Multilayer ceramic electronic component and mounting board therefor
There are provided a multilayer ceramic electronic component and a mounting board therefor, the multilayer ceramic electronic component including a ceramic body having a hexahedral shape, including dielectric layers, and satisfying T/W>1.0 when a length of the ceramic body is defined as L, a width of a lower surface of the ceramic body is defined as W, and a thickness of the ceramic body is defined as T, and first and second internal electrodes stacked in the ceramic body so as to face each other, having the respective dielectric layers interposed therebetween, wherein when a width of an upper surface of the ceramic body is defined as Wa, 0.800≦Wa/W≦0.985 is satisfied.
1. A multilayer ceramic electronic component, comprising:
a ceramic body having a hexahedral shape, including dielectric layers, and satisfying T/W>1.0 when a length of the ceramic body is defined as L, a width of a lower surface of the ceramic body is defined as W, and a thickness of the ceramic body is defined as T; and
first and second internal electrodes stacked in the ceramic body so as to face each other, having the respective dielectric layers interposed therebetween,
wherein when a width of an upper surface of the ceramic body is defined as Wa, 0.800≦Wa/W≦0.985 is satisfied.
2. The multilayer ceramic electronic component of claim 1 , wherein when an average thickness of the dielectric layers is defined as td, 0.1 μm≦td≦0.6 μm is satisfied.
3. The multilayer ceramic electronic component of claim 1 , wherein the first and second internal electrodes respectively have a thickness of 0.6 μm or less.
4. The multilayer ceramic electronic component of claim 1 , wherein the dielectric layers are stacked in an amount of 500 layers or more.
5. The multilayer ceramic electronic component of claim 1 , wherein the first and second internal electrodes are stacked in a thickness direction of the ceramic body.
6. A mounting board for a multilayer ceramic electronic component, the mounting board comprising:
a printed circuit board having first and second electrode pads disposed thereon; and
a multilayer ceramic electronic component mounted on the printed circuit board,
wherein the multilayer ceramic electronic component includes: a ceramic body having a hexahedral shape, including dielectric layers, and satisfying T/W>1.0 when a length of the ceramic body is defined as L, a width of a lower surface of the ceramic body is defined as W, and a thickness of the ceramic body is defined as T; and first and second internal electrodes stacked in the ceramic body so as to face each other, having the respective dielectric layers interposed therebetween, and when a width of an upper surface of the ceramic body is defined as Wa, 0.800≦Wa/W≦0.985 is satisfied.
7. The mounting board of claim 6 , wherein when an average thickness of the dielectric layers is defined as td, 0.1 μm≦td≦0.6 μm is satisfied.
8. The mounting board of claim 6 , wherein the first and second internal electrodes respectively have a thickness of 0.6 μm or less.
9. The mounting board of claim 6 , wherein the dielectric layers are stacked in an amount of 500 layers or more.
10. The mounting board of claim 6 , wherein the first and second internal electrodes are stacked in a thickness direction of the ceramic body.