IP Library › Granted Patent US 9,140,738
Granted Patent B2
US 9,140,738 · App. 13/901,950 · Granted Sep 22, 2015

Electrostatic capacitance detection device

Inventors: Tomomi Shimizu (Aichi, JP); Takeshi Sawada (Aichi, JP)
Assignee: KABUSHIKI KAISHA TOKAI RIKA DENKI SEISAKUSHO
G01R27/2605G06F3/044G06F2203/04107
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Quick Facts
Patent No.
US 9,140,738
App. No.
13/901,950
Granted
Sep 22, 2015
Kind
B2
Abstract

An electrostatic capacitance detection device includes a substrate having a predetermined thickness, an electrode layer formed on a front surface of the substrate in a predetermined pattern including electrodes to be touched so as to detect an electrostatic capacitance and wirings drawn from the electrodes, and a shield layer formed on a rear surface of the substrate and into a shield pattern corresponding to the predetermined pattern of the electrode layer. The shield pattern of the shield layer is formed surrounding the electrodes without overlapping with the electrodes, surrounding the wirings, and between the wirings when viewed in the thickness direction of the substrate.

Claims (12)

1. An electrostatic capacitance detection device, comprising:

a substrate having a predetermined thickness;

an electrode layer formed on a front surface of the substrate in a predetermined pattern comprising electrodes to be touched so as to detect an electrostatic capacitance and wirings drawn from the electrodes; and

a shield layer formed on a rear surface of the substrate and into a shield pattern corresponding to the predetermined pattern of the electrode layer, such that the electrode layer and the shield layer are disposed on opposite sides of the substrate,

wherein the shield pattern of the shield layer is formed surrounding the electrodes without overlapping with the electrodes, surrounding the wirings without overlapping with the wirings in a longitudinal direction thereof, and between the wirings when viewed in the thickness direction of the substrate.

2. The electrostatic capacitance detection device according to claim 1 , wherein the shield layer formed surrounding the wirings and between the wirings is partially overlapped with the wirings when viewed in the thickness direction of the substrate.

3. The electrostatic capacitance detection device according to claim 2 , wherein all the shield layers including the shield layer formed between the wirings are formed to be electrically connected to each other.

4. The electrostatic capacitance detection device according to claim 1 , wherein the shield layer comprises a mesh structure.

5. The electrostatic capacitance detection device according to claim 1 , wherein the shield patterns formed surrounding the wirings and between the wirings comprise a linear shape.

6. The electrostatic capacitance detection device according to claim 1 , wherein the shield patterns formed surrounding the wirings and between the wirings comprise a connection part to connect with each other.

7. The electrostatic capacitance detection device according to claim 6 , wherein the connection part comprises a linear shape.

8. The electrostatic capacitance detection device according to claim 1 , wherein the shield pattern of the shield layer is, when viewed in the thickness direction of the substrate, formed to have a frame shape around the electrodes and formed to have a linear shape around the wirings and between the wirings, and wherein the linear shield pattern is formed along a longitudinal direction of the frame-shaped shield pattern.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 28, 2013
From: SHIMIZU, TOMOMI; SAWADA, TAKESHI
To: KABUSHIKI KAISHA TOKAI RIKA DENKI SEISAKUSHO
Reel/Frame 030492/0246 →
Priority Claims (1)
JP 2012-124069 · May 31, 2012 · national
Continuity (1)
Related Publication 20130321003A1 · Dec 5, 2013