Electronic circuit substrate, display device, and wiring substrate

1. An electronic circuit substrate, comprising:

a wiring substrate that has a substrate, and wiring lines, circuit elements, and connecting terminals that are formed on said substrate, the connecting terminals being connected to the circuit elements via the wiring lines; and

a semiconductor chip mounted on the wiring substrate through the connecting terminals,

wherein the connecting terminals of the wiring substrate each comprise:

a pair of protrusions having a depression therebetween; and

a depression electrode disposed in the depression and covering at least a part of each protrusion of the pair of protrusions,

wherein the semiconductor chip has bump electrodes that are to be connected to the depression electrodes of the connecting terminals, respectively, and

wherein a contact region where a depression electrode is in contact with a corresponding bump electrode forms a line shape in a plan view.

2. The electronic circuit substrate according to claim 1 , wherein each protrusion of the pair of protrusions extends along a first direction, and a direction in which the contact region that forms a line shape extends is parallel to the first direction.

3. The electronic circuit substrate according to claim 1 , wherein the depression electrode and the bump electrode are directly connected to each other at least partially in the contact region.

4. The electronic circuit substrate according to claim 1 , wherein each of the bump electrodes has edges that define a bottom surface of the bump electrode, and at least one of said edges of the bump electrode is in contact with the depression electrode in the contact region.

5. The electronic circuit substrate according to claim 1 , further comprising a resin material layer disposed around the depression electrodes and the bump electrodes,

wherein the resin material layer is made of a non-conductive film or a non-conductive paste an NCP.

6. The electronic circuit substrate according to claim 1 , wherein the pair of protrusions has elasticity.

7. The electronic circuit substrate according to claim 1 , wherein each protrusion of the pair of protrusions has a convex curved surface, and

wherein the depression is defined by at least the convex curved surfaces.

8. The electronic circuit substrate according to claim 1 , wherein a plurality of said connecting terminals are aligned along a prescribed direction in a mounting region of each said semiconductor chip, and

wherein a pitch at which the connecting terminals are arranged at an edge of the mounting region is smaller than a pitch at which the connecting terminals are arranged at a center of the mounting region.

9. The electronic circuit substrate according to claim 1 , wherein a plurality of said connecting terminals are aligned along a prescribed direction in a mounting region of each said semiconductor chip, and

wherein, of the pair of protrusions of each of the connecting terminals disposed at an edge of the mounting region, one protrusion that is closer to the edge of the mounting region is larger than another protrusion that is closer to a center of the mounting region.

10. The electronic circuit substrate according to claim 1 , wherein the circuit elements each have a TFT and a pixel electrode that is electrically connected to the TFT, and

wherein the wiring lines include gate bus lines and source bus lines connecting the connecting terminals and the TFTs to each other.

11. A display device, comprising:

the electronic circuit substrate according to claim 1 ; and

a display medium layer that is driven by the electronic circuit substrate.

12. The display device according to claim 11 , further comprising:

an opposite substrate disposed opposite to the electronic circuit substrate; and

a liquid crystal layer as the display medium layer that is sandwiched between the electronic circuit substrate and the opposite substrate.

13. A wiring substrate, comprising:

a substrate; and

wiring lines, circuit elements, and connecting terminals that are formed on said substrate, the connecting terminals being respectively connected to the circuit elements via the wiring lines,

wherein each of the connecting terminals comprises:

a pair of protrusions having a depression therebetween; and

a depression electrode disposed in the depression and covering at least a part of each protrusion of the pair of protrusions, and

wherein the depression is defined by a pair of inclined surfaces formed by the pair of protrusions, and a bump electrode of a semiconductor chip is selectively connected to the depression electrode at the pair of inclined surfaces.