Micro-electro-mechanical systems (MEMS) and corresponding manufacturing process
An embodiment of a micro-electro-mechanical system of the MEMS type comprising at least one micro-electro-mechanical device of the MEMS type and one junction with a duct suitable to being associated with an external apparatus. Said junction being a printed circuit board PCB comprising at least two layers with juxtaposed faces, a channel being present in at least one face of at least one of said at least two layers suitable for realizing the duct with the juxtaposition of the other face of at least another one of at least two layers.
1. A circuit support, comprising:
a first layer having first and second conductive surfaces;
a second layer disposed over the first layer and having a third conductive surface and a fourth opposite conductive surface that faces and is insulated from the first surface;
a first duct disposed and extending substantially parallel and free from any obstruction, disposed between the first surface of the first layer and the fourth surface of the second layer, the duct having a cavity having a first opening through one of the second and third surfaces, the cavity having a second opening through one of the second and third surfaces, and the first and second openings configured to receive an external apparatus coupled to the circuit support and to provide a fluidic connection between the external apparatus and the first duct of the circuit support.
2. The circuit support of claim 1 wherein the first and second openings are respectively disposed at first and second ends of the duct.
3. The circuit support of claim 1 wherein the first and second openings are disposed through a same one of the second and third surfaces.
4. The circuit support of claim 1 , further comprising a via through the first and second layers and spaced from the duct.
5. The circuit support of claim 1 , further comprising a conductive trace disposed over the second surface of the second layer.
6. The circuit support of claim 1 , further comprising a spacer disposed over the second surface of the second layer adjacent to one of the first and second openings of the duct.
7. The circuit support of claim 1 wherein one of the duct openings comprises an inlet of the duct and the other of the duct openings comprises an outlet of the duct.
8. The circuit support of claim 1 , further comprising a second duct separate from the first duct and disposed and extending substantially parallel between the first surface of the first layer and the fourth surface of the second layer, the second duct having a first opening through one of the second and third surfaces, the second duct having a second opening through one of the second and third surfaces.
9. A method, comprising:
disposing a first conductive layer over a second conductive layer to form a circuit support having a duct free from any obstruction disposed between the first and second layers;
disposing an insulation layer between the first and second layers such that the first and second layers are insulated from each other; and
forming at least two openings to the duct through at least one of the first and second layers, at least one of the openings having an axis that is substantially perpendicular to an axis of the duct, each of the openings having a structure to receive an external apparatus and to provide fluidic connection between the external apparatus and the duct.
10. The method of claim 9 , further comprising forming the first and second openings at respective first and second ends of the duct.
11. The method of claim 9 , further comprising forming the first and second openings through a same one of the first and second layers.
12. The method of claim 9 , further comprising forming a conductive trace over at least one of the first and second layers.
13. A circuit support, comprising:
a first layer disposed between first and second surfaces insulated from each other by the first layer, the first surface is a conductive surface;
a second layer disposed over the first layer and disposed between a third surface and a fourth opposite surface that faces and is insulated from the first surface, the fourth surface is a conductive surface;
a duct disposed between the first surface of the first layer and the fourth surface of the second layer, the duct having first and second openings through a same one of the second and third surfaces; and
connection pads formed on the third surface of the second layer over the duct, the connection pads configured to allow an external apparatus to be physically and electrically connected to the circuit support.
14. The circuit support of claim 13 , further comprising a conductive trace disposed over one of the second and third surfaces.
15. A system, comprising:
a circuit support including
a first layer disposed between first and second conductive surfaces insulated from each other by the first layer,
a second layer disposed over the first layer and disposed between a third surface and a fourth opposite surface that faces and is insulated from the first surface;
a first duct disposed and extending substantially parallel between the first surface of the first layer and the fourth surface of the second layer, the duct having a first opening through one of the second and third surfaces, the duct having a second opening through one of the second and third surfaces; and
a device mounted to the circuit support adjacent to one of the duct openings.
16. The system of claim 15 wherein the device comprises a microelectromechanical device.
17. The system of claim 15 wherein the device comprises a sensor.
18. The system of claim 15 wherein the device includes a second duct that is in fluid communication with the first duct.
19. The system of claim 15 wherein the device includes a pump.
20. The system of claim 15 wherein the device includes a valve.
21. The system of claim 15 , further comprising:
a conductive trace disposed on the circuit support; and
wherein the device includes a conductive pad electrically coupled to the conductive trace.
22. A system, comprising:
a circuit support including,
a first layer disposed between first and second conductive surfaces insulated from each other by the first layer;
a second layer disposed over the first layer and disposed between a third surface and a fourth opposite surface that faces and is insulated from the first surface;
a duct disposed between the first surface of the first layer and the fourth surface of the second layer, the duct having first and second openings through a same one of the second and third surfaces;
connection pads formed on the third surface of the second layer over the duct, the connection pads configured to allow an external device to be physically and electrically connected to the circuit support; and
wherein the external device is mounted to the circuit support adjacent to one of the duct openings to provide fluidic communication between the duct and the external device.
23. The system of claim 22 , further comprising:
a conductive trace disposed over one of the first and second layers of the circuit board; and
wherein the device is electrically coupled to the trace.