IP Library Granted Patent US 9,152,755
Granted Patent B2
US 9,152,755 · App. 14/452,669 · Granted Oct 6, 2015

Optical semiconductor device, socket, and optical semiconductor unit

Inventor: Hideyuki Kanno (Tokyo, JP)
Assignee: Japan Aviation Electronics Industry, Limited
G06F17/5072H01R12/7076H01R12/716H01R13/20H05K3/301H05K2201/10106H05K2201/10325
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Quick Facts
Patent No.
US 9,152,755
App. No.
14/452,669
Granted
Oct 6, 2015
Kind
B2
Abstract

An optical semiconductor unit of the present invention has an LED device provided with an LED (Light Emitting Diode) and a socket to which the LED device is mounted, the LED device has a main body to which the LED is mounted, the main body has a first surface to which block-shaped electrode portions are connected.

Claims (10)

1. A method of designing an optical semiconductor device having a main body to which an optical semiconductor is mounted, and an electrode portion formed on the main body, the method comprising:

(a) defining an input power supplied to the optical semiconductor and a junction temperature of the optical semiconductor;

(b) obtaining a first graph showing a relationship between a volume of the main body and a junction temperature of the optical semiconductor at the defined input power based on the assumption that heat generated from the optical semiconductor is dissipated only through the main body and based on the assumption that heat generated from the optical semiconductor is not dissipated through members except the main body in the optical semiconductor device, and a second graph showing a relationship between a volume of the electrode portion and the junction temperature of the optical semiconductor at the defined input power based on the assumption that heat generated from the optical semiconductor is dissipated only through the electrode portion and based on the assumption that heat generated from the optical semiconductor is not dissipated through members except the electrode in the optical semiconductor device;

(c) calculating, from the first and the second graphs, the volumes of the main body and the electrode portion such that the junction temperature of the optical semiconductor become a defined temperature; and

(d) designing the main body and the electrode portion so that the main body and the electrode portion have the volumes calculated in (c).

2. A method of designing a socket having a plurality of socket terminals connected to an optical semiconductor device having an optical semiconductor, the method comprising:

(e) defining an input power supplied to the optical semiconductor and a junction temperature of the optical semiconductor;

(f) obtaining a third graph showing a relationship between a volume of the plurality of socket terminals and a junction temperature of the optical semiconductor at the defined input power based on the assumption that heat generated from the optical semiconductor is dissipated only through the socket and based on the assumption that heat generated from the optical semiconductor is not dissipated through members except the socket;

(g) calculating, from the third graph; the volume of the plurality of socket terminals such that the junction temperature of the optical semiconductor become a defined temperature; and

(h) designing the plurality of socket terminals so that the plurality of socket terminals have the volume calculated in (g).

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 6, 2014
From: KANNO, HIDEYUKI
To: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
Reel/Frame 033474/0522 →
Priority Claims (1)
JP 2009-058463 · Mar 11, 2009 · national
Continuity (2)
Division 12658525 · Feb 11, 2010
Related Publication 20140344771A1 · Nov 20, 2014