Solid-state image pickup device
A solid-state image pickup device capable of suppressing the generation of dark current and/or leakage current is provided. The solid-state image pickup device has a first substrate provided with a photoelectric converter on its primary face, a first wiring structure having a first bonding portion which contains a conductive material, a second substrate provided with a part of a peripheral circuit on its primary face, and a second wiring structure having a second bonding portion which contains a conductive material. In addition, the first bonding portion and the second bonding portion are bonded so that the first substrate, the first wiring structure, the second wiring structure, and the second substrate are disposed in this order. Furthermore, the conductive material of the first bonding portion and the conductive material of the second bonding portion are surrounded with diffusion preventing films.
1. A solid-state image pickup device comprising:
a first substrate provided with a photoelectric converter disposed on its primary face;
a first wiring structure which is disposed on the primary face of the first substrate and which has a first bonding portion containing a conductive material;
a second substrate provided with, on its primary face, a part of a peripheral circuit including a control circuit and a readout circuit reading out a signal based on a charge of the photoelectric converter; and
a second wiring structure which is disposed on the primary face of the second substrate and which has a second bonding portion containing a conductive material,
wherein the first bonding portion and the second bonding portion are bonded so that the first substrate, the first wiring structure, the second wiring structure, and the second substrate are disposed in this order, and
the conductive material of the first bonding portion and the conductive material of the second bonding portion are surrounded with diffusion preventing films,
wherein the diffusion preventing films include at least one of
a first diffusion preventing film which forms an upper face of the first wiring structure together with the first bonding portion, and
a second diffusion preventing film which forms an upper face of the second wiring structure together with the second bonding portion.
2. The solid-state image pickup device according to claim 1 , wherein
the diffusion preventing films include the first diffusion preventing film, and the first diffusion preventing film surrounds the first bonding portion, and/or
the diffusion preventing films include the second diffusion preventing film, and the second diffusion preventing film surrounds the second bonding portion.
3. The solid-state image pickup device according to claim 1 , wherein at least one of the first diffusion preventing film and the second diffusion preventing film is a silicon nitride film, a silicon oxynitride film, a silicon carbonitride film, or a silicon carbide film.