IP Library Granted Patent US 9,161,432
Granted Patent B2
US 9,161,432 · App. 13/598,269 · Granted Oct 13, 2015

Circuit board

Inventors: Toshio Watanabe (Kanagawa, JP); Isao Ichimura (Tokyo, JP); Tatsuo Maeda (Kanagawa, JP); Takuma Nagata (Aichi, JP)
Assignee: Sony Corporation
H05K1/0201H05K3/0061H05K3/303H05K2201/09054H05K2201/09063H05K2201/09072H05K2201/10121H05K2201/10219H05K2201/10409H05K2203/165
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Quick Facts
Patent No.
US 9,161,432
App. No.
13/598,269
Granted
Oct 13, 2015
Kind
B2
Abstract

A circuit board includes a board having a hole formed therein, and an imager that is bonded to a first region including at least a portion of the hole in a front surface of the board.

Claims (54)

1. A circuit board apparatus, comprising:

a circuit board having a hole formed therein; and

an imager that is adhered directly to a first region including at least a portion of the hole in a front surface of the circuit board,

a first temperature regulation member;

a second temperature regulation member;

a third temperature regulation member inserted between a rear surface of the imager and one of the first temperature regulation member and the second temperature regulation member,

wherein the first region includes a first region segment of the circuit board and the first region segment is contiguous to the at least portion of the hole in the front surface of the circuit board, and

one of the first temperature regulation member and the second temperature regulation member is mounted in a second region including at least a portion of the hole in a rear surface of the circuit board.

2. The circuit board apparatus according to claim 1 , wherein

the third temperature regulation member includes an elastic thermal conductor sheet.

3. The circuit board apparatus according to claim 1 , wherein

the third temperature regulation member includes thermal-conduction grease.

4. The circuit board apparatus according to claim 2 , wherein

the first temperature regulation member is a heat sink including an insertion hole sized to insert a temperature sensor therein.

5. The circuit board apparatus according to claim 2 , further comprising

an elastic body to bring the second temperature regulation member mounted to the second region into pressing contact with the second region.

6. The circuit board apparatus according to claim 5 , wherein

the second temperature regulation member includes a temperature regulation plate having an insertion hole sized to insert a temperature sensor therein.

7. The circuit board apparatus according to claim 2 , wherein

the circuit board and the imager are bonded by solder and resin.

8. The circuit board apparatus according to claim 7 , further comprising

a fixing member to fix the imager that is bonded to the first region to the first region.

9. A circuit board, comprising:

a board having a hole formed therein;

an imager that is bonded to a first region including at least a portion of the hole in a front surface of the board;

a first temperature regulation member;

a second temperature regulation member; and

a third temperature regulation member inserted between a rear surface of the imager and one of the first temperature regulation member and the second temperature regulation member,

wherein one of the first temperature regulation member and the second temperature regulation member is mounted in a second region including at least a portion of the hole in a rear surface of the board,

wherein the third temperature regulation member includes an elastic thermal conductor sheet and

wherein the first temperature regulation member is a heat sink including an insertion hole sized to insert a temperature sensor therein.

10. A circuit board, comprising:

a board having a hole formed therein;

an imager that is bonded to a first region including at least a portion of the hole in a front surface of the board;

a first temperature regulation member;

a second temperature regulation member;

a third temperature regulation member inserted between a rear surface of the imager and one of the first temperature regulation member and the second temperature regulation member; and

an elastic body to bring the second temperature regulation member mounted to the second region into pressing contact with the second region,

wherein one of the first temperature regulation member and the second temperature regulation member is mounted in a second region including at least a portion of the hole in a rear surface of the board,

wherein the third temperature regulation member includes an elastic thermal conductor sheet and

wherein the second temperature regulation member includes a temperature regulation plate having an insertion hole sized to insert a temperature sensor therein.

11. A circuit board, comprising:

a board having a hole formed therein;

an imager that is bonded to a first region including at least a portion of the hole in a front surface of the board;

a first temperature regulation member;

a second temperature regulation member; and

a third temperature regulation member inserted between a rear surface of the imager and one of the first temperature regulation member and the second temperature regulation member,

wherein one of the first temperature regulation member and the second temperature regulation member is mounted in a second region including at least a portion of the hole in a rear surface of the board,

wherein the third temperature regulation member includes an elastic thermal conductor sheet and

wherein the board and the imager are bonded by solder and resin.

12. The circuit board according to claim 11 , further comprising

a fixing member to fix the imager that is bonded to the first region to the first region.

13. The circuit board apparatus according to claim 1 , wherein

the first region segment of the circuit board is adhered directly to a bonding portion of the imager by a bonding material, the first region segment and the bonding portion of the imager being facially opposed to each other with the bonding material disposed therebetween.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 7, 2012
From: WATANABE, TOSHIO; ICHIMURA, ISAO; MAEDA, TATSUO; NAGATA, TAKUMA
To: SONY CORPORATION
Reel/Frame 028918/0550 →
Priority Claims (1)
JP 2011-196819 · Sep 9, 2011 · national
Continuity (1)
Related Publication 20130062717A1 · Mar 14, 2013