Compression and obfuscation of three-dimensional coding
Systems and methods related to three-dimensional coding are disclosed. In one embodiment, a method for encoding data is described that includes generating a pattern in a substrate. The pattern includes elements and each element has one of an aperture or a protrusion. The aperture or protrusion has unique x, y coordinates within the pattern. The method also includes varying a depth of at least one element. The varied depth encodes data.
1. A 3-D code comprising:
a plurality of apertures formed within a substrate, wherein:
each aperture comprises a unique position in the 3-D code relative to each of the other apertures;
each aperture comprises a depth, wherein at least one aperture has a depth that is different from at least one other aperture's depth;
at least one of said plurality of apertures includes a first geometric shape; and
said at least one of said plurality of apertures includes an encoding geometric shape formed on a bottom surface of said at least one aperture; and
the encoding geometric shape encodes information.
2. The 3-D code of claim 1 , wherein the plurality of apertures represent at least two different geometric shapes.
3. The 3-D code of claim 1 , wherein a diameter of each of the plurality of apertures is approximately 20 micrometers or less.
4. The 3-D code of claim 1 , wherein a depth of at least one of the apertures is approximately less than 10 micrometers.
5. The 3-D code of claim 1 , wherein the code is a pin-stamped code and the pin-stamped code comprises at least one aperture having an encoded feature on its bottom surface.
6. The 3-D code of claim 5 , wherein the encoded feature comprises a secondary 3-D code.
7. The 3-D code of claim 1 , wherein the code is too small to be seen by a naked eye.
8. The 3-D code of claim 1 , wherein the code forms part of a microperforated portion of a housing.
9. The 3-D code of claim 1 , wherein at least one aperture comprise a through-hole.
10. The 3-D coding of claim 1 , wherein the code is obscured within one of a printed logo and a printed letter.
11. A method of reading a 3-D code in a substrate, the substrate including a surface, said method comprising:
determining a relative location of a reader and a device having a 3-D code;
orienting the reader relative to the device to enable reading of the 3-D code;
obtaining an image of the 3-D code;
processing the image to determine a relative location of each element of the 3-D code; and
determining a depth of each element of the 3-D code, said depth extending into said substrate below said surface, at least one element of the 3-D code including a different depth from a second element of the 3-D code, said different depth comprising encoded data; wherein
the 3-D code forms part of a microperforated portion of a housing on an electronic device.
12. The method of claim 11 , wherein the step of determining a relative location of the reader and the device comprises utilizing an image recognition software to discern features of the device.
13. A 3-D code comprising:
a plurality of apertures formed within a substrate wherein the code forms part of a microperforated portion of a housing on an electronic device, and wherein:
each aperture comprises a unique position in the 3-D code relative to each of the other apertures; and
each aperture comprises a depth, wherein at least one aperture has a depth that is different from at least one other aperture's depth, said different depth comprising encoded data.
14. The 3-D code of claim 13 , wherein at least one of the plurality of apertures has a first geometric shape and a second geometric shape is formed on a bottom surface of the aperture.
15. The 3-D code of claim 13 , wherein the code is a pin-stamped code and the pin-stamped code comprises at least one aperture having an encoded feature on its bottom surface.
16. The 3-D code of claim 15 wherein the encoded feature comprises a secondary 3-D code.
17. The 3-D code of claim 13 , wherein at least one aperture comprises a through-hole.