Integrated system and method of making the integrated system

Inventor: Thomas Kilger (Regenstauf, DE)

H01L23/49822 H01L23/5389 H01L23/645 H01L24/05 H01L24/20 H01L24/96 H01L25/105 H01F2027/2809 H01L21/563 H01L23/49838 H01L24/03 H01L24/11 H01L24/13 H01L24/16 H01L24/19 H01L24/40 H01L24/48 H01L24/81 H01L2224/0345 H01L2224/0361 H01L2224/0362 H01L2224/0381 H01L2224/0401 H01L2224/04042 H01L2224/04105 H01L2224/05073 H01L2224/05124 H01L2224/05147 H01L2224/05155 H01L2224/05166 H01L2224/05171 H01L2224/05184 H01L2224/05552 H01L2224/05639 H01L2224/05644 H01L2224/05647 H01L2224/05655 H01L2224/11005 H01L2224/1132 H01L2224/1145 H01L2224/11312 H01L2224/11334 H01L2224/11462 H01L2224/11849 H01L2224/12105 H01L2224/131 H01L2224/13111 H01L2224/16145 H01L2224/16227 H01L2224/16503 H01L2224/40227 H01L2224/484 H01L2224/4847 H01L2224/48091 H01L2224/48137 H01L2224/48227 H01L2224/48463 H01L2224/73204 H01L2224/81801 H01L2224/82101 H01L2224/82106 H01L2224/96 H01L2225/1035 H01L2225/1041 H01L2924/014 H01L2924/1301 H01L2924/1305 H01L2924/13055 H01L2924/13091 H01L2924/1461 H01L2924/19107 H05K1/165 H05K1/181 H05K1/185 Y10T29/4913

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Quick Facts

Patent No.: US 9,136,213
App. No.: 13/565,709
Granted: Sep 15, 2015
Kind: B2

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Abstract

A system and method of manufacturing a system are disclosed. An embodiment of the system includes a first packaged component comprising a first component and a first redistribution layer (RDL) disposed on a first main surface of the first packaged component, wherein the first RDL includes first pads. The system further includes a second packaged component having a second component disposed at a first main surface of the second packaged component, the first main surface having second pads and a connection layer between the first packaged component and the second packaged component, wherein the connection layer connects a first plurality of the first pads with the second pads.

Claims (11)

1. A system comprising:

a first packaged component comprising a first semiconductor component, a first portion of a primary winding, a first portion of a secondary winding and a first encapsulant;

a second packaged component comprising a second semiconductor component, a second portion of the primary winding, a second portion of the secondary winding and a second encapsulant, the first packaged component being separate from the second packaged component;

and

an underfill material disposed between the first packaged component and the second packaged component, wherein the underfill material comprises a solder ball arrangement, wherein a first set of solder balls connects the first portion of the primary winding to the second portion of the primary winding, wherein a second set of solder balls connects the first portion of the secondary winding to the second portion of the secondary winding, and wherein the primary winding and the secondary winding form a transformer.

2. The system according to claim 1 , wherein the transformer is a core-less transformer.

3. The system according to claim 1 , wherein the underfill material comprises a low-k dielectric material.

4. The system according to claim 1 , wherein the underfill material comprises platelets of low-k dielectric material.

5. The system according to claim 4 , wherein the platelets comprise an organic material.

6. The system according to claim 4 , wherein the platelets comprise ceramic.

7. The system according to claim 1 , wherein the underfill material comprises a magnetic film or a magnetic paste.

Assignments (1)

ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 2, 2012

From: KILGER, THOMAS

To: INFINEON TECHNOLOGIES AG

Reel/Frame 028714/0079 →

Continuity (1)

Related Publication 20140036464A1 · Feb 6, 2014