Impact and/or sound deadening hydronic sub-flooring panel and related system and method

1. A sub-flooring panel for use with a heating element comprising:

a first solid base body having a first recessed formation adapted to receive the heating element, the first recessed formation having:

a bottom portion having a semi-circular cross-section with a first diameter; and

opposing step formations, each step formation having a rise and a run, the rises of the opposing step formations being separated by a second distance greater than the first diameter;

a cap member having flat side portions, each flat side portion supported on a respective run of the opposing step formations, the cap member configured to cover the heating element in the first recessed formation, the cap member having a second recessed formation adapted to receive a portion of the heating element; and

at least one thermally-conductive liner configured for contact with both the heating element and the first solid base body, the liner having at least a first portion and a second portion, the first portion positioned between the heating element and the second recessed formation of the cap member, the first portion of the liner generally conforming to the second recessed formation of the cap member, the second portion of the liner positioned between each of the flat side portion and its respective opposite step formation.

2. The panel of claim 1 , wherein the first base body comprises a material selected from the group consisting of oriented strand board (OSB), plywood, medium density fiberboard (MDF), particleboard, pre-fabricated agricultural residues, wood, pre-fabricated “light” concrete, plastics or a combination thereof.

3. The panel of claim 1 , wherein the recessed formation has a step formation on which the cap member is supported.

4. The panel of claim 3 , wherein the step formation has at least one beveled corner.

5. The panel of claim 1 , wherein the heating element includes hydronic piping.

6. The panel of claim 1 , wherein liner comprises aluminum, and/or copper.

7. The panel of claim 1 , wherein the liner has a perforation pattern.

8. The panel of claim 1 , further comprising at least one connector configured to connect the first base body to another base body of another sub-flooring panel.

9. The panel of claim 8 , wherein the another base body has another recessed formation, and wherein the another recessed formation is configured for alignment with the first recessed formation.

10. The panel of claim 9 , wherein each recessed formation is configured to receive a respective portion of the heating element.

11. The panel of claim 1 , wherein the cap member has at least one beveled corner.

12. A sub-flooring system, comprising:

a sub-flooring panel assembly comprising a plurality of panels, each panel comprising a solid base body with a recessed formation, wherein the recessed formations of at least two panels are aligned and configured to receive an elongated heating element, and wherein each recessed formation has a bottom portion having a semi-circular cross-section with a first diameter, and opposing step formations, with each step formation having a rise and a run, the rises of the opposing step formations being separated by a second distance greater than the first diameter;

a cap member configured to sit in at least one recessed formation and cover at least a portion of the elongated heating element, the cap member having a concave form configured to receive an upper portion of the portion of the elongated heating element; and

an underlayment assembly comprising a plurality of stabilizing supports and at least one generally rigid board.

13. The sub-flooring system of claim 12 , wherein each panel has at least a connector configured to connect adjacent panels to each other.

14. The sub-flooring system of claim 12 , wherein the elongated heating element includes hydronic piping.

15. A method of installing a sub-flooring system, comprising:

providing a slab structure;

positioning at least two stabilizing supports on the slab structure, each in a selected location;

positioning at least one generally rigid board on the supports;

providing a plurality of solid sub-flooring panels, each panel having a recessed formation, the recessed formation having:

a bottom portion having a semi-circular cross-section with a first diameter; and

opposing step formations, each step formation having a rise and a run, the rises of the opposing step formations being separated by a second distance greater than the first diameter;

joining the plurality of panels to form a sub-flooring panel assembly wherein the recessed formations of adjacent panels align with each other to form an elongated continuous recessed formation;

positioning an elongated heating element in the elongated continuous recessed formation;

positioning a thermally-conductive liner on at least a portion of the elongated heating element, the liner having a recessed formation conforming to an upper portion of the elongated heating element; and

positioning a cap member in the elongated continuous recessed formation on at least a portion of the liner to cover at least a portion of the elongated heating element, the cap member having flat side portions, each flat side portion supported on a respective run of the opposing step formations, the cap member having a recessed formation configured to receive an upper portion of the elongated heating member.

16. The method of claim 15 , wherein a selected location is generally under a corner region of at least one panel.

17. The method of claim 15 , wherein the positioning at least two stabilizing supports includes adjusting height of at least one of the stabilizing supports.

18. The method of claim 15 , further comprising positioning a fiberboard on the at least one generally rigid board before positioning the panels on the fiberboard.