, and
wherein the light shielding member is provided on a surface of the sealing member facing the lens or a surface thereof facing the solid-state imaging device.
19. The electronic apparatus according to claim 18 ,
wherein the angle made between the edge surface of the light shielding member and the optical axis direction of the lens is larger than the incident angle of light whose incident angle is the largest of light incident on the edge portion of the light shielding member.
20. The electronic apparatus according to claim 19 ,
wherein pads to which metal wires connected to a substrate are connected are provided at an peripheral portion of a light receiving surface of the solid-state imaging device, and
wherein the pads are not arranged on an area closer to the light receiving surface in areas defined by an intersection between a surface of the solid-state imaging device and a virtual extension surface of the edge surface of the light shielding member.
21. The electronic apparatus according to claim 19 ,
wherein the light receiving surface of the solid-state imaging device receives light incident from an opening of a substrate having the opening, and
an edge surface of the opening does not intersect the virtual extension surface of the edge surface of the light shielding member.
22. The electronic apparatus according to claim 18 ,
wherein a side surface of the sealing member does not intersect the virtual extension surface of the edge surface of the light shielding member.
23. The electronic apparatus according to claim 19 ,
wherein the light shielding member is formed by printing a material for printing on an optical filter arranged on an optical path once or plural times.
24. The electronic apparatus according to claim 18 ,
wherein the angle made between the edge surface of the light shielding member and the optical axis is 50 degrees.
25. The electronic apparatus according to claim 18 ,
wherein the light shielding member is made of an antireflection film.
26. The electronic apparatus according to claim 25 , wherein the light shielding member is colored black.
27. The electronic apparatus according to claim 18 , wherein the light shielding member is colored black.
28. The electronic apparatus according to claim 25 , wherein the light shielding member has UV curability or heat curability.
29. The electronic apparatus according to claim 28 ,
wherein the light shielding member is made of a material selected from the group consisting of a carbon filler, epoxy resin or acrylic resin colored black with dye and an epoxy/acrylic hybrid resin.
30. The electronic apparatus according to claim 19 , further comprising;
an optical member arranged on an optical path between the lens and the solid-state image device,
wherein the light shielding member is bonded to a surface of the optical member facing the solid-state imaging device.
31. The electronic apparatus according to claim 30 , wherein the optical member is an infrared ray cut filter.
32. The electronic apparatus according to claim 30 , further comprising:
a bonding pad arranged on a peripheral portion of the solid-state imaging device excluding a light receiving surface,
wherein the solid-state imaging apparatus is configured to satisfy the following expressions: θM >arctan [tanθU+{(D−2σ)/G], wherein θM is the angle made between the edge surface of the light shielding member and the optical axis, θU is an incident angle of an upper ray, D is a distance between the edge portion of the light receiving surface and the bonding pad, σ is a deviation from a position in design of the light shielding member, and G is a gap length between the optical member and the solid-state imaging device.
33. The electronic apparatus according to claim 30 , wherein the sealing member is made of transparent materials transmitting light.
34. The electronic apparatus according to claim 33 , wherein the sealing member is made of glass or resin.