Vapor deposition mask, method for producing vapor deposition mask device and method for producing organic semiconductor element
A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size is increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.
1. A vapor deposition mask,
wherein a metal mask provided with a slit, and
a resin mask that is positioned on a front surface of the metal mask, and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.
2. The vapor deposition mask according to claim 1 ,
wherein the metal mask is of a magnetic substance.
3. The vapor deposition mask according to claim 1 ,
wherein a sectional shape of the opening has broadening toward a vapor deposition source direction.
4. The vapor deposition mask according to claim 1 ,
wherein a sectional shape of the slit has broadening toward the vapor deposition source direction.
5. The vapor deposition mask according to claim 1 ,
wherein a sectional shape of an entire opening formed by the slit of the metal mask and the opening of the resin mask presents a step shape.
6. The vapor deposition mask according to claim 1 ,
wherein a barrier layer is provided on end surfaces forming the opening of the resin mask.
7. The vapor deposition mask according to claim 1 ,
wherein a thickness of the resin mask is 3 μm to 25 μm inclusive.
8. A method for producing a vapor deposition mask device, comprising the steps of:
bonding a metal mask provided with a slit to a resin plate;
fixing the metal mask to which the resin plate is bonded, onto a frame containing a metal; and
forming openings corresponding to a pattern to be produced by vapor deposition in a plurality of rows lengthwise and crosswise in the resin plate by emitting laser from the metal mask side.
9. A method for producing a vapor deposition mask device, comprising the steps of:
fixing a metal mask provided with a slit onto a frame containing a metal;
bonding the metal mask fixed to the frame and a resin plate to each other; and
forming openings corresponding to a pattern to be produced by vapor deposition in a plurality of rows lengthwise and crosswise in the resin plate by emitting laser from the metal mask side.
10. A method for producing an organic semiconductor element,
wherein the vapor deposition mask according to claim 1 is used.
11. The vapor deposition mask according to claim 2 ,
wherein a sectional shape of the opening has broadening toward a vapor deposition source direction.
12. The vapor deposition mask according to claim 2 ,
wherein a sectional shape of the slit has broadening toward the vapor deposition source direction.
13. The vapor deposition mask according to claim 3 ,
wherein a sectional shape of the slit has broadening toward the vapor deposition source direction.
14. The vapor deposition mask according to claim 2 ,
wherein a sectional shape of an entire opening formed by the slit of the metal mask and the opening of the resin mask presents a step shape.
15. The vapor deposition mask according to claim 3 ,
wherein a sectional shape of an entire opening formed by the slit of the metal mask and the opening of the resin mask presents a step shape.
16. The vapor deposition mask according to claim 4 ,
wherein a sectional shape of an entire opening formed by the slit of the metal mask and the opening of the resin mask presents a step shape.
17. The vapor deposition mask according to claim 2 ,
wherein a barrier layer is provided on end surfaces forming the opening of the resin mask.
18. The vapor deposition mask according to claim 3 ,
wherein a barrier layer is provided on end surfaces forming the opening of the resin mask.
19. The vapor deposition mask according to claim 4 ,
wherein a barrier layer is provided on end surfaces forming the opening of the resin mask.
20. The vapor deposition mask according to claim 5 ,
wherein a barrier layer is provided on end surfaces forming the opening of the resin mask.