Black curable composition, light-shielding color filter, light-shielding film and method for manufacturing the same, wafer level lens, and solid-state imaging device
A black curable composition for a wafer level lens is provided which exhibits excellent developability during formation of a pattern and imparts excellent adhesion with a lens to a formed light-shielding film. The black curable composition contains an inorganic pigment, a specific dispersion resin, a polymerization initiator, and a polymerizable compound. The inorganic pigment is preferably titanium black.
1. A black curable composition for a wafer level lens, comprising:
(A1) an inorganic pigment;
(B1) a dispersion resin having a phosphoric acid group or a sulfonic acid group in a molecule thereof;
(C1) a polymerization initiator; and
(D1) a polymerizable compound,
wherein (i) the (B1) dispersion resin comprises a copolymer of a monomer (b1-1) having a phosphoric acid group or a sulfonic acid group with a macromonomer (b1-2) having a weight average molecular weight of from 1,000 to 30,000; or (ii) the (B1) dispersion resin comprises a resin that has a polyether structure in the main chain thereof and is represented by the following Formula (I):
wherein, in Formula (I), R A represents a molecular chain which has a number average molecular weight of from 500 to 30,000 and which is a polyether; and y represents 1 or 2.
2. The black curable composition according to claim 1 , wherein the (A1) inorganic pigment comprises titanium black.
3. The black curable composition according to claim 1 , further comprising (E) an organic pigment.
4. A wafer level lens, comprising, at a peripheral portion of a lens that is present on a substrate, a light-shielding section obtained using a black curable composition, the black curable composition comprising:
(A1) an inorganic pigment;
(B1) a dispersion resin having a phosphoric acid group or a sulfonic acid group in a molecule thereof;
(C1) a polymerization initiator; and
(D1) a polymerizable compound,
wherein (i) the (B1) dispersion resin comprises a copolymer of a monomer (b1-1) having a phosphoric acid group or a sulfonic acid group with a macromonomer (b1-2) having a weight average molecular weight of from 1,000 to 30,000; or (iii) the (B1) dispersion resin comprises a resin that has a polyether structure or a polyester structure in the main chain thereof and is represented by the following Formula (I):
wherein, in Formula (I), R A represents a molecular chain which has a number average molecular weight of from 500 to 30,000 and which is selected from a polyether or a polyester; and y represents 1 or 2.
5. A black curable composition for formation of a light-shielding film, comprising:
(A2) an inorganic pigment;
(B2) a dispersion resin which has at least one of a phosphoric acid group or a sulfonic acid group in a molecule thereof and has an acid value of from 10 mgKOH/g to 100 mgKOH/g;
(C2) a polymerization initiator; and
(D2) a polymerizable compound,
wherein the light-shielding film blocks infrared light and is provided on one surface of a silicon substrate having an imaging device section on an opposite surface thereof,
wherein (i) the (B2) dispersion resin comprises a copolymer of a monomer (b2-1) having a phosphoric acid group or a sulfonic acid group with a macromonomer (b2-2) having a weight average molecular weight of from 1,000 to 30,000; or (ii) the (B2) dispersion resin comprises a resin that has a polyether structure in the main chain thereof and is represented by the following Formula (I):
wherein, in Formula (I), R A represents a molecular chain which has a number average molecular weight of from 500 to 30,000 and which is a polyether; and y represents 1 or 2.
6. The black curable composition according to claim 5 , wherein the (A2) inorganic pigment comprises titanium black.
7. The black curable composition according to claim 5 , wherein the (B2) dispersion resin has an acid value of from 20 mgKOH/g to 70 mgKOH/g.
8. The black curable composition according to claim 5 , wherein the (C2) polymerization initiator is an oxime ester compound or a hexaarylbiimidazole compound.
9. The black curable composition according to claim 6 , wherein the titanium black as the (A2) inorganic pigment has an average primary particle diameter of from 30 nm to 65 nm.
10. The black curable composition according to claim 5 , wherein the content of the (B2) dispersion resin in terms of mass ratio is from 0.20 to 0.40 relative to the (A2) inorganic pigment.
11. A light-shielding film, which is formed using a black curable composition on one surface of a silicon substrate having an imaging device section on an opposite surface thereof, the black curable composition comprising:
(A2) an inorganic pigment;
(B2) a dispersion resin which has at least one of a phosphoric acid group or a sulfonic acid group in a molecule thereof and has an acid value of from 10 mgKOH/g to 100 mgKOH/g;
(C2) a polymerization initiator; and
(D2) a polymerizable compound,
wherein the light-shielding film blocks infrared light and is provided on one surface of a silicon substrate having an imaging device section on an opposite surface thereof,
wherein (i) the (B2) dispersion resin comprises a copolymer of a monomer (b2-1) having a phosphoric acid group or a sulfonic acid group with a macromonomer (b2-2) having a weight average molecular weight of from 1,000 to 30,000; or (iii) the (B2) dispersion resin comprises a resin that has a polyether structure or a polyester structure in the main chain thereof and is represented by the following Formula (I):
wherein, in Formula (I), R A represents a molecular chain which has a number average molecular weight of from 500 to 30,000 and which is selected from a polyether or a polyester; and y represents 1 or 2.
12. A solid-state imaging device, comprising the light-shielding film according to claim 11 on one surface of a silicon substrate having an imaging device section on an opposite surface thereof.
13. The solid-state imaging device according to claim 12 , comprising:
a silicon substrate having an imaging device section on one surface thereof;
a metal electrode provided on an opposite surface of the silicon substrate and electrically connected with the imaging device section; and
the light-shielding film according to claim 11 , which is provided on the surface of the silicon substrate having the metal electrode provided thereon, and which is patterned so that at least a part of the metal electrode is exposed.
14. The solid-state imaging device according to claim 13 , wherein a solder resist is provided between the metal electrode and the light-shielding film.
15. A method for manufacturing a light-shielding film, comprising:
applying a black curable composition on one surface of a silicon substrate having an imaging device section on an opposite surface thereof to form a black curable composition layer;
subjecting the black curable composition layer to pattern exposure; and
developing the black curable composition layer after exposure to form a pattern, wherein the black curable composition comprises:
(A2) an inorganic pigment;
(B2) a dispersion resin which has at least one of a phosphoric acid group or a sulfonic acid group in a molecule thereof and has an acid value of from 10 mgKOH/g to 100 mgKOH/g;
(C2) a polymerization initiator; and
(D2) a polymerizable compound,
wherein the light-shielding film blocks infrared light and is provided on one surface of a silicon substrate having an imaging device section on an opposite surface thereof,
wherein (i) the (B2) dispersion resin comprises a copolymer of a monomer (b2-1) having a phosphoric acid group or a sulfonic acid group with a macromonomer (b2-2) having a weight average molecular weight of from 1,000 to 30,000; or (iii) the (B2) dispersion resin comprises a resin that has a polyether structure or a polyester structure in the main chain thereof and is represented by the following Formula (I):
wherein, in Formula (I), R A represents a molecular chain which has a number average molecular weight of from 500 to 30,000 and which is selected from a polyether or a polyester; and y represents 1 or 2.
16. A black curable composition, comprising:
(A3) an inorganic pigment;
(B3) a chain resin comprising a solvent-compatible moiety and a pigment-adsorbing moiety having a basic group, and not comprising an acidic group, the chain resin having an amine value of from 75 mgKOH/g to 150 mgKOH/g;
(C3) a polymerization initiator; and
(D3) a polymerizable compound.
17. The black curable composition according to claim 16 , wherein the (A3) inorganic pigment comprises titanium black.
18. The black curable composition according to claim 16 , wherein the solvent-compatible moiety comprises repeating units having an I/O value in a range from 0.05 to 1.50 in an amount of 80% by mass or more.
19. The black curable composition according to claim 16 , wherein the solvent-compatible moiety comprises a repeating unit represented by the following Formula (I-A) or the following Formula (I-B):
wherein, in Formula (I-A), R 1 represents an alkoxy group, a cycloalkoxy group, or an aryloxy group; and R 2 represents a hydrogen atom, a halogen atom, or an alkyl group:
wherein, in Formula (I-B), R 3 represents an aryl group; and R 4 represents a hydrogen atom or an alkyl group.
20. The black curable composition according to claim 16 , wherein the (C3) polymerization initiator is an oxime ester compound or a hexaarylbiimidazole compound.
21. The black curable composition according to any one of claims 16 to 20 , further comprising (E3) an alkali-soluble resin that is other than the (B3) chain resin.
22. The black curable composition according to claim 16 , further comprising (F3) an organic pigment.
23. A light-shielding color filter for a solid-state imaging device, comprising the black curable composition according to claim 16 .
24. A solid-state imaging device, comprising the light-shielding color filter for a solid-state imaging device according to claim 23 .
25. A wafer level lens, comprising, at a peripheral portion of a lens present on a substrate, a light-shielding film obtained using the black curable composition according to claim 16 .
26. An infrared light-shielding film, which is formed, using the black curable composition according to claim 16 , and on a silicon substrate having an imaging device section, on an opposite surface to a surface on which the imaging device is provided.
27. A solid-state imaging device, comprising the infrared light-shielding film according to claim 26 provided on a silicon substrate having an imaging device section, at an opposite surface to a surface on which the imaging device is provided.
28. A method for manufacturing an infrared light-shielding film, comprising:
applying the black curable composition according to claim 16 to a silicon substrate having an imaging device section, on an opposite surface to a surface on which the imaging device is provided, to form a photosensitive layer;
subjecting the photosensitive layer to pattern exposure; and
developing the photosensitive layer after exposure to form a pattern.
29. The black curable composition according to claim 16 , wherein the chain resin is a block copolymer.