Method of manufacturing organic light emitting display device

1. A method of manufacturing an organic light emitting display device, the method comprising:

defining a plurality of pixels on a substrate, each of the pixels including a first area in which light is emitted in a first direction and a second area in which light is emitted in a second direction opposite the first direction;

forming a plurality of first electrodes respectively disposed in only the first area of each of the plurality of pixels;

forming a sacrificial layer in the first area and the second area of each of the plurality of pixels to cover the plurality of first electrodes, the sacrificial layer having a plurality of openings to open a patterning area in the respective second area of each of the plurality of pixels;

forming a conductive layer on the patterning areas and the sacrificial layer;

removing the sacrificial layer entirely from the first and second areas;

forming an intermediate layer including an organic emitting layer; and

forming a third electrode on the intermediate layer.

2. The method of claim 1 , wherein the first electrode comprises a transparent conductor.

3. The method of claim 2 , wherein the conductive layer is formed by stacking a reflective layer and a transparent conductive layer.

4. The method of claim 1 , wherein the first electrode is formed by stacking a reflective layer and a transparent conductive layer.

5. The method of claim 4 , wherein the conductive layer comprises a transparent conductor.

6. The method of claim 1 , wherein sidewalls forming the plurality of openings in the sacrificial layer are inclined at an angle of 90 degrees or greater with respect to a surface of the substrate.

7. The method of claim 1 , wherein removing the sacrificial layer comprises removing the conductive layer formed on the sacrificial layer.

8. The method of claim 1 , wherein the sacrificial layer includes a photo-resist.

9. A method of manufacturing an organic light emitting display device, the method comprising:

forming a first electrode in only a first area of a substrate;

forming a sacrificial layer on the substrate to cover the first electrode, the sacrificial layer having an opening to open at least a portion of a second area separated from the first area of the substrate;

forming a second electrode in an area corresponding to the opening;

removing the sacrificial layer entirely from the first and second areas;

forming an intermediate layer including an organic emitting layer on the first electrode and the second electrode; and

forming a third electrode on the intermediate layer.

10. The method of claim 9 , wherein forming the second electrode comprises:

forming a conductive layer on the substrate and the sacrificial layer.

11. The method of claim 10 , wherein the first electrode comprises a transparent conductor.

12. The method of claim 11 , wherein the conductive layer is formed by stacking a reflective layer and a transparent conductive layer.

13. The method of claim 10 , wherein the first electrode is formed by stacking a reflective layer and a transparent conductive layer.

14. The method of claim 13 , wherein the conductive layer comprises a transparent conductor.

15. The method of claim 10 , wherein removing the sacrificial layer comprises removing the conductive layer formed on the sacrificial layer.

16. The method of claim 9 , wherein sidewalls forming the opening in the sacrificial layer are inclined at an angle of 90 degrees or greater with respect to a surface of the substrate.

17. The method of claim 9 , wherein the sacrificial layer includes a photo-resist.