Electronic devices and methods of making the same using solution processing techniques

1. An organic thin film transistor comprising:

an electronic substrate comprising circuit elements, the circuit elements of the electronic substrate comprising source and drain electrodes, a channel region being defined between the source and drain electrodes;

a double bank well-defining structure disposed over the source and drain electrodes, the double bank well-defining structure comprising a first layer of insulating material and a second layer of insulating material thereover, the second layer of insulating material having a lower wettability than the first layer of insulating material, both the first layer of insulating material and the second layer of insulating material being exposed in wells defined by the double bank well-defining structure, the first layer of insulating material defining bottom portions of the wells and the second layer of insulating material defining top portions of the wells; and

organic semiconductive material disposed in the wells defined by the double bank well-defining structure, wherein the first layer of insulating material comprises an organic polymer and the second layer of insulating material comprises a fluorinated organic polymer having inherently low wettability.

2. An organic thin film transistor according to claim 1 , wherein the organic thin film transistor is a bottom-gate organic thin film transistor and the electronic substrate further comprises a gate electrode with a gate dielectric disposed thereover, the source and drain electrodes being disposed over the gate dielectric.

3. An organic thin film transistor according to claim 1 , wherein the second layer of insulating material has a contact angle of greater than 80°.

4. An organic thin film transistor according to claim 3 , wherein the second layer of insulating material has a contact angle of greater than 100°.

5. An organic thin film transistor according to claim 1 , wherein the double bank well-defining structure comprises a layer of adhesive material disposed between the first and second layers.

6. An organic thin film transistor according to claim 1 , wherein the first and second layers of the double bank well-defining structure define a step structure around each of the wells such that an edge of the first layer is around the well and an edge of the second layer is stepped back from the well.

7. An organic thin film transistor according to claim 1 , wherein the fluorinated polymer is poly-1,1,2,4,4,5,5,6,7,7-decafluoro-3-oxa-1,6-heptadiene.

8. A method of manufacturing an organic thin film transistor, the method comprising:

providing an electronic substrate comprising circuit elements, the circuit elements of the electronic substrate comprising source and drain electrodes, a channel region being defined between the source and drain electrodes;

forming a double bank well-defining structure over the source and drain electrodes, the double bank well-defining structure comprising a first layer of insulating material and a second layer of insulating material thereover, the second layer of insulating material having a lower wettability than the first layer of insulating material, both the first layer of insulating material and the second layer of insulating material being exposed in wells defined by the double bank well-defining structure, the first layer of insulating material defining bottom portions of the wells and the second layer of insulating material defining top portions of the wells; and

depositing a solution of organic semiconductive material in the wells defined by the double bank well-defining structure,

wherein the first layer of insulating material comprises an organic polymer and the second layer of insulating material comprises a fluorinated organic polymer and is deposited from a fluorinated solvent,

wherein the method further comprises cleaning after forming the double bank well-defining structure and prior to depositing the solution of organic material in the wells defined by the double bank well-defining structure.

9. A method according to claim 8 , comprising depositing the organic semiconductive material in an organic solvent.

10. A method according to claim 8 , comprising depositing a conductive organic material in the wells prior to depositing the organic semiconductive material thereon.

11. A method according to claim 10 , comprising depositing the conductive organic material from an aqueous solution.

12. A method according to claim 8 , wherein the second layer of insulating material has a contact angle of greater than 80°.

13. A method according to claim 12 , wherein the second layer of insulating material has a contact angle of greater than 100°.

14. A method according to claim 8 , comprising subjecting the double bank well-defining structure to baking prior to depositing the solution of organic material in wells defined by the double bank well-defining structure.

15. A method according to claim 14 , comprising baking the double bank well-defining structure prior to depositing the solution of organic material in wells defined by the double bank well-defining structure at a temperature in the range 150 to 250° C.

16. A method according to claim 14 , comprising baking in an inert atmosphere.

17. A method according to claim 14 , comprising depositing a conductive organic material in the wells prior to depositing the organic semiconductive material thereon, and performing the baking step after depositing the organic conductive material and prior to depositing the organic semiconductive material.

18. A method according to claim 14 , comprising baking the double bank well-defining structure prior to depositing the solution of organic material in wells defined by the double bank well-defining structure at a temperature in the range 170 to 210° C.

19. A method according to claim 14 , comprising baking the double bank well-defining structure prior to depositing the solution of organic material in wells defined by the double bank well-defining structure at a temperature in the range 180 to 200° C.

20. A method according to claim 8 , comprising subjecting the double bank well-defining structure to baking after cleaning and prior to depositing the solution of organic material in wells defined by the double bank well-defining structure.

21. A method according to claim 8 , wherein the fluorinated polymer is poly-1,1,2,4,4,5,5,6,7,7-decafluoro-3-oxa-1,6-heptadiene.

22. An organic thin film transistor comprising:

a substrate comprising circuit elements, the circuit elements of the electronic substrate comprising source and drain electrodes, a channel region being defined between the source and drain electrodes;

a double bank well-defining structure disposed over the source and drain electrodes, the double bank well-defining structure comprising a first layer of insulating material and a second layer of insulating material thereover, the second layer of insulating material having a lower wettability than the first layer of insulating material, both the first layer of insulating material and the second layer of insulating material being exposed in wells defined by the double bank well-defining structure, the first layer of insulating material defining bottom portions of the wells and the second layer of insulating material defining top portions of the wells; and

organic material disposed in the wells defined by the double bank well-defining structure, the second layer of insulating material having a contact angle of greater than 80°, wherein the first layer of insulating material comprises an organic polymer and the second layer of insulating material comprises a fluorinated organic polymer having inherently low wettability.

23. An organic thin film transistor according to claim 22 , wherein the fluorinated polymer is poly-1,1,2,4,4,5,5,6,7,7-decafluoro-3-oxa-1,6-heptadiene.

24. A method suitable for manufacturing an organic thin film transistor, the method comprising:

providing a substrate comprising circuit elements, the circuit elements of the electronic substrate comprising source and drain electrodes, a channel region being defined between the source and drain electrodes;

forming a double bank well-defining structure over the source and drain electrodes, the double bank well-defining structure comprising a first layer of insulating material and a second layer of insulating material thereover, the second layer of insulating material having a lower wettability than the first layer of insulating material, both the first layer of insulating material and the second layer of insulating material being exposed in wells defined by the double bank well-defining structure, the first layer of insulating material defining bottom portions of the wells and the second layer of insulating material defining top portions of the wells; and

depositing a solution of organic material in the wells defined by the double bank well-defining structure, the second layer of insulating material having a contact angle of greater than 80°,

wherein the first layer of insulating material comprises an organic polymer and the second layer of insulating material comprises a fluorinated organic polymer and is deposited from a fluorinated solvent,

wherein the method further comprises cleaning after forming the double bank well-defining step and prior to depositing the solution of organic material in the wells defined by the double bank well-defining structure.

25. A method of manufacturing organic thin film transistor, the method comprising:

providing a substrate comprising circuit elements, the circuit elements of the electronic substrate comprising source and drain electrodes, a channel region being defined between the source and drain electrodes;

forming a double bank well-defining structure over the source and drain electrodes, the double bank well-defining structure comprising a first layer of insulating material and a second layer of insulating material thereover, the second layer of insulating material having a lower wettability than the first layer of insulating material, both the first layer of insulating material and the second layer of insulating material being exposed in wells defined by the double bank well-defining structure, the first layer of insulating material defining bottom portions of the wells and the second layer of insulating material defining top portions of the wells; and

depositing a solution of organic material in the wells defined by the double bank well-defining structure, wherein the first layer of insulating material comprises an organic polymer and the second layer of insulating material comprises a fluorinated organic polymer that is deposited from a fluorinated solvent,

wherein the method further comprises cleaning after forming the double bank well-defining step and prior to depositing the solution of organic material in the wells defined by the double bank well-defining structure.

26. An organic thin film transistor comprising:

a substrate comprising circuit elements, the circuit elements of the electronic substrate comprising source and drain electrodes, a channel region being defined between the source and drain electrodes;

a double bank well-defining structure disposed over the source and drain electrodes, the double bank well-defining structure comprising a first layer of insulating material and a second layer of insulating material thereover, the second layer of insulating material having a lower wettability than the first layer of insulating material, both the first layer of insulating material and the second layer of insulating material being exposed in wells defined by the double bank well-defining structure, the first layer of insulating material defining bottom portions of the wells and the second layer of insulating material defining top portions of the wells; and

organic material disposed in the wells defined by the double bank well-defining structure, wherein the double bank well-defining structure comprises a layer of adhesive material disposed between the first and second layers, wherein the first layer of insulating material comprises an organic polymer and the second layer of insulating material comprises a fluorinated organic polymer having inherently low wettability.

27. A method of manufacturing an organic thin film transistor, the method comprising:

providing a substrate comprising circuit elements, the circuit elements of the electronic substrate comprising source and drain electrodes, a channel region being defined between the source and drain electrodes;

forming a double bank well-defining structure over the source and drain electrodes, the double bank well-defining structure comprising a first layer of insulating material and a second layer of insulating material thereover, the second layer of insulating material having a lower wettability than the first layer of insulating material, both the first layer of insulating material and the second layer of insulating material being exposed in wells defined by the double bank well-defining structure, the first layer of insulating material defining bottom portions of the wells and the second layer of insulating material defining top portions of the wells; and

depositing a solution of organic material in the wells defined by the double bank well-defining structure, wherein the double bank well-defining structure is subjected to a baking step prior to depositing the solution of organic material in the wells defined by the double bank well-defining structure,

wherein the first layer of insulating material comprises an organic polymer and the second layer of insulating material comprises a fluorinated organic polymer and is deposited from a fluorinated solvent,

wherein the method further comprises cleaning after forming the double bank well-defining step and prior to depositing the solution of organic material in the wells defined by the double bank well-defining structure.

28. An organic thin film transistor comprising:

a substrate comprising circuit elements, the circuit elements of the electronic substrate comprising source and drain electrodes, a channel region being defined between the source and drain electrodes;

a double bank well-defining structure disposed over the source and drain electrodes, the double bank well-defining structure comprising a first layer of insulating material and a second layer of insulating material thereover, the second layer of insulating material having a lower wettability than the first layer of insulating material, both the first layer of insulating material and the second layer of insulating material being exposed in wells defined by the double bank well-defining structure, the first layer of insulating material defining bottom portions of the wells and the second layer of insulating material defining top portions of the wells; and

organic material disposed in the wells defined by the double bank well-defining structure, wherein the first and second layers of the double bank well-defining structure define a step structure around each of the wells such that an edge of the first layer is around the well and an edge of the second layer is stepped back from the well, wherein the first layer of insulating material comprises an organic polymer and the second layer of insulating material comprises a fluorinated organic polymer having inherently low wettability.