Laser processing method
A laser processing method for performing laser processing to a workpiece. The laser processing method includes: a filament forming step of applying a first pulsed laser beam having a transmission wavelength to the workpiece to thereby form a filament as an optical transmission line in the workpiece so that the filament extends from the surface of the workpiece to be irradiated with the first pulsed laser beam to the inside of the workpiece, the filament having a refractive index higher than that of the workpiece; and a laser processing step of applying a second pulsed laser beam to the filament after performing the filament forming step to thereby transmit the second pulsed laser beam along the filament, thereby processing the workpiece with the second pulsed laser beam.
1. A laser processing method of performing laser processing to a workpiece, comprising:
a filament forming step of applying a first pulsed laser beam having a transmission wavelength to said workpiece to thereby form a filament as an optical transmission line in said workpiece so that said filament extends from the surface of said workpiece to be irradiated with said first pulsed laser beam to the inside of said workpiece, said filament having a refractive index higher than that of said workpiece; and
a laser processing step of applying a second pulsed laser beam to said filament after performing said filament forming step to thereby transmit said second pulsed laser beam along said filament, thereby processing said workpiece with said second pulsed laser beam.
2. The laser processing method according to claim 1 , wherein said first pulsed laser beam to be applied in said filament forming step is focused at a position slightly inside said workpiece from the surface of said workpiece to be irradiated with said first pulsed laser beam.
3. The laser processing method according to claim 1 , wherein said first pulsed laser beam to be applied in said filament forming step is focused by using a focusing lens having a numerical aperture (NA) set to 0.2 to 0.3.
4. The laser processing method according to claim 3 , wherein said first pulsed laser beam is applied at predetermined intervals along a process line in said filament forming step, thereby forming a plurality of filaments arranged at said predetermined intervals along each process line, each filament having a refractive index higher than that of said workpiece.
5. The laser processing method according to claim 4 , wherein said second pulsed laser beam to be applied in said laser processing step is guided along each filament to the inside of said workpiece to thereby form a break layer along each filament.
6. The laser processing method according to claim 1 , wherein said filament forming step forms a plurality of said filaments within said workpiece.
7. The laser processing method according to claim 1 , wherein said workpiece includes a sapphire substrate, and further wherein said filament extends across the entire thickness of said sapphire substrate.
8. The laser processing method according to claim 1 , wherein said workpiece includes a sapphire substrate, and further wherein said filament extends within said sapphire substrate.
9. The laser processing method according to claim 1 , wherein said filament is formed directly below where the first pulsed laser beam has been applied.