Semiconductor device
View Patent ↗A semiconductor device includes a semiconductor base body having an n + -type semiconductor layer and an n − -type semiconductor layer p + -type diffusion regions selectively formed on a surface of the n − -type semiconductor layer, and a barrier metal layer formed on a surface of the n − -type semiconductor layer and surfaces of p + -type diffusion regions. A Schottky junction is between the barrier metal layer and the n − -type semiconductor layer. An ohmic junction is between the barrier metal layer and the p + -type diffusion regions. Platinum is diffused into the semiconductor base body such that a concentration of platinum becomes maximum in a surface of the n − -type semiconductor layer.
1. A semiconductor device comprising:
a semiconductor base body having the structure where a first semiconductor layer of a first conductive type and a second semiconductor layer of a first conductive type containing an impurity of a first conductive type at a concentration lower than a concentration of the impurity of the first conductive type contained in the first semiconductor layer are laminated to each other in this order;
a high concentration diffusion region of a second conductive type selectively formed on a surface of the second semiconductor layer, and containing an impurity of a second conductive type opposite to the conductive type of the impurity of the first conductive type at a concentration higher than a concentration of the impurity of the first conductive type which the second semiconductor layer contains; and
a barrier metal layer formed on a surface of the second semiconductor layer and a surface of the high concentration diffusion region, forming a Schottky junction between the barrier metal layer and the second semiconductor layer, and forming an ohmic junction between the barrier metal layer and the high concentration diffusion region, wherein
heavy metal is diffused into the semiconductor base body such that a concentration of heavy metal becomes maximum in a surface of the second semiconductor layer, by forming a mask on the surface of the second semiconductor layer, by forming a mask on the surface of the second semiconductor layer, by forming a heavy metal diffusion source layer on the surface of the first semiconductor layer and by applying thermal treatment to the semiconductor base body, wherein
assuming
a depth position in the surface of the second semiconductor layer as D1,
a depth position in a deepest portion of the high concentration diffusion region as D2,
a depth position which is deeper than the depth position D2 and is shallower than a boundary surface between the first semiconductor layer and the second semiconductor layer as D3,
a depth position of the boundary surface between the first semiconductor layer and the second semiconductor layer as D4, and
a depth position in the surface of the first semiconductor layer as D5,
the concentration of the heavy metal at the depth position D4 is higher than the concentration of the heavy metal at the depth position D3, and wherein
the concentration of the heavy metal at the depth position D2 is higher than the concentration of the heavy metal at the depth position D3.
2. The semiconductor device according to claim 1 , wherein
the depth position D3 is a depth position at which a tail current is controllable at the time of switching off the semiconductor device.
3. The semiconductor device according to claim 1 , wherein
the concentration of the heavy metal at the depth position D1 is higher than the concentration of the heavy metal at the depth position D5.
4. The semiconductor device according to claim 1 , wherein
the concentration of the heavy metal in the surface of the second semiconductor layer is higher than the concentration of the heavy metal in a surface of the high concentration diffusion region.
5. The semiconductor device according to claim 1 , wherein
the concentration of the heavy metal in the surface of the high concentration diffusion region is higher than the concentration of the heavy metal in the surface of the second semiconductor layer.
6. The semiconductor device according to claim 1 , wherein
the heavy metal is platinum.