IP Library › Granted Patent US 9,117,985
Granted Patent B2
US 9,117,985 · App. 14/546,569 · Granted Aug 25, 2015

Silicone resin composition and an optical semiconductor device

Inventors: Yoshihira Hamamoto (Annaka, JP); Tsutomu Kashiwagi (Annaka, JP)
Assignee: SHIN-ETSU CHEMICAL CO., LTD.
H01L33/56C08L83/14C08G77/52
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Quick Facts
Patent No.
US 9,117,985
App. No.
14/546,569
Granted
Aug 25, 2015
Kind
B2
Abstract

One purpose is to provide a silicone resin composition which provides a cured product having a large Abbe's number and a high brightness. A silicone resin composition including (A-1) an organopolysiloxane having a three-dimensional crosslinked structure, at least two alkenyl groups, and at least one monovalent aromatic hydrocarbon group bonded to a silicon atom, (A-2) a linear organopolysiloxane having alkenyl groups at at least both terminals of a molecular chain and at least one monovalent aromatic hydrocarbon group bonded to a silicon atom, (B-1) a linear organohydrogen polysiloxane having at least one silphenylene skeleton in a molecular chain and hydrosilyl groups at least both terminals of the molecular chain, in an amount such that a ratio of the number of the hydrosilyl groups in component (B-1) to a total number of the alkenyl groups in components (A-1) and (A-2) is 0.5 to 2, and (C) a hydrosilylation catalyst in a catalytic amount.

Claims (18)

1. A silicone resin composition comprising

(A-1) an organopolysiloxane having a three-dimensional crosslinked structure, at least two alkenyl groups, and at least one monovalent aromatic hydrocarbon group bonded to a silicon atom,

(A-2) a linear organopolysiloxane having alkenyl groups at at least both terminals of a molecular chain and at least one monovalent aromatic hydrocarbon group bonded to a silicon atom,

(B-1) a linear organohydrogen polysiloxane having at least one silphenylene skeleton in a molecular chain and hydrosilyl groups at at least both terminals of the molecular chain, in an amount such that a ratio of the number of the hydrosilyl groups in component (B-1) to a total number of the alkenyl groups in components (A-1) and (A-2) is 0.5 to 2, and (C) a hydrosilylation catalyst in a catalytic amount.

2. The silicone resin composition according to claim 1 , wherein component (B-1) is represented by the following general formula (1):

wherein R is, independently of each other, selected from the group consisting of substituted or unsubstituted monovalent aliphatic hydrocarbon groups which have 1 to 10 carbon atoms and may have an unsaturated bond, and monovalent aromatic hydrocarbon groups having 6 to 12 carbon atoms, m is an integer of from 1 to 1,000, n is an integer of from 0 to 300, and the parenthesized repeating units may bond randomly each other or form a block unit.

3. The silicone resin composition according to claim 1 , wherein the number of the monovalent aromatic hydrocarbon group bonded to a silicone atom in the linear oragnopolysiloxane (A-2) is 5 to 45%, relative to a total number of the substituents each bonded to a silicon atom.

4. The silicone resin composition according to claim 1 , wherein the organopolysiloxane (A-1) is represented by the following average compositional formula (2):

R1aR2bR3cSiO(4-a-b-c)/2  (2)

wherein R1 is, independently of each other, a substituted or unsubstituted monovalent aliphatic hydrocarbon group which has 1 to 10 carbon atoms, R2 is, independently of each other, a monovalent aromatic hydrocarbon group having 6 to 12 carbon atoms, R3 is, independently of each other, an alkenyl group having 2 to 8 carbon atoms, a is the number of 0.4 to 1, b is the number of 0.1 to 0.5, and c is the number of 0.05 to 0.5, provided that a total of a, b and c is 0.5 to 2.

5. The silicone resin composition according to claim 1 , wherein the composition further comprises (B-2) an organohydrogenpolysiloxane having at least two hydrosilyl groups and no silphenylene skeleton, in an amount such that a ratio of a total number of the hydrosilyl groups in components (B-1) and (B-2) to a total number of the alkenyl groups in components (A-1) and (A-2) is 0.5 to 2.

6. The silicone resin composition according to claim 5 , wherein the organohydrogenpolysiloxane (B-2) is represented by the following general formula (3):

wherein R6 is, independently of each other, selected from the group consisting of substituted or unsubstituted monovalent aliphatic hydrocarbon groups which have 1 to 10 carbon atoms and may have an unsaturated bond, and monovalent aromatic hydrocarbon groups having 6 to 12 carbon atoms, R′ is, independently of each other, selected from the aforementioned groups defined for R6 or a group represented by the following (4):

wherein R″ is, independently of each other, a hydrogen atom or is selected from the aforementioned groups defined for R6, the parenthesized repeating units may bond randomly each other or form a block unit, x is an integer of from 0 to 1,000, y is an integer of from 0 to 1,000, and s is an integer of from 0 to 1,000, provided that a total of x, y and s is 1 to 1,000.

7. The silicone resin composition according to claim 1 , wherein the composition further comprises an adhesion-imparting agent (D).

8. The silicone resin composition according to claim 1 , wherein the composition further comprises an antioxidant (E).

9. The silicone resin composition according to claim 8 , wherein the antioxidant (E) is a hindered phenol antioxidant.

10. An optical semiconductor device provided with a cured product obtained by curing the silicone resin composition according to claim 1 .

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 18, 2014
From: HAMAMOTO, YOSHIHIRA; KASHIWAGI, TSUTOMU
To: SHIN-ETSU CHEMICAL CO., LTD.
Reel/Frame 034200/0322 →
Continuity (1)
Related Publication 20150144987A1 · May 28, 2015