IP Library › Granted Patent US 9,132,791
Granted Patent B2
US 9,132,791 · App. 13/656,255 · Granted Sep 15, 2015

Blind spot monitor assembly

Inventors: Bryan Else Yamasaki (Ann Arbor, MI); Charan Singh Lota (Canton, MI)
Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
B60R16/0239Y10T29/49947
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Quick Facts
Patent No.
US 9,132,791
App. No.
13/656,255
Granted
Sep 15, 2015
Kind
B2
Abstract

A bracket for a vehicle blind spot monitor. The bracket can have upper and bottom members that are spaced apart from each other and connected by a side member. The upper, bottom and side members of the bracket can also form an opening where a blind spot monitor can be located. The bottom member can have a debris-blocking flange that protects or shields the outer radar surface from debris such as rocks, sand, etc., that are thrown up from a road surface towards the blind spot monitor. The bracket can have a plurality of protrusions to guide the blind spot monitor into the bracket opening. The bracket additionally features clips that affix the blind spot monitor to the bracket prior to installation on the vehicle.

Claims (32)

1. An electronics module assembly for mounting to a panel of a vehicle, the panel having a plurality of mounting posts; the electronics module assembly comprising:

an electronics module, having at least one extended flange, the at least one extended flange having at least one module aperture, the at least one module aperture for receiving the mounting post;

a bracket having a generally U shaped opening complementary to a portion of the electronics module for receiving the electronics module and having at least one bracket aperture, the at least one bracket aperture for receiving the mounting post; and

an inner bracket surface having at least one clip for fastening the electronics module to the bracket.

2. The electronics module assembly of claim 1 , further comprising:

the electronics module having at least two parallel planar surfaces spaced apart from one another and joined along a module perimeter, defining a volume; and

the bracket having the generally U shaped opening complementary to a portion of the module perimeter.

3. The electronics module assembly of claim 1 , further comprising:

the U shaped opening having at least one projecting feature that abuts the electronics module.

4. The electronics module assembly of claim 3 , further comprising:

the projecting features abut the electronics module along the module perimeter.

5. The electronics module assembly of claim 1 , further comprising:

the inner bracket surface having at least one locating portion for receiving the extended flange.

6. The electronics module assembly of claim 1 , further comprising:

the bracket apertures are concentric with the module apertures when the electronics module is fastened to the bracket.

7. A method for mounting an electronics module assembly to a panel of a vehicle, the panel having a plurality of mounting posts; the method comprising:

providing an electronics module, having at least one extended flange and having at least one module aperture for receiving the mounting posts;

providing a bracket having a generally U shaped opening complementary to a portion of the electronics module for receiving the electronics module and having at least one bracket aperture for receiving the mounting posts;

providing an inner bracket surface having at least one clip for fastening the electronics module to the bracket to form the electronics module assembly; and

mounting the electronics module assembly to the mounting posts of the panel.

8. The method of claim 7 , further comprising:

providing the U shaped opening having at least one projecting feature that abuts the electronics module;

whereby the electronics module is guided by the projecting feature while being affixed to the bracket.

9. The method of claim 7 , further comprising:

providing the electronics module with at least two parallel planar surfaces spaced apart from one another and joined along a module perimeter, defining a volume;

whereby the projecting features abut the electronics module along the module perimeter.

10. The method assembly of claim 1 , further comprising:

providing the inner bracket surface with at least one locating portion;

whereby the locating portion receives the extended flange.

11. The method of claim 1 , further comprising:

providing bracket apertures that are concentric with the module apertures;

whereby when the electronics module is fastened to the bracket, the mounting posts are inserted through the bracket apertures and the module apertures.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 22, 2015
From: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
To: TOYOTA JIDOSHA KABUSHIKI KAISHA
Reel/Frame 036622/0336 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 30, 2012
From: YAMASAKI, BRYAN ELSE; LOTA, CHARAN SINGH
To: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
Reel/Frame 029211/0898 →
Continuity (1)
Related Publication 20140111950A1 · Apr 24, 2014