Organic light emitting diode display device
Disclosed is an organic light emitting diode display device in which at least one lateral surface of an encapsulation substrate is inclined to prevent disconnection of a film connected to a pad, thereby achieving a narrow bezel and enhanced reliability. The display device includes a substrate, an organic light emitting diode array including a thin film transistor arranged on the substrate and an organic light emitting diode connected to the thin film transistor, a pad disposed on the substrate and configured to receive a drive signal to drive the organic light emitting diode array, an encapsulation substrate bonded to the substrate to face each other so as to cover the organic light emitting diode array, and a film connected to the pad and provided with a drive chip thereon. At least one lateral surface of the encapsulation substrate is inclined.
1. An organic light emitting diode display device comprising:
a substrate;
an organic light emitting diode array including a thin film transistor arranged on the substrate and an organic light emitting diode connected to the thin film transistor;
a pad disposed on the substrate and configured to receive a drive signal to drive the organic light emitting diode array;
an encapsulation substrate to cover the organic light emitting diode array, wherein the encapsulation substrate is metal; and
a film having a first surface and a second surface, connected to the pad on the first surface, and provided with a drive chip on the second surface,
wherein at least one lateral surface of the encapsulation substrate is inclined; and
wherein the film is extended along the inclined lateral surface of the encapsulation substrate and a rear surface of the encapsulation substrate.
2. The device according to claim 1 , wherein light emitted from the organic light emitting diode is discharged outward through the substrate.
3. The device according to claim 1 , wherein the rear surface of the encapsulation substrate faces the first surface of the film.
4. The device according to claim 1 , wherein a recess is formed between the inclined lateral surface of the encapsulation substrate and the rear surface of the encapsulation substrate.
5. The device according to claim 4 , wherein the drive chip is seated in the recess.
6. The device according to claim 1 , wherein the encapsulation substrate has a thickness within a range of 50 μm to 200 μm.
7. The device according to claim 1 , wherein a first angle between an inner surface of the encapsulation substrate coming into contact with the organic light emitting diode array and the lateral surface of the encapsulation substrate is greater than 0° and less than 90° , and
wherein a second angle between the lateral surface of the encapsulation substrate and the rear surface of the encapsulation substrate is greater than 90° and less than 180° .