MEMS die and methods with multiple-pressure sealing

1. A method for producing a micro-electro-mechanical systems (MEMS) die, the method comprising:

positioning a first material layer on a substrate;

covering the first material layer with a lid layer, wherein a first cavity and a second cavity are defined in the first material layer beneath the lid layer, and wherein the lid layer comprises first vent holes in communication with the first cavity and second vent holes in communication with the second cavity;

exposing at least the first cavity to a first atmosphere;

sealing the first cavity while the first cavity is exposed to the first atmosphere while not sealing the second cavity, wherein sealing the first cavity comprises sealing the first vent holes while the first cavity is exposed to the first atmosphere;

exposing at least the second cavity to a second atmosphere that is different than the first atmosphere; and

sealing the second cavity while the second cavity is exposed to the second atmosphere, wherein sealing the second cavity comprises sealing the second vent holes while the second cavity is exposed to the second atmosphere.

2. The method of claim 1 , wherein the first atmosphere has a first pressure and the second atmosphere has a second pressure that is different than the first pressure.

3. The method of claim 1 , wherein the first vent holes are smaller than the second vent holes.

4. The method of claim 1 , wherein sealing the first vent holes comprises covering the lid layer with a first sealing layer, the first sealing layer filling the first vent holes.

5. The method of claim 1 , comprising positioning one or more micro-electro-mechanical systems (MEMS) devices within either or both of the first and/or second cavities.

6. The method of claim 1 , wherein the first cavity is connected to the second cavity within the first material layer, whereby both the first cavity and the second cavity are sealed while exposed to the second atmosphere.

7. The method of claim 4 , wherein covering the lid layer with a first sealing layer comprises depositing a first oxide and/or nitride layer using a plasma-enhanced chemical vapor deposition (PECVD) or physical vapor deposition (PVD) process.

8. The method of claim 4 , wherein covering the lid layer with a first sealing layer comprises depositing a first sealing layer having a thickness that is at least as great as a radius of the first vent holes.

9. The method of claim 4 , wherein sealing the second vent holes comprises covering the lid layer with a second sealing layer, the second sealing layer filling the second vent holes.

10. The method of claim 8 , wherein covering the lid layer with a second sealing layer comprises covering the lid layer with a plurality of plugs, each of the plurality of plugs at least partially filling one of the second vent holes.

11. A method for producing a micro-electro-mechanical systems (MEMS) die, the method comprising:

positioning a first material layer on a substrate, the first material layer comprising a first cavity and a second cavity that each have one or more openings out of the first material layer;

exposing at least the first cavity to a first atmosphere;

sealing the first cavity while the first cavity is exposed to the first atmosphere while not sealing the second cavity;

exposing at least the second cavity to a second atmosphere that is different than the first atmosphere; and

sealing the second cavity while the second cavity is exposed to the second atmosphere;

wherein the first material layer comprises at least one additional cavity having one or more openings out of the first material layer; and

wherein the method further comprises:

exposing the at least one additional cavity to at least one additional atmosphere that is different than the first and second atmospheres; and

sealing the at least one additional cavity while the at least one additional cavity is exposed to the at least one additional atmosphere.