IP Library › Granted Patent US 9,142,687
Granted Patent B2
US 9,142,687 · App. 14/201,711 · Granted Sep 22, 2015

Semiconductor diode device

Inventors: Yoichi Hori (Hyogo-ken, JP); Takao Noda (Hyogo-ken, JP); Kohei Morizuka (Hyogo-ken, JP); Ryoichi Ohara (Hyogo-ken, JP)
Assignee: Kabushiki Kaisha Toshiba
H01L29/872H01L29/0603H01L29/0615H01L29/0692H01L29/1608H01L29/6606H01L29/0619H01L29/66037
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,142,687
App. No.
14/201,711
Granted
Sep 22, 2015
Kind
B2
Abstract

According to one embodiment, a semiconductor device includes a first semiconductor region, a first electrode, a second semiconductor region, a third semiconductor region, a fourth semiconductor region, a fifth semiconductor region, and a second electrode. The first electrode forms a Schottky junction with the first region. The second region is provided between the first region and the first electrode. The third region is provided between the first region and the first electrode and forms an ohmic junction with the first electrode. The fourth region is provided between the first region and the third region. The fourth region has a higher impurity concentration than the first region. The fifth region is provided between the third region and the first electrode. The fifth region has a higher impurity concentration than the third region. The second electrode is provided on opposite side of the first region from the first electrode.

Claims (51)

1. A semiconductor device comprising:

a first semiconductor region of a first conductivity type;

a first electrode forming a Schottky junction with the first semiconductor region;

a second semiconductor region of a second conductivity type provided between the first semiconductor region and the first electrode;

a third semiconductor region of the second conductivity type provided between the first semiconductor region and the first electrode, the third semiconductor region forming an ohmic junction with the first electrode;

a fourth semiconductor region of the first conductivity type provided between the first semiconductor region and the third semiconductor region, the fourth semiconductor region having a higher impurity concentration than the first semiconductor region;

a fifth semiconductor region of the second conductivity type provided between the third semiconductor region and the first electrode, the fifth semiconductor region having a higher impurity concentration than the third semiconductor region, wherein the fifth semiconductor region is surround by the third semiconductor region;

a second electrode provided on opposite side of the first semiconductor region from the first electrode.

2. The device according to claim 1 , wherein a position of the fourth semiconductor region as viewed in a direction connecting the first semiconductor region and the first electrode is substantially equal to a position of the fifth semiconductor region as viewed in the direction.

3. The device according to claim 1 , further comprising:

a sixth semiconductor region of the second conductivity type provided so as to surround an end of the third semiconductor region, the sixth semiconductor region having a lower impurity concentration than the third semiconductor region.

4. The device according to claim 1 , wherein as viewed in a direction connecting the first semiconductor region and the first electrode, an outer peripheral edge of the first electrode is provided between an end of the fifth semiconductor region and an end of the third semiconductor region.

5. The device according to claim 1 , wherein

as viewed in a direction connecting the first semiconductor region and the first electrode, the first semiconductor region includes a first region, a second region, and a third region,

the second semiconductor region is provided between the first region and the first electrode,

the third semiconductor region is provided between the second region and the first electrode and between the third region and the first electrode, and

the fourth semiconductor region is provided between the third region and the first electrode, and not provided between the second region and the first electrode.

6. The device according to claim 1 , wherein the first semiconductor region, the second semiconductor region, the third semiconductor region, the fourth semiconductor region, and the fifth semiconductor region include SiC.

7. The device according to claim 1 , wherein

the second semiconductor region is provided in a plurality, and

the plurality of second semiconductor regions are provided so as to extend in one direction, and provided parallel to each other.

8. The device according to claim 7 , wherein the third semiconductor region is provided so as to surround the plurality of second semiconductor regions.

9. The device according to claim 7 , wherein the fourth semiconductor region is provided so as to surround the plurality of second semiconductor regions.

10. The device according to claim 5 , wherein

as viewed in the direction, the first region includes a first portion and a second portion, and

as viewed in the direction, the second region is provided between the first portion and the second portion.

11. The device according to claim 10 , wherein the third region is provided so as to surround the first region.

12. The device according to claim 5 , wherein

as viewed in the direction, the first region includes a first portion, a second portion, and a third portion,

as viewed in the direction, the second region is provided between the second portion and the third portion, and

as viewed in the direction, the third region is provided between the first portion and the second portion.

13. The device according to claim 5 , wherein

as viewed in the direction, the first region includes a first portion, a second portion, and a third portion,

as viewed in the direction, the second region includes a fourth portion and a fifth portion,

as viewed in the direction, the third region is provided between the first portion and the second portion,

as viewed in the direction, the fifth portion is provided between the second portion and the third portion, and

as viewed in the direction, the fourth portion is provided so as to surround the first region.

14. The device according to claim 5 , wherein

as viewed in the direction, the first region includes a first portion, a second portion, and a third portion,

as viewed in the direction, the second region includes a fourth portion and a fifth portion,

as viewed in the direction, the fourth portion is provided between the first portion and the second portion, and

as viewed in the direction, the fifth portion is provided between the second portion and the third portion.

15. The device according to claim 14 , wherein as viewed in the direction, the third region is provided so as to surround the first region.

16. The device according to claim 5 , wherein

the second region includes a plurality of fourth portions, and

the plurality of fourth portions are arranged inside the first region.

17. The device according to claim 16 , wherein as viewed in the direction, the third region is provided so as to surround the first region.

18. The device according to claim 5 , wherein

the second region includes a plurality of fourth portions,

the third region is provided so as to surround the first region, and

the plurality of fourth portions are provided at a position corresponding to a corner of the third region.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 7, 2014
From: HORI, YOICHI; NODA, TAKAO; MORIZUKA, KOHEI; OHARA, RYOICHI
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 032384/0086 →
Priority Claims (1)
JP 2013-138244 · Jul 1, 2013 · national
Continuity (1)
Related Publication 20150001552A1 · Jan 1, 2015