IP Library Granted Patent US 9,108,848
Granted Patent B2
US 9,108,848 · App. 12/923,428 · Granted Aug 18, 2015

Methods of manufacturing and transferring larger-sized graphene

Inventors: Yun-sung Woo (Suwon-si, KR); David Seo (Yongin-si, KR); Su-kang Bae (Suwon-si, KR); Sun-ae Seo (Hwaseong-si, KR); Hyun-jong Chung (Hwaseong-si, KR); Sae-ra Kang (Asan-si, KR); Jin-seong Heo (Suwon-si, KR); Myung-hee Jung (Seongnam-si, KR)
Assignees: Samsung Electronics Co., Ltd.; Sungkyunkwan University Foundation For Corporate Collaboration
C01B31/0206B82Y30/00B82Y40/00Y10T156/1041
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Quick Facts
Patent No.
US 9,108,848
App. No.
12/923,428
Granted
Aug 18, 2015
Kind
B2
Abstract

Example embodiments relate to methods of manufacturing and transferring a larger-sized graphene layer. A method of transferring a larger-sized graphene layer may include forming a graphene layer, a protection layer, and an adhesive layer on a substrate and removing the substrate. The graphene layer may be disposed on a transferring substrate by sliding the graphene layer onto the transferring substrate.

Claims (31)

1. A method of transferring a larger-sized graphene, comprising:

forming a graphene layer on a substrate;

sequentially forming a protection layer and an adhesive layer on the graphene layer;

removing the substrate;

disposing the graphene layer on a transferring substrate with a contact solution layer; and

removing the adhesive layer and the protection layer,

wherein the disposing includes coating the contact solution layer on a surface of the transferring substrate, the surface facing the graphene layer; and sliding the graphene layer onto the transferring substrate via the contact solution layer.

2. The method of claim 1 , further comprising:

forming a catalyst layer on the substrate prior to forming the graphene layer.

3. The method of claim 2 , wherein removing the substrate includes:

weakening an adhesion between the catalyst layer and the substrate; and

separating the substrate from the catalyst layer, the graphene layer, the protection layer, and the adhesive layer.

4. The method of claim 3 , wherein weakening the adhesion between the catalyst layer and the substrate includes penetrating a hydrophilic liquid into a gap between the catalyst layer and the substrate.

5. The method of claim 2 , further comprising:

removing the catalyst layer after removing the substrate.

6. The method of claim 1 , wherein the protection layer includes a material selected from the group consisting of poly methyl methacrylate (PMMA), photoresist (PR), electron resist (ER), SiO x , and AlO x .

7. The method of claim 1 , wherein the adhesive layer includes a material selected from the group consisting of adhesive tape, glue, epoxy resin, thermal release tape, and water-soluble tape.

8. The method of claim 1 , wherein removing the substrate includes etching the substrate.

9. The method of claim 1 , wherein the contact solution layer includes a material selected from the group consisting of deionized water, isopropyl alcohol, ethanol, methanol, and mineral oil.

10. The method of claim 1 , further comprising:

evaporating the contact solution layer by heating the transferring substrate.

11. The method of claim 1 , further comprising:

cutting an exposed surface of the substrate to form a cutting line after forming the protection layer and the adhesive layer on the graphene layer; and

contacting a hydrophilic liquid to the cutting line.

12. The method of claim 11 , further comprising:

forming a catalyst layer on the substrate prior to forming the graphene layer; and

removing the catalyst layer after removing the substrate.

13. The method of claim 11 , wherein the adhesive layer includes a material selected from the group consisting of adhesive tape, glue, epoxy resin, thermal release tape, and water-soluble tape.

14. The method of claim 1 , wherein the graphene layer is formed on the substrate by chemical vapor deposition.

15. The method of claim 1 , wherein a majority of an upper surface of the transferring substrate is coated with the contact solution layer.

16. The method of claim 1 , wherein the graphene layer contacts the contact solution layer on the transferring substrate before contacting the transferring substrate.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 21, 2010
From: WOO, YUN-SUNG; SEO, DAVID; BAE, SU-KANG; SEO, SUN-AE; CHUNG, HYUN-JONG; KANG, SAE-RA; HEO, JIN-SEONG; JUNG, MYUNG-HEE
To: SAMSUNG ELECTRONICS CO., LTD.; SUNGKYUNKWAN UNIVERSITY FOUNDATION FOR CORPORATE COLLABORATION
Reel/Frame 025059/0057 →
Priority Claims (1)
KR 10-2009-0109283 · Nov 12, 2009 · national
Continuity (1)
Related Publication 20110108521A1 · May 12, 2011