Image sensor

1. An image sensor comprising:

a package having a window;

a sensor chip facing the window, the sensor chip having a pixel region;

a read-out circuit disposed farther from the window than the sensor chip, the read-out circuit being electrically connected to the sensor chip; and

a shielding plate disposed outside the pixel region of the sensor chip, wherein

the shielding plate is configured to block transmission of light, and

the shielding plate is inclined to be closer to a bottom of the package with increasing distance from the sensor chip, the bottom of the package being located at the opposite side of the window.

2. The image sensor according to claim 1 , wherein the shielding plate extends to outside of the read-out circuit in plan view.

3. The image sensor according to claim 1 , wherein the shielding plate is secured to an edge of the sensor chip.

4. The image sensor according to claim 1 , further comprising a relay board disposed under the read-out circuit,

wherein the read-out circuit includes a pad electrode at an area extending from the sensor chip,

the relay board includes an interconnection electrode at an area extending from the sensor chip, and

the shielding plate is secured to an edge of the read-out circuit or an edge of the relay board.

5. The image sensor according to claim 1 , wherein the shielding plate is made of aluminum nitride.

6. The image sensor according to claim 1 , further comprising:

bumps electrically connecting the sensor chip to the read-out circuit, and

an underfill resin filling spaces between the bumps, wherein

the shielding plate is secured by means of a resin serving as a fixing agent, and

the resin is made of the same material as that of the underfill resin.

7. An image sensor comprising:

a package having a window;

a sensor chip facing the window, the sensor chip having a pixel region;

a read-out circuit disposed farther from the window than the sensor chip, the read-out circuit being electrically connected to the sensor chip; and

a shielding plate disposed outside the pixel region of the sensor chip, wherein

the shielding plate is configured to block transmission of light, and

the shielding plate is secured to an edge of the sensor chip.

8. The image sensor according to claim 7 , wherein the shielding plate extends to outside of the read-out circuit in plan view.

9. The image sensor according to claim 7 , wherein the shielding plate is inclined to reflect light entering through the window in a direction away from the sensor chip.

10. The image sensor according to claim 7 , wherein the shielding plate is inclined to be closer to a bottom of the package with increasing distance from the sensor chip, the bottom of the package being located at the opposite side of the window.

11. The image sensor according to claim 7 , further comprising a relay board disposed under the read-out circuit, wherein

the read-out circuit includes a pad electrode at an area extending from the sensor chip,

the relay board includes an interconnection electrode at an area extending from the sensor chip, and

the shielding plate is secured to an edge of the read-out circuit or an edge of the relay board.

12. The image sensor according to claim 7 , wherein the shielding plate is made of aluminum nitride.

13. The image sensor according to claim 7 , further comprising:

bumps electrically connecting the sensor chip to the read-out circuit, and

an underfill resin filling spaces between the bumps, wherein

the shielding plate is secured by means of a resin serving as a fixing agent, and

the resin is made of the same material as that of the underfill resin.