IP Library Granted Patent US 9,136,390
Granted Patent B2
US 9,136,390 · App. 13/104,546 · Granted Sep 15, 2015

Semiconductor device and manufacturing method thereof

Inventors: Shunpei Yamazaki (Setagaya, JP); Junichiro Sakata (Atsugi, JP); Jun Koyama (Sagamihara, JP)
Assignee: Semiconductor Energy Laboratory Co., Ltd.
H01L29/7869H01L27/1225H01L29/66969H01L29/78696H01L21/02554H01L21/02565H01L21/02631
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Quick Facts
Patent No.
US 9,136,390
App. No.
13/104,546
Granted
Sep 15, 2015
Kind
B2
Abstract

A semiconductor device which includes a thin film transistor having an oxide semiconductor layer and excellent electrical characteristics is provided. Further, a method for manufacturing a semiconductor device in which plural kinds of thin film transistors of different structures are formed over one substrate to form plural kinds of circuits and in which the number of steps is not greatly increased is provided. After a metal thin film is formed over an insulating surface, an oxide semiconductor layer is formed thereover. Then, oxidation treatment such as heat treatment is performed to oxidize the metal thin film partly or entirely. Further, structures of thin film transistors are different between a circuit in which emphasis is placed on the speed of operation, such as a logic circuit, and a matrix circuit.

Claims (63)

1. An active matrix display device comprising:

a transistor which comprises:

a gate electrode over a substrate;

a gate insulating layer over the gate electrode; and

an oxide semiconductor layer having a channel formation region over the gate electrode with the gate insulating layer interposed therebetween, the oxide semiconductor layer comprising indium, tin and zinc;

an insulating layer comprising aluminum oxide over the oxide semiconductor layer;

a pixel electrode in electrical contact with the oxide semiconductor layer; and

a terminal portion which comprises:

a first conductive layer over the substrate;

an insulating layer over the first conductive layer; and

a transparent conductive film over the insulating layer, wherein the transparent conductive film is overlapped with the first conductive layer,

wherein the oxide semiconductor layer includes a first oxide semiconductor layer and a second oxide semiconductor layer on the first oxide semiconductor layer, the first oxide semiconductor layer having a lower resistivity than the second oxide semiconductor layer, and

wherein the first conductive layer is electrically floating.

2. An active matrix display device comprising:

a pixel comprising:

a transistor over a substrate; and

a pixel electrode in electrical contact with the transistor;

a terminal portion; and

a driver circuit operationally connected to the pixel, the driver circuit comprising an inverter circuit, the inverter circuit comprising:

a first transistor; and

a second transistor,

wherein a source of the first transistor is electrically connected to a drain of the second transistor; and

wherein a gate of the first transistor is electrically connected to the source of the first transistor,

each of the transistor of the pixel, the first transistor and the second transistor comprising:

a gate electrode;

a gate insulating layer over the gate electrode; and

an oxide semiconductor layer having a channel formation region over the gate electrode with the gate insulating layer interposed therebetween, the oxide semiconductor layer comprising indium, tin and zinc,

the terminal portion comprising:

a first conductive layer over the substrate;

an insulating layer over the first conductive layer; and

a transparent conductive film over the insulating layer, wherein the transparent conductive film is overlapped with the first conductive layer,

wherein the oxide semiconductor layer includes a first oxide semiconductor layer and a second oxide semiconductor layer on the first oxide semiconductor layer, the first oxide semiconductor layer having a lower resistivity than the second oxide semiconductor layer, and

wherein the first conductive layer is electrically floating.

3. An active matrix display device comprising:

a pixel comprising:

a transistor over a substrate; and

a pixel electrode in electrical contact with the transistor;

a terminal portion; and

a driver circuit operationally connected to the pixel, the driver circuit comprising an inverter circuit, the inverter circuit comprising:

a first transistor; and

a second transistor;

wherein a source of the first transistor is electrically connected to a drain of the second transistor; and

wherein a gate of the first transistor is electrically connected to a drain of the first transistor,

wherein each of the transistor of the pixel, the first transistor and the second transistor comprises:

a gate electrode;

a gate insulating layer over the gate electrode; and

an oxide semiconductor layer having a channel formation region over the gate electrode with the gate insulating layer interposed therebetween, the oxide semiconductor layer comprising indium, tin and zinc,

wherein the terminal portion comprises:

a first conductive layer over the substrate;

an insulating layer over the first conductive layer; and

a transparent conductive film over the insulating layer, wherein the transparent conductive film is overlapped with the first conductive layer,

wherein the oxide semiconductor layer includes a first oxide semiconductor layer and a second oxide semiconductor layer on the first oxide semiconductor layer, the first oxide semiconductor layer having a lower resistivity than the second oxide semiconductor layer, and

wherein the first conductive layer is electrically floating.

4. The active matrix display device according to any one of claims 1 , 2 and 3 , wherein the active matrix display device is a liquid crystal device.

5. The active matrix display device according to any one of claims 1 , 2 and 3 , wherein the active matrix display device is a light emitting device.

6. The active matrix display device according to any one of claims 1 , 2 and 3 , wherein the oxide semiconductor layer is amorphous.

7. The active matrix display device according to any one of claims 1 , 2 and 3 , wherein the oxide semiconductor layer contains an insulating impurity.

8. The active matrix display device according to claim 1 , wherein, in a plan view, the oxide semiconductor layer is completely overlapped by the gate electrode.

9. The active matrix display device according to claim 2 , wherein, in a plan view, in at least the transistor of the pixel, the oxide semiconductor layer is completely overlapped by the gate electrode.

10. The active matrix display device according to claim 3 , wherein, in a plan view, in at least the transistor of the pixel, the oxide semiconductor layer is completely overlapped by the gate electrode.

11. The active matrix display device according to claim 1 , further comprising an FPC connected with the transparent conductive film of the terminal portion.

12. The active matrix display device according to claim 2 , further comprising an FPC connected with the transparent conductive film of the terminal portion.

13. The active matrix display device according to claim 3 , further comprising an FPC connected with the transparent conductive film of the terminal portion.

Priority Claims (1)
JP 2008-333788 · Dec 26, 2008 · national
Continuity (2)
Continuation 12646085 · Dec 23, 2009
Related Publication 20110215319A1 · Sep 8, 2011