High vacuum OLED deposition source and system
Sources, devices, and techniques for deposition of organic layers, such as for use in an OLED, are provided. A vaporizer may vaporize a material between cooled side walls and toward a mask having an adjustable mask opening. The mask opening may be adjusted to control the pattern of deposition of the material on a substrate, such as to correct for material buildup that occurs during deposition. Material may be collected from the cooled side walls for reuse.
1. A device comprising:
a first thermal vaporizer;
a mask assembly comprising an adjustable mask opening and disposed not more than a distance 5 W from the first thermal vaporizer, wherein W is the width of the mask assembly; and
a first plurality of cooled side walls disposed between the first thermal vaporizer and the mask assembly and defining a material sublimation region.
2. The device of claim 1 , wherein mask assembly is disposed not more than 4 W from the first thermal vaporizer.
3. The device of claim 1 , wherein the mask assembly is disposed at least 100 μm-1 cm from the first thermal vaporizer.
4. The device of claim 1 , wherein the mask assembly is disposed 1 mm-5 mm from the material source.
5. The device of claim 1 , wherein the mask assembly comprises a plurality of components moveable relative to one another to adjust the area of the mask opening.
6. The device of claim 1 , wherein the mask opening is adjustable between a fully closed position and an open position.
7. The device of claim 6 , wherein, when the mask opening is fully closed, source material provided by the first thermal vaporizer is entirely prevented from passing through the mask.
8. The device of claim 1 , wherein the mask opening has a maximum area of not more than 50% of the area of the mask.
9. The device of claim 1 , further comprising an organic material source disposed within the first thermal vaporizer.
10. The device of claim 1 , further comprising a second vaporizer.
11. The device of claim 10 , further comprising a second plurality of cooled side walls disposed between the second vaporizer and the mask assembly.
12. The device of claim 10 , each vaporizer configured to vaporize a separate material.
13. The device of claim 1 , further comprising a vacuum source in fluid communication with the material sublimation region.
14. The device of claim 1 , wherein at least a portion of the mask assembly is cooled.
15. A deposition system comprising:
a device as recited in claim 1 ; and
a target substrate;
wherein the mask assembly has an area less than the area of the target substrate.
16. A method for fabricating a device, the method comprising:
vaporizing a first material between a first plurality of cooled side walls and toward a mask assembly having an adjustable mask opening and disposed not more than a distance 5 W from the first material, wherein W is a width of the mask assembly.
17. The method of claim 16 , further comprising:
changing the width of the adjustable mask opening.
18. The method of claim 16 , further comprising:
vaporizing a second material toward the mask assembly.
19. The method of claim 18 , further comprising:
rastering a substrate relative to the mask and source assembly containing a second material to cover a surface of a substrate.
20. The method of claim 16 , further comprising:
rastering a substrate relative to the mask and source assembly containing a first material to cover a surface of a substrate.