Electronic device
An electronic device is provided wherein the characteristics thereof are prevented from deteriorating. The electronic device ( 1 ) is provided with: a chip component ( 2 ) having an electronic element ( 22 ); a wiring board ( 3 ) on which the chip component ( 2 ) is mounted with a space therebetween, the space for containing the electronic element ( 22 ); a resin layer ( 4 ) provided from the surface of the chip component ( 2 ) to the surface of the wiring board ( 3 ) so as to surround the space; and an inorganic insulating layer ( 5 ), which is provided at the resin layer ( 4 ) and is positioned at the side of the space. Since entry of water vapor into the space can be reduced not only by means of the resin layer ( 4 ) but also by means of the inorganic insulating layer ( 5 ), the electronic device ( 1 ) having high airtight sealing performance can be provided.
1. An electronic device comprising:
a chip component having an electronic element;
a wiring board on which the chip component is mounted with a space therebetween, the space for containing the electronic element;
a resin layer provided from a surface of the chip component to a surface of the wiring board so as to surround the space; and
an inorganic insulating layer which is provided at the resin layer and is positioned at a side of the space, wherein the inorganic insulating layer is provided on an inner surface of the resin layer and is exposed to the space.
2. The electronic device as set forth in claim 1 , wherein a relationship of α1 >α2>α3 is satisfied where the thermal expansion coefficients of the resin layer, inorganic insulating layer, and chip component are α1, α2, and α3.
3. The electronic device as set forth in claim 1 , wherein:
the inorganic insulating layer includes a plurality of first inorganic particles having a particle size not more than 130 nm, and the plurality of first inorganic particles are bonded to each other to form a three-dimensional matrix structure.
4. The electronic device as set forth in claim 3 , wherein there is a resin among the first inorganic particles forming the three-dimensional matrix structure.
5. The electronic device as set forth in claim 3 , wherein the first inorganic particles are bonded to each other with first neck portions therebetween.
6. The electronic device as set forth in claim 3 , wherein:
the inorganic insulating layer further includes a plurality of second inorganic particles having a particle size not less than 160 nm, and
the second inorganic particles are bonded to each other with the three-dimensional matrix structure among them, the three-dimensional matrix structure formed by bonding the plurality of first inorganic particles to each other.
7. The electronic device as set forth in claim 6 , wherein the first inorganic particles and second inorganic particles are made of the same material.
8. The electronic device as set forth in claim 6 , wherein the first inorganic particles and second inorganic particles are bonded to each other with second neck portions therebetween.
9. An electronic device comprisinq:
a chip component having an electronic element;
a wiring board on which the chip component is mounted with a space therebetween for containing the electronic element;
a resin layer provided from a surface of the chip component to a surface of the wiring board so as to surround the space; and
an inorganic insulating layer provided at the resin layer and positioned at a side of the space, wherein the inorganic insulating layer is provided inside the resin layer.
10. The electronic device as set forth in claim 9 , wherein:
the inorganic insulating layer includes a plurality of first inorganic particles having a particle size not more than 130 nm, and
the plurality of first inorganic particles are bonded to each other to form a three-dimensional matrix structure.
11. The electronic device as set forth in claim 10 , wherein there is a resin among the first inorganic particles forming the three-dimensional matrix structure.
12. The electronic device as set forth in claim 10 , wherein the first inorganic particles are bonded to each other with first neck portions therebetween.