IP Library Granted Patent US 9,137,595
Granted Patent B2
US 9,137,595 · App. 14/075,818 · Granted Sep 15, 2015

Apparatus for prevention of pressure transients in microphones

Inventor: Sung Bok Lee (Chicago, IL)
Assignee: KNOWLES ELECTRONICS, LLC
H04R1/083H04R2201/003
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Quick Facts
Patent No.
US 9,137,595
App. No.
14/075,818
Granted
Sep 15, 2015
Kind
B2
Abstract

An acoustic device includes a substrate, a microelectromechanical system (MEMS) apparatus, a cover, a port, and a valve. The MEMS apparatus includes a diaphragm and a back plate. The cover is coupled to the substrate and encloses the MEMS apparatus. The port is disposed through the substrate and the MEMS apparatus is disposed over the port. The valve is disposed over the port and opposite the MEMS apparatus. The valve is configured to assume a closed position during the occurrence of a high pressure event and prevent a pressure transient from damaging the MEMS apparatus. The valve is configured to assume an open position during the absence of a high pressure event.

Claims (11)

1. An acoustic device comprising:

a substrate;

a microelectromechanical system (MEMS) apparatus, the MEMS apparatus including a diaphragm and a backplate;

a cover, the cover coupled to the substrate and enclosing the MEMS apparatus;

a port, the port disposed through the substrate, the MEMS apparatus being disposed over the port;

a valve, the valve disposed over the port and opposite the MEMS apparatus, the valve being configured to automatically without human intervention assume a closed position during the occurrence of a high pressure event and prevent a pressure transient from damaging the MEMS apparatus, the valve being configured to automatically without human intervention assume an open position during the absence of a high pressure event.

2. The acoustic device of claim 1 wherein the valve comprises a plurality of springs coupled to a central member.

3. The acoustic device of claim 1 wherein during the high pressure event a portion of the valve covers the port.

4. The acoustic device of claim 1 further comprising an application specific integrated circuit coupled to the substrate.

5. The acoustic device of claim 1 wherein the valve is disposed at least partially on an exterior of the substrate.

6. The acoustic device of claim 1 wherein in the valve is disposed on a structure with an opening and wherein the MEMS apparatus is connected to one side of the opening and the valve on the other side of the opening.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 6, 2014
From: LEE, SUNG BOK
To: KNOWLES ELECTRONICS, LLC
Reel/Frame 034114/0792 →
Continuity (2)
Provisional Application 61726256 · Nov 14, 2012
Related Publication 20140133687A1 · May 15, 2014