IP Library Granted Patent US 9,123,476
Granted Patent B2
US 9,123,476 · App. 13/778,536 · Granted Sep 1, 2015

Tab lead and method of producing the same

Inventors: Hiroshi Hata (Hikone, JP); Takurou Watanabe (Oyama, JP)
Assignee: Showa Denko Packaging Co., Ltd.
H01G11/74H01G11/80H01M2/266H01M2/30H01M2/32H01M10/0585H01M10/0525Y02E60/13
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Quick Facts
Patent No.
US 9,123,476
App. No.
13/778,536
Granted
Sep 1, 2015
Kind
B2
Abstract

A tab lead including a first insulating film made of resin is adhered to one of surfaces of a part of a region of a metal plate in a length direction of the metal plate and a second insulating film made of resin is adhered to the other surface of the part of the region. Both end portions of the first insulating film and both end portions of the second insulating film are integrally welded to each other. First protruding portions protruding outward in a thickness direction of the first insulating film are formed at regions of the first insulating film corresponding to both widthwise side edges of the metal plate and vicinities thereof. Second protruding portions protruding outward in a thickness direction of the second insulating film are formed at regions of the second insulating film corresponding to both widthwise side edges of the metal plate and vicinities thereof.

Claims (19)

1. A tab lead comprising:

a metal plate;

a first insulating film made of resin adhered to one of surfaces of a part of a region of the metal plate in a length direction of the metal plate; and

a second insulating film made of resin adhered to the other of surfaces of the part of the region; wherein

both end portions of the first insulating film and both end portions of the second insulating film are integrally welded to each other,

first protruding portions are formed in the first insulating film to extend along both widthwise side edges of the metal plate or a vicinity thereof so as to protrude outward in a thickness direction of the first insulating film, and

second protruding portions are formed in the second insulating film to extend along both widthwise side edges of the metal plate or a vicinity thereof so as to protrude outward in a thickness direction of the second insulating film.

2. The tab lead as recited in claim 1 , wherein

a first protruding rate calculated by a following calculating formula falls within a range of 1-100%,

first protruding rate (%)={( X−Y )/ Y}× 100,

where “X” (μm) is a maximum thickness of the first protruding portion of the first insulating film, and “Y” (μm) is a thickness of a portion of the first insulating film corresponding to an intermediate portion of the metal plate in a width direction of the metal plate, and

a second protruding rate calculated by a following calculating formula falls within a range of 1-100%,

second protruding rate (%)={( V−W )/ W}× 100,

where “V” (μm) is a maximum thickness of the second protruding portion of the second insulating film, and “W” (μm) is a thickness of a portion of the second insulating film corresponding to the intermediate portion of the metal plate in the width direction of the metal plate.

3. The tab lead as recited in claim 2 , wherein a relationship of 100 μm≦Y≦250 μm and a relationship of 100 μm≦W≦250 μm are met.

4. The tab lead as recited in claim 1 , wherein an apex of the first protruding portion is positioned outside of a widthwise side edge of the metal plate corresponding to the first protruding portion and an apex of the second protruding portion is positioned outside of a widthwise side edge of the metal plate corresponding to the second protruding portion.

5. The tab lead as recited in claim 1 , wherein an intermediate portion of the first insulating film between the first protruding portions defines a first flat portion; and

an intermediate portion of the second insulating film between the second protruding portions defines a second flat portion.

6. The tab lead as recited in claim 1 , wherein no protruding portions are formed elsewhere in the first insulating film or the second insulating film.

Assignments (3)
CHANGE OF NAME Recorded Jul 25, 2023
From: SHOWA DENKO PACKAGING CO., LTD.
To: RESONAC PACKAGING CORPORATION
Reel/Frame 064374/0937 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 5, 2014
From: SHOWA DENKO K.K.
To: SHOWA DENKO PACKAGING CO.
Reel/Frame 032354/0426 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 14, 2013
From: HATA, HIROSHI; WATANABE, TAKUROU
To: SHOWA DENKO PACKAGING CO., LTD.; SHOWA DENKO K.K.
Reel/Frame 030611/0810 →
Priority Claims (1)
JP 2012-43643 · Feb 29, 2012 · national
Continuity (1)
Related Publication 20140072869A1 · Mar 13, 2014