Transistor having an oxide semiconductor film
View Patent ↗To provide a thin film transistor which has high operation speed and in which a large amount of current can flow when the thin film transistor is on and off-state current at the time when the thin film transistor is off is extremely reduced. The thin film transistor is a vertical thin film transistor in which a channel formation region is formed using an oxide semiconductor film in which hydrogen or an OH group contained in the oxide semiconductor is removed so that hydrogen is contained in the oxide semiconductor at a concentration of lower than or equal to 5×10 19 /cm 3 , preferably lower than or equal to 5×10 18 /cm 3 , more preferably lower than or equal to 5×10 17 /cm 3 , and the carrier concentration is lower than or equal to 5×10 14 /cm 3 , preferably lower than or equal to 5×10 12 /cm 3 .
1. A semiconductor device comprising:
an oxide semiconductor film;
a gate insulating film over the oxide semiconductor film; and
a first gate electrode and a second gate electrode, each of the first gate electrode and the second gate electrode facing a side surface of the oxide semiconductor film with the gate insulating film interposed therebetween,
wherein the first gate electrode and the second gate electrode are electrically connected to each other, and
wherein the oxide semiconductor film comprises indium and zinc.
2. The semiconductor device according to claim 1 , wherein the first gate electrode is positioned on a side opposite to the second gate electrode with the oxide semiconductor film interposed.
3. The semiconductor device according to claim 1 , wherein the oxide semiconductor film further comprises gallium.
4. The semiconductor device according to claim 1 , wherein the oxide semiconductor film is intrinsic or substantially intrinsic.
5. The semiconductor device according to claim 1 , wherein a carrier concentration of the oxide semiconductor film is lower than or equal to 5×10 14 cm −3 .
6. The semiconductor device according to claim 1 , wherein a concentration of hydrogen in the oxide semiconductor film is lower than or equal to 5×10 19 cm −3 .
7. A semiconductor device comprising:
an oxide semiconductor film;
a gate insulating film over the oxide semiconductor film; and
a first gate electrode and a second gate electrode, each of the first gate electrode and the second gate electrode facing a side surface of the oxide semiconductor film with the gate insulating film interposed therebetween,
wherein the first gate electrode and the second gate electrode are electrically connected to each other,
wherein the oxide semiconductor film comprises indium and zinc, and
wherein a degree of crystallization in the oxide semiconductor film is 90% or more.
8. The semiconductor device according to claim 7 , wherein the first gate electrode is positioned on a side opposite to the second gate electrode with the oxide semiconductor film interposed.
9. The semiconductor device according to claim 7 , further comprising a source electrode and a drain electrode,
wherein the oxide semiconductor film is positioned the source electrode,
wherein the drain electrode is positioned over the oxide semiconductor film, and
wherein the gate insulating film is positioned over the drain electrode.
10. The semiconductor device according to claim 7 , wherein the oxide semiconductor film further comprises gallium.
11. The semiconductor device according to claim 7 , wherein the oxide semiconductor film is intrinsic or substantially intrinsic.
12. The semiconductor device according to claim 7 , wherein a carrier concentration of the oxide semiconductor film is lower than or equal to 5×10 14 cm −3 .
13. The semiconductor device according to claim 7 , wherein a concentration of hydrogen in the oxide semiconductor film is lower than or equal to 5×10 19 cm −3 .
14. A semiconductor device comprising:
an insulating film over a substrate;
a source electrode over the insulating film;
an oxide semiconductor film over the source electrode;
a drain electrode over the oxide semiconductor film;
a gate insulating film over the drain electrode; and
a first gate electrode and a second gate electrode, each of the first gate electrode and the second gate electrode facing a side surface of the oxide semiconductor film with the gate insulating film interposed therebetween,
wherein the first gate electrode and the second gate electrode are electrically connected to each other, and
wherein the oxide semiconductor film comprises indium and zinc.
15. The semiconductor device according to claim 14 , wherein the first gate electrode is positioned on a side opposite to the second gate electrode with the oxide semiconductor film interposed.
16. The semiconductor device according to claim 14 , wherein the oxide semiconductor film further comprises gallium.
17. The semiconductor device according to claim 14 , wherein the oxide semiconductor film is intrinsic or substantially intrinsic.
18. The semiconductor device according to claim 14 , wherein a carrier concentration of the oxide semiconductor film is lower than or equal to 5×10 14 cm −3 .
19. The semiconductor device according to claim 14 , wherein a concentration of hydrogen in the oxide semiconductor film is lower than or equal to 5×10 19 cm −3 .