Apparatus and method for placing and mounting solder balls on an integrated circuit substrate
An apparatus for placing and mounting solder balls on an integrated circuit substrate contains: a fixture, a vacuuming device, a guiding plate, and a storage tank. The fixture includes a plurality of first grooves defined therein, the vacuuming device is disposed over the fixture and includes a vacuum chamber which has an air pore so that when air is drawn out of the vacuum chamber via the air pore, a plurality of solder balls are attached, and when the air is fed into the vacuum chamber from the air pore, the plurality of solder balls are released. The guiding plate is secured below the fixture, and the storage tank is arranged below the guiding plate and is applied to accommodate the plurality of solder balls. Thereby, a production yield of placing and mounting the plurality of solder balls on an integrated circuit substrate is enhanced.
1. A method for placing and mounting solder balls on an integrated circuit substrate comprises steps of:
A. lifting a guiding plate and a storage tank upwardly to connect with a fixture;
B. rotating a turning assembly counterclockwisely, after the guiding plate and the storage tank are connected with the fixture;
C. drawing air out of a vacuum chamber via an air pore by means of a vacuuming device so as to attach a plurality of solder balls 1 , when the turning assembly rotates counterclockwisely, wherein after the turning assembly rotates counterclockwisely over 180 degrees, the plurality of solder balls in the storage tank move leftward;
D. rotating the turning assembly clockwisely after the plurality of solder balls in the storage tank move leftward;
E. moving the plurality of solder balls in storage tank rightward after the turning assembly rotates clockwisely over 180 degrees;
F. placing the plurality of solder balls into a plurality of apertures of the guiding plate from the storage tank again and rotating the storage tank, the guiding plate, the vacuuming device, and the fixture back to an original angle;
G. moving the guiding plate and the storage tank downwardly so that the guiding plate and the storage tank disconnect from the fixture;
H. horizontally moving the guiding plate and the storage to one side;
I. lifting a substrate;
J. starting to mount the plurality of solder balls;
K. re-feeding air into the vacuum chamber from the air pore of the vacuuming device so as to release the plurality of solder balls onto a flux of the substrate from the fixture;
L. descending the substrate on which the plurality of solder balls are mounted.