Method for treating substrates with halosilanes

1. A method for rendering a substrate hydrophobic comprising:

providing a feedroll feeding a treatable substrate;

moving a portion of the treatable substrate from the feedroll through a first zone divider into an inert gas inlet zone;

introducing inert gas into the inert gas inlet zone and producing a positive pressure of the inert gas in the inert gas inlet zone;

moving the treatable substrate through a second zone divider, the second zone divider separating the inert gas inlet zone from a treatment zone;

moving the treatable substrate into the treatment zone;

forming a treated substrate by exposing the treatable substrate to turbulent flow of a vapor with a concentration comprising at least 90% of a halosilane in the treatment zone such that the vapor penetrates the substrate, the halosilane reacting with at last a portion of the treatable substrate to produce HCl; and

wherein the temperature of the vapor is maintained above condensation temperature of the halosilane in the treatment zone; and

moving the treated substrate through a third zone divider, the third zone divider separating the treatment zone from a neutralization zone;

moving the treated substrate into the neutralization zone and exposing at least a portion of the substrate to a basic compound to at least partially neutralize the HCl while at least a portion of the treatable substrate is exposed to the halosilane in the treatment zone;

moving the treated substrate into a positive pressure zone coupled to at least one vapor outlet and including an inert gas inlet;

flowing inert gas through the inert gas inlet forming a positive pressure of the inert gas within the positive pressure zone and a flow of inert gas with by-products through the at least one vapor outlet; and

rolling the treated substrate onto an uptake roll substantially continuously as treatable substrate is fed from the feedroll.

2. The method of claim 1 , wherein the vapor consists essentially of the halosilane and the vapor is substantially free of added solvent.

3. The method of claim 2 , wherein the halosilane comprises chlorosilane.

4. The method of claim 2 , wherein the total time the substrate spends inside the treatment zone ranges from 1 second to 10 seconds.

5. The method of claim 1 , wherein the vapor is introduced at or near center of the treatment zone; and

wherein the turbulent flow of the vapor is produced by a mixer in the treatment zone.

6. The method of claim 1 , wherein the total time the substrate spends inside the treatment zone ranges from about 1 second to about 10 seconds.

7. The method of claim 1 , wherein the substrate is selected from cellulosic substrates derived from wood, textiles, or insulation.

8. The method of claim 1 , further comprising passing the substrate through an intermediate zone located between the treatment zone and the positive pressure zone, where the intermediate zone has a lower concentration of halosilane than the treatment zone and a higher concentration of halosilane than the positive pressure zone.

9. The method of claim 1 , wherein a feed rate of the halosilane into the treatment zone is adjusted by a computer program, the method comprising the steps of:

i) receiving a request from a device for feeding the halosilane to the treatment zone;

ii) receiving input data comprising speed, width, and thickness of the substrate being treated;

iii) executing the computer program to generate an updated feed rate based on the input data received in step ii); and

iv) forwarding the updated feed rate to the device for feeding the halosilane.

10. The method of claim 1 , wherein the method is continuous.

11. The method of claim 1 , wherein the basic compound comprises an organic base.

12. The method of claim 1 , wherein the basic compound comprises an inorganic base.

13. The method of claim 1 , wherein the basic compound comprises ammonia.

14. The method of claim 13 , wherein the ammonia is substantially pure ammonia gas.

15. The method of claim 1 , wherein the treated substrate is heated following halosilane penetration.

16. The method of claim 15 , wherein the treated substrate is heated above 200° C.

17. The method of claim 15 , wherein the treated substrate is heated to a temperature between about 100° C. and about 150° C.

18. The method of claim 15 , wherein the treated substrate is heated to a temperature of about 65° C.